CEDAR RAPIDS, IA -- Did avoiding the voids just get less important? A multi-company investigation into BGA voids suggests as much.

The new study by Rockwell Collins, RIM, Indium and Dage shows voids are not a “primary” issue to BGA solder joint integrity.

New BGA voiding requirements will be proposed to J-STD-001 task group based on study’s findings, Rockwell engineer Dave Hillman says. Hillman says the group plans to present the findings in Fall 2011.

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