The May 20 event takes place at the Center for Innovative Technology in Herndon, VA.
Nominations are being accepted through April 17 for the term that begins at SMTAI, Oct. 4-8 in San Diego.
Candidates must be SMTA members who have demonstrated commitment to the association.
To nominate a board member, visit http://www.smta.org/nominations/nominations.cfm, or contact JoAnn Stromberg at joann@smta.org.
The SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies and related business operations.
ITASCA, IL – Kester recently completed an expansion project at its Itasca headquarters to dedicate more floor space to solder paste and tacky soldering flux products.
Floor space was increased more than 3,000 sq. ft., the company said.
The project was centered on improving environmental control for these products, and to improve product quality, says the firm.
EL SEGUNDO, CA — Pricing for commodity electronics components is falling at a moderate rate, but the pace of erosion reflects the fact that pricing has already hit rock bottom in many commodity categories, according to iSuppli Corp.
SINGAPORE – Singapore's exports to the US fell 44.4% year-over-year in February, pulling the nation's shipments down 24%.
Weak demand for electronics was among the reasons cited for the drop. Electronics exports dropped 31.9% to S$3.5 billion.
Shipments to the country's 10 top trading partners were down, except China. Sales to US customers dropped to US$673 million, but the percentage drop actually climbed slightly from a 50% plunge in January. Shipments to the European Union fell 36.7%, and sales to Japan dropped 38.9%.
The company said the cuts will come in its device and media segments, plus corporate development and global support.
Cellphone sales were down 5% to 315 million cellphones in the fourth quarter, Gartner reported, and grew 2% sequentially despite the holiday buying season.TEDDINGTON, UK – National Physical Laboratory scientists are researching what use of Pb-free solder alloys could mean for tin pest and tin whiskers.
NPL has been studying the allotropic phase transformation in tin and its alloys, commonly known as tin pest, to measure the implications of adopting Pb-free solder manufacturing practices.The firm has received funding from the Department for Business, Enterprise & Regulatory Reform. It seeks industry support for the work on the order of £5,200 per company for the 14-month project.
Also, NPL has developed a measurement system and test method
to assess the ability of different conformal coatings to stop or slow down tin
whisker growth. The method can help conformal coating suppliers modify coatings
to inhibit whisker initiation, growth and penetration for electronics.