SAN JOSE – The MicroElectronics Packaging and Test Engineering Council (MEPTEC) released the program for its Nov. 13 symposium “Packaging Developments and Innovations:  From System Design to Integrated Delivery” in San Jose.
 
Glenn Daves, director of packaging technology at Freescale Semiconductors will keynote, discussing aligning packaging developments with the market.
 
Sessions include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovation, and design tools and co-design solutions.
 
To register, visit www.meptec.org.
 

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