BANNOCKBURN, IL – IPC has released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the design, assembly, inspection, repair, and reliability issues associated with bottom termination components whose external connections consist of metalized terminals that are an integral part of the component body.

NEVADA CITY, CA – A new report offers an in-depth look at the worldwide integrated circuit packaging market.

The Worldwide IC Packaging Market, 2011 Edition, provides individual IC device market forecasts for units, revenue and ASP, from 2008 through 2014. It was authored by New Venture Research.

The package solutions for each of these markets are forecast, broken down into I/O ranges. Package types are rolled up to deliver an overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions. 

Major package families include dual in-line package; small outline transistor; small outline; thin small outline package; dual flat pack no lead; chip carrier; quad flat pack; quad flat pack no lead; pin grid array; ball grid array; fine-pitched ball grid array, and wafer-level package.

Also, unit forecasts for die mounted using direct chip attach methods were developed. DCA methods include chip on board, flip chip on board, chip on glass, flip chip on glass, and tape automated bonding/tape carrier package.

The contract IC packaging market is forecast, and units and revenue are analyzed by package family. Profiles of individual contract IC package assemblers are also provided. 

FRAMINGHAM, MA – The worldwide mobile phone market grew 19.8% year-over-year in the first quarter of 2011, says the International Data Corp.

KEMPELE, FINLAND -- PKC Group will close on its previously announced acquisition of wiring harnesses manufacturer Segu on April 30.

VELDHOVEN, the NETHERLANDS -- Assembléon today announced Tonn van de Laar will replace Andre Papoular as chief executive.

ANGLETON, TX – Benchmark Electronics announced sales of $538 million for the quarter ended Mar. 31, down 6% year-over-year, on weaker demand and inventory adjustments.

The contract electronics manufacturer reported first-quarter net income of $15 million, a drop of nearly 17% compared to the same period last year. 

Computing was down 29% sequentially, medical was off 26% due to inventory adjustments and supply disruptions from Japan, and telecom dropped 8%.  Computing slowed on lower demand, but is expected to rebound as a new program ramps in the current quarter. Gross margins fell 70 basis points to 7.1%.

The company said demand is picking up as the year progresses. “During the quarter, we saw weaker than expected demand primarily due to customer inventory adjustments following strong fourth-quarter demand,” said CEO Cary Fu. “We expect sales in the second quarter to rebound, as our customers achieve balancing of inventory levels to match demand.”

Sales for the second quarter are expected to range from $560 million to $600 million.

SON, THE NETHERLANDS – Electronics manufacturing services firm Neways Electronics International reported first-quarter 2011 revenue of EUR 72.3 million, up 29% year-over-year.

Net profit increased sequentially, and orders grew 4% to EUR 75.3 million compared to year-end 2010.

EMS market activity showed growth across the board. However, continued increased market demand means several suppliers are as yet unable to fully meet their delivery obligations, the firm says. Neways expects events in Japan to have an effect in the coming months. 

The planned acquisition of the electronic development activities of consultancy and engineering firm DHV was announced early April. Fifty-four DHV engineers will transfer to Neways. Annual revenue from the acquisition is expected to be around EUR 4 million.

Full-year 2011 revenue and profit are expected to exceed those of 2010 by a “considerable measure.” 

TEDDINGTON, UK – NPL’s electronic interconnection group will present eight free one-hour technical webinars over the coming months.

The webinars focus on test methods used to monitor or help evaluate possible failure modes in electronic assemblies. 

The webinar schedule is as follows: Tin Whiskers Evaluation Techniques & Benefits of Conformal Coating, June 22; X-Ray Fluorescence Testing Results with Laboratory & Handheld Systems, Sept. 8; Solderability Assessment – Testing, Aging & Practical Impact on Assembly Yield, Oct. 11; How to Test & Qualify Packages with Scanning Acoustic Microscopy (SAM), Oct. 27; Using Surface Insulation Resistance (SIR) to Qualify Production Processes & Materials, Nov. 8; Cleanliness Assessment Using Solvent Extract & Ionic Extraction to Improve Reliability, Nov. 24; Characterization of Solder Joints, Test Methods & Typical Failure Modes, Jan. 24; Using Mechanical Testing to Diagnose Design, Product & Process Failures, Feb. 21. 

To register, visit http://www.npl.co.uk/ei.   

The group will also host a European technical seminar at its facility in Teddington, UK, on Oct. 29.

TAIPEI -- Foxconn Electronics (Hon Hai) reported fourth-quarter consolidated net profits of NT$21.5 billion ($750.7 million) on revenues of NT$952.1 billion ($33.2 billion).

BILLINGSTAD, NORWAY -- Top 50 EMS firm Kitron reported first-quarter sales of NOK 429.8 million ($81.5 million), up 4.5% over last year.

SAN JOSE – Flextronics today reported fourth-quarter net sales of $6.9 billion, up 15% year-over-year.

BANNOCKBURN, IL – IPC said North American printed circuit board shipments were up 5.4% year-over-year in March. Orders decreased 9.9% compared to the same month in 2010.

Year to date, circuit board shipments were up 6.9%, while orders were down 7.1%. Sequentially, shipments increased 14.9%, and orders were up 21.9%.

The book-to-bill ratio in March held steady at 0.95. A ratio of more than 1.0 suggests current demand is ahead of supply, which is a positive indicator for sales growth over the next two to three months.

Rigid circuit board shipments were up 5.1%, while orders decreased 10.1% year-over-year.

Year to date, rigid board shipments were up 6.7%, and orders declined 8.5%. Sequentially, shipments increased 14.9%, and orders increased 26%.

The March rigid book-to-bill ratio remained at 0.94.

Flex circuit board shipments for the month were up 9.1%, and orders declined 7.4% compared to March 2010.

Year to date, flex shipments increased 9.3%, while orders were up 9.6%. Sequentially, flex shipments increased 15%, and orders fell 13.2%.

The flex book-to-bill moderated to 1.04.

“North American PCB sales in March were strong, following normal seasonal patterns, and sales of both rigid PCBs and flexible circuits are still ahead of last year,” said IPC president and CEO Denny McGuirk. “Stronger sales than orders is the dynamic keeping the book-to-bill ratio holding slightly below parity, which indicates slowing growth over the next quarter.”

Rigid PCBs represent an estimated 89% of the current industry in North America, says IPC. In March, 83% of total shipments reported were domestically produced. Domestic production accounted for 83% of rigid PCB and 85% of flexible circuit shipments.