SAN DIEGO – AEM has developed a high-reliability-qualified SnPb conversion process designed to mitigate the formation of tin whiskers in surface mount components.

The process reportedly eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dipping, while ensuring converted component terminations contain a minimum of 5% Pb, as verified by SEM/EDS and XRF inspection methods.

This Sn/Pb conversion process is suited for chip-scale passive components, including capacitors, inductors, resistors, ferrite chip beads, fuses, resistor arrays, capacitor arrays, bead arrays and many molded body passive and active surface mount component types.

The firm says it includes 100% adherence to visual and mechanical inspections per applicable EIA guidelines, including sample solderability, leach resistance, terminal strength and destructive physical analysis screening.

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