AUSTIN – A new TechSearch International survey reveals market growth and the latest developments for fan-out wafer level packages.

FO-WLPs are a package option for devices with a large number of I/Os that cannot be accommodated by a fan-in design.

While some companies plan to go to finer pitch (0.3mm or 0.35mm) to continue the use of conventional fan-in technology, others are planning to use fan-out methods, says TechSearch.  According to Tim Olson, president and CEO of Deca Technologies, “The promise of fan-out to eliminate the cost, inflexibility, and cycle time delays of tooling substrates is tremendous. The industry just needs to overcome the capital disadvantages and a few engineering challenges. We are close to a tipping point.”

The use of a fan-out solution provides the same low-profile advantage as the conventional WLP, says the research firm. In the fan-out process, singulated die are placed into a “reconstituted wafer” with enough space around each chip to accommodate second-level connections.

FO-WLPs are offered (or are under development) in many companies, including ADL Engineering, Amkor, ASE, Deca Technologies, Freescale Semiconductor, Fujikura, Intel, King Dragon International, NANIUM, Nepes, Renesas Electronics, SPIL, STATS ChipPAC, and Teramikros. 

The report examines assembly price trends. Supply chain disruptions from Japan’s March 11 earthquake and tsunami have been mitigated, but traditional price declines for many substrates did not take place in 2011, says TechSearch. In some cases, prices increased. Metal prices continue to have a major impact on the cost of semiconductor packaging and assembly. With gold prices remaining at near record levels, many companies continue to move to copper wire bonding to reduce cost. Companies continue to look for material saving measures, and Amkor has announced its pin gate molding process for PBGA to aid in cost reduction. The report describes Xilinx’s 2.5D packaging solution with through silicon vias in the silicon interposer.

The report includes an economic update for the semiconductor packaging industry and an analysis of the impact of the flooding in Thailand on the electronics industry. Plants that produce disk drives and subassembly suppliers to this sector were flooded, and equipment will need to be replaced.  In addition, some IC assembly facilities, automotive plants, and related suppliers also suffered flood damage. 

For more information, visit www.techsearchinc.com.

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