The latest revision changes hole-fill criteria for Class 1 and 2 end-product, adds SMT termination criteria for flattened post/nail-heads, expands criteria for area arrays (noncollapsible balls and column grid array), staking and adhesive criteria for bonding of through-hole and SMT components, and consolidates thermal management criteria and lead placement and soldering criteria for each terminal type.

Extensive changes were made to the document's organization to improve ease of use and clarity, IPC said.

In a press release, task group chairman Teresa Rowe said J-STD-001E marks a major step forward for product developers and manufacturers. “At the end of the day, achieving an acceptable soldered connection is a very important process journey. This standard provides a map to that journey which begins and ends with customer satisfaction,” she said.

The new standard took 4 and a half years and more than 3,500 meeting hours, IPC said.  

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