SAN DIEGO – Brian O’Leary of KIC will host three free webinars on reflow processing throughout 2009.

 O’Leary, a published author and KIC’s Americas sales manager, will cover: 

• Reduce/Eliminate Product Changeover for the Reflow Process will be held May 15 and will discuss how to consolidate multiple profiles under one or more oven recipes. For more information, visit https://kicthermal.webex.com/kicthermal/j.php?ED=107946612&UID=85294172.

 

• How to Profile BGAs will take place June 26, and will highlight ways of successfully profiling BGAs, including thermocouple attachment. Also discussed will be methods of BGA inspection, using profiling as a tool for robust inspection. For more information, visit https://kicthermal.webex.com/kicthermal/j.php?ED=107946417&UID=85293982.

 

• The How to Use Less Energy in Reflow While Maintaining Throughput and an In-Spec Process will take place Sept. 25, and will reveal results of several studies and methodology about how to turn down the thermostat and save money. For more information, visit https://kicthermal.webex.com/kicthermal/j.php?ED=107946437&UID=0.

 

Each webinar will last 30 min.

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