ROLLING MEADOWS, IL – BEST is hosting a half-day advanced PCB x-ray inspection seminar Apr. 3 here.

Bob Klenke of ITM Consulting, Ken Gribble of Nikon and Norman Mier of BEST will demonstrate this inspection technique for advanced electronics packages.

Presentation topics include Advanced Package X-ray Inspection, BGA and X-Ray Rework Inspection, and Small Spot Size X-ray Inspection of POPs, BGAs and Leadless Devices.

The sessions will feature hands-on how-to sessions, as well as theoretical sessions.

To register, contact Laura Ripoli at  (847) 797-9250 or lripoli@solder.net. 

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