WEST CONSHOHOCKEN, PA - Heraeus Materials Technology and Air-Vac Engineering have joined forces to develop solder paste for area array rework.

Development is currently underway at Heraeus’ Pennsylvania R&D center using Air-Vac’s ONYX-29 rework system.

The firms plan to optimize current dippable paste formulations specifically for the rework process. The new product is scheduled for beta testing later this year.

Air-Vac provides electronics rework equipment and processes.

Heraeus provides dippable solder pastes optimized for rework of BGAs and other area array devices.

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