BANNOCKBURN, IL – IPC presented Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC Midwest this week.

Barry Ritchie, Dow Corning, and Gordon Sullivan, Royal Adhesives & Sealants, were honored with Committee Leadership Awards for the 5-33f Potting and Encapsulation Task Group that developed IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.

Brian Madsen, Continental Automotive Systems; Carlos Montemayor, Dow Corning; Douglas Pauls, Rockwell Collins; James Stockhausen, Elantas PDG, and John Waryold, HumiSeal, earned Special Recognition Awards for contributions to IPC-HDBK-850.

Stephen Craig, Shin-Etsu Silicones of America; David Edwards, Henkel Corp.; Nate Grinvalds, Rockwell Collins; Amy Hagnauer, Raytheon Company; Jason Keeping, Celestica; Richard Kraszewski, Plexus; Jeff Labodda, Epic Resins; Debora Obitz, Trace Laboratories – Baltimore; Arthur Perkowski, Electronic Coating Technologies; Bill Vuono, Raytheon Company, and Jonathon Zarnstorff, Epic Resins, earned Distinguished Committee Service Awards for contributions to the handbook.

For contributions to the development of IPC-AJ-820A, Assembly and Joining Handbook, Special Recognition Awards went to Beverley Christian, Research In Motion; and David Hillman and Douglas Pauls, Rockwell Collins.

For their contributions to IPC-AJ-820A, Jennifer Day, US Army Aviation & Missile Command; Daniel Foster, Missile Defense Agency; Mahendra Gandhi, Northrop Grumman; Andrew Ganster, NSWC Crane; Constantino Gonzalez, ACME Training & Consulting; Greg Hurst, BAE Systems; Graham Naisbitt, Gen3 Systems; Mel Parrish, STI Electronics; Joseph Sherfick, NSWC Crane; Zenaida Valianu, Celestica, and Linda Woody, Lockheed Martin, earned Distinguished Committee Service Awards.

Karen McConnell, Northrop Grumman, received a Committee Leadership Award for leadership of the 2-16 Product Data Description (Laminar View) Subcommittee that developed IPC-2581A, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology.

Edward Acheson, Cadence Design Systems; John Ambrose, Sanmina-SCI; Kjell Asp, Ericsson AB; Gary Carter, Fujitsu Network Communications; Joe Clark, DownStream Technologies; Bill Newhard, DownStream Technologies; Hemant Shah, Cadence Design Systems, and Chris Shaw, Fujitsu Network Communications received Distinguished Committee Service Awards for contributions to the development of IPC-2581A.

Daniel Gamota, Printovate Technologies, earned a Special Recognition Award for guiding the D-60 Printed Electronics Committee and four printed electronics subcommittees during the formative months of IPC’s printed electronics efforts.

For leadership of the 5-23b Component and Wire Solderability Specification Task Group that developed J-STD-002D, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Dennis Fritz, MacDermid, and David Hillman, Rockwell Collins, earned Committee Leadership Awards.

For contributions to J-STD-002D, Bev Christian, RIM; David Corbett, Defense Supply Center Columbus; Chris Mahanna, Robisan Laboratory; Graham Naisbitt, Gen3 Systems; Gerard O’Brien, Solderability Testing & Solutions; Michael Paddack, Boeing, and George Wenger, Andrew Corp., received Special Recognition Awards.

Distinguished Committee Service Awards went to Donald Abbott, Sensata Technologies; David Adams, Rockwell Collins; Greg Alexander, Ascentech; Martin Bayes, Dow Electronic Materials; Christine Blair, STMicroelectronics; Gerald Leslie Bogert, Bechtel Plant Machinery; Calette Chamness, US Army Aviation & Missile Command; Theodore Edwards, Dynaco Corp.; Mahendra Gandhi, Northrop Grumman; Reza Ghaffarian, Jet Propulsion Laboratory; Christopher Hunt, National Physical Laboratory; Vijay Kumar, Lockheed Martin; Leo Lambert, EPTAC; Todd MacFadden, Bose; Renee Michalkiewicz, Trace Laboratories – Baltimore; John Rohlfing, Delphi Electronics and Safety; Douglas Romm, Texas Instruments; William Russell, Raytheon; John Thompson, FCI USA, and Linda Woody, Lockheed Martin, for contributions to J-STD-002D.

For co-chairmanship of the 4-14 Plating Processes Subcommittee that developed Amendment 1 to IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, George Milad, Uyemura, and Gerard O’Brien, Solderability Testing & Solutions, earned Committee Leadership Awards.

For IPC-4552, Amendment 1, Jon Pereira, DDi Toronto, received a Special Recognition Award. Martin Bayes, Dow Electronic Materials; Trevor Bowers, Adtran; Patricia Dupuis, Raytheon Company; Philip Henault, Raytheon; Brian Madsen, Continental Automotive Systems, and James Monarchio, TTM Technologies, also earned Distinguished Committee Service Awards for IPC-4552, Amendment 1.

For contributions as technical content advisor on two IPC DVD training programs, Component Color Codes and Component Number Codes, Sheryl Payne, Controltek, earned a Special Recognition Award.

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