ST. PAUL, MN – SUSS MicroTec will distribute 3M’s wafer support system equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging.

SUSS will manufacture and sell XBC300 and CBC300 wafer bonders configured to use 3Ms WSS materials, including 3M liquid UV-curable adhesive and light-to-heat conversion coating.

3M supplies materials for the semiconductor industry.

SUSS MicroTec supplies semiconductor processing equipment.

• Prev
• Next