MAASTRICHT, THE NETHERLANDS – Nordson Asymtek has opened registration for its 2013 Technology Days, taking place here next month.

The mini-conference will focus on how developments in fluid dispensing, jetting, and conformal coating can improve the way companies bring their products to market.

Conference sessions include developments in jetting, solder paste, and micro-coating; two-component dispensing in micro-electronics; UV-curing mechanism and process; reduction of VOC emissions and substitutes to toxic conformal coatings; thermal considerations in conformal coating; applications in MEMS devices; underfill and board protection requirements in automotive applications; IPC norms in conformal coating; low viscosity UV-coatings; applications with thermal gap fillers; 3D interconnects; the effects of PCB cleaning; jetting of encapsulation fluids, rheology, and results in jetting; easy clean display coatings; developments in x-ray inspection systems; plasma applications in electronics, influences on adhesion and bonding strength, and wafer cleaning and etching.

The event will be held in Maastricht June 12 and 13.

The full agenda and registration form are available at http://www.nordsonasymtek.com/TechDays2013.

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