ECD’s M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler.

Is suitable for use in both batch and in-line vapor phase reflow soldering equipment, with or without vacuum. Is compatible with the high-temperature environment (up to 260°C) of condensation reflow, is impervious to vapor and moisture and resistant to damage or deformation during vacuum stages. Features an operator-friendly design and is compatible with other electronics assembly processes, including traditional wave and convection reflow soldering, PCB cleaning, and formic acid no flux reflow.

ECD

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