JASPER, IN -- A 15% jump in Kimball's EMS sales helped boost the company to a 6% overall hike in revenue for the quarter ended Sept. 30.
WASHINGTON -- A pair of major US business groups have filed a lawsuit asking the US Court of Appeals for the District of Columbia Circuit to modify or set aside in whole or in part the Securities and Exchange Commission’s regulations requiring companies to publicly disclose their use of conflict minerals that originate in the Democratic Republic of the Congo or an adjoining country.
BANNOCKBURN, IL – The B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies, has been released.
BANNOCKBURN, IL – North American printed circuit board shipments in September were down 6.7%, and orders decreased 3.3% compared to September 2011, says IPC.
INDIANAPOLIS – Specialty Coating Systems next week will host a free webinar on conformal coatings for medical devices.
SIEVI, FINLAND -- Scanfil reported third quarter net income of EUR 1.7 million on sales of EUR 48.2 million ($62.5 million).
SPOKANE VALLEY, WA -- Electronics manufacturing services provider Key Tronic today reported net income more than tripled to $3.7 million for its fiscal first quarter 2013.
WASHINGTON – The American Public Health Association today called on the global electronics’ industry, public health officials and international agencies to step up efforts to protect workers and communities, citing well documented adverse health effects caused by many toxic chemicals used in the manufacture of electronic and electrical products worldwide.
SAN JOSE, CA – Sanmina-SCI reported revenue of $1.58 billion for the fiscal fourth quarter ended Sept. 29, down 7.1% year-over-year and up 1.9% sequentially. GAAP net income was $164.2 million, up 807% year-over-year.
LYON, FRANCE – Demand for so-called "mid-end" tools and related materials for wafer-level packaging is surging, thanks to the growth of 3D IC and wafer-level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer bumping.
ORLANDO – The DMSMS & Standardization Conference will take place here Nov. 26-29. It will include panels, briefings and training on the counterfeiting issue.