NEVADA CITY, CA – In a recent New Venture Research report, the following areas of advanced IC packaging are discussed, including forecasts of units, pricing, and revenue: stacked IC packaging; through silicon vias; system in package; wafer level packages, including fan-out WLPs; staggered inner-row QFNs, and interconnection, including flip chip.

Advanced IC Packaging Technologies and Markets finds that stacked packages will grow from 2.6 billion in 2009 to 5.5 billion in 2014; SiPs will grow from 1.4 billion last year to nearly 3 billion in 2014; WLPs will grow from 6.8 billion in 2009 to 16.8 billion in 2014; fan out WLPs will expand from 2.9% of that last year to 6%; QFNs will grow from 10 billion to 22 billion in that time period, and staggered inner-row QFNs will expand from less than 1% to 6%.

Through silicon vias, while still a ways off in terms of implementation, have promise in a number of markets, including DRAMs, MPUs, PLDs, special purpose logic communications chips, CMOS image sensors, and graphics chips, says the firm. Flash is another potential market for this technology. TSVs and the market size potential are discussed in the report.

For more information, visit www.newventureresearch.com.

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