Shenmao Rolls Out PF606-P275 Lead-Free Solder Paste
Shenmao's PF606-P275 lead-free, no-clean, zero- halogen solder paste is designed for fine-pitch applications, including SMT processes and portable devices such as smartphones.
Is said to offer exceptional void performance enabled by an activator system that ensures reliability with CSPs, QFNs and large ground pad components. Complies with RoHS, RoHS 2.0, and REACH standards, and features a unique flux formulation that enhances solderability and wettability to deliver strong, stable solder joints under challenging conditions. Features a flux design that actively prevents solder powder oxidation during reflow, reducing issues such as Head-in- Pillow (HIP) and ensuring consistent solder ball performance. Also features a hot slump performance that mitigates the effects of component warpage, preventing HIP issues in BGA and CSP applications.
Shenmao
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