Parmi USA's Xceed II AOI system features an enhanced platform designed to improve inspection speed and quality.

Incorporates TRSC-II sensor to deliver superior 2-D/3-D data quality and offer five different resolution settings, from high precision (4µm, 6µm, 7µm) for detailed inspection to high-speed settings (10µm, 14µm) for faster throughput. Is optimized for die inspection, including System in Package (SiP), bare die, IPD, die attach, underfill fillet and Cu Clip on die. Enhances 2-D die inspection through advanced coaxial lighting, enabling more types of defect detection on the die’s top surface, including text, polarity, cracks, contamination, chipping and epoxy issues.

Parmi USA

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