SAN JOSE -- Advanced IC packaging technologies such as wafer-level packages, stacked packages and system-in-package have moved into the mainstream of IC production, reports Electronic Trend Publications.

Although these technologies experienced a setback during the current industry downturn, they will experience high growth rates in the coming months and years, the research firm says.

Recent research by the research firm on advanced IC packaging technologies found:

• Wafer-level packages will grow from 7 billion units in 2008 to nearly 18 billion units in 2013.
• Stacked packages will grow from 2.7 billion units in 2008 to nearly 5 billion units in 2013.
• System in package will grow from 1.7 billion units in 2008 to 2.4 billion units in 2013.

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