BANNOCKBURN, IL – The best technical conference paper of IPC Apex Expo 2015 goes to Karl Sauter, Oracle Corp. USA, and co-author Joseph Smetana, Alcatel-Lucent, for “High Frequency Loss Test Methods for Laminate Materials Comparison (a High Density Packaging User Group/HDPUG Project).” The paper will be presented Feb. 26.

An honorable mention went to “Electroplated Copper Filling of Through Holes on Varying Substrate Thickness,” by Jim Watkowski, MacDermid. His co-authors included Kesheng Feng, Bill DeCesare, Mike Yu and Don DeSalvo.

A second honorable mention was presented to “Acceptance Testing of Low-Ag Reflow Solder Alloys,” by Kris Troxel, Hewlett-Packard. Her co-authors were Aileen Allen, Elizabeth Elias Benedetto and Rahul Joshi.

Papers are voted on through a ballot process by members of IPC’s Technical Program Committee. Authors will receive their awards during the opening keynote session on Feb. 24.

The papers were evaluated on technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations, and clarity and professionalism of writing.

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