BANNOCKBURN, IL – IPC has announced the winners of the Best US and International Papers of IPC Apex Expo 2012.

Taking top honors in the International category, the winning paper is “Lead-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs,” by Ramon Mendez, DFM/process development engineer, Celestica, Monterrey, Mexico. His coauthors are Ismael Marin and Helen Lowe, also from Celestica.

“Investigation of Pad Cratering in Large Flip-Chip BGA Using Acoustic Emission,” by Anurag Bansal, Ph.D., reliability engineer, Cisco Systems, San Jose, CA, was selected as the best paper in the US category. Dr. Bansal’s coauthors, also with Cisco Systems, are Cherif Guirguis and Kuo-Chuan Liu.

The committee also awarded three honorable mentions in the International category and one in the US category. Those papers are “Elemental Compositions of Over Two Dozen Cell Phones,” by Beverley Christian, Ph.D., Research in Motion Ltd., Ontario, Canada; “A Plasma Deposited Surface Finish for Printed Circuit Boards,” by Tim Von Werne, Ph.D., Semblant Limited, Cambridgeshire, UK; “Warpage Issues and Assembly Challenges Using Coreless Packaging Substrate,” by Jinho Kim, Samsung Electro-Mechanics Co. Ltd., Suwon Gyunggi-Do, South Korea; and “PCB Trace Impedance Impact of Localized PCB Copper Density,” by Gary Brist, Intel Corp., Hillsboro, OR.

Selected through a ballot process by the event’s technical program committee, the papers will be presented Feb. 28 – Mar. 1 at the San Diego Convention Center.          

More than 100 papers were submitted for consideration. Papers were evaluated on technical content, originality, test procedures, and data used to deduce conclusions, quality of illustrations, and the clarity and professionalism of writing.

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