LAS VEGAS – The Electronic Components and Technology Conference (ECTC) is requesting 250- to 750-word abstracts and/or professional development course proposals for its 63rd conference here.

ECTC addresses new developments, trends, and applications for 3D integration, TSV, WLP, flip chip, materials, and other integrated systems packaging topics.

Abstracts and proposals are requested electronically at www.ectc.net by Oct. 8.

ECTC is accepting previously unpublished, non-confidential and non-commercial content related to advanced packaging, applied reliability, assembly and manufacturing technology, electronic components and RF, emerging technologies, interconnections, materials and processing, modeling and simulation,  and optoelectronics.

Final manuscripts are due for publication no later than Feb. 25.

All accepted papers will be presented during oral, interactive presentations or student poster sessions.

For more information, contact Beth Keser at beth@qualcomm.com.

Selected instructors will teach four-hour education courses. To be considered, include course objective, outline and a description of who should attend as part of a 200-word proposal.

For more information, contact Kitty Pearsall at kittyp@us.ibm.com.

Selected authors and instructors will be notified by Dec. 15. Visit www.ectc.net for more details.

ECTC will take place May 28 – 31 at The Cosmopolitan of Las Vegas.

• Prev
• Next