LAKE FOREST, CA – Integral Technology said it has received a patent for a copper-clad laminate designed to eliminate pad cratering in circuit board assemblies.

The invention describes a high Tg C-stage glass-free insulating layer for rigid printed circuit boards. In use, it acts as a shock absorber to prevent fractures.

Integral Technology markets the product under the name Zeta Cap.
 
The inventor is Christopher Hunrath and the patent number is 8,188,373.

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