ESSEX, ENGLAND – PCB solder finishes are one of the most common causes of soldering defects and rejection of PCBs during assembly, according to recent surveys, says Bob Willis.

Design and process engineers highlighted solder finishes 35%, with delamination at 25%; third place were cosmetic faults.

As part of the NPL Defect Database, one survey showed that currently open joint failure is the most common issue. PCB solder finish was seen as the second biggest issue.

A free poster guide covers different pad finish examples at different magnifications, two solderability testing methods, and many of the common process problems associated with PCB surface finishes.

The guide is available at www.bobwillisonline.com/posters.

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