BANNOCKBURN, IL – IPC has released IPC-6012D, “Qualification and Performance Specification for Rigid Printed Boards,” a multi-year effort to update the industry standard for bare board acceptance.

IPC said there are changes to almost “every page” in the new revision, including updated requirements for dielectric removal, HASL solder pots, printed board edges, markings and solder mask coverage. The most anticipated addition is for new microvia requirements for both the capture and target lands. Annular ring, plating to target land separation, target land penetration and voiding in plated and copper filled structures are just some of the examples where the revision addresses microvia structures.

The release coincides with the release of IPC-6012DS, “Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards,” which provides supplemental requirements for space and military avionics product.

This revision caps a five-year effort to update the core specifications in the IPC-6010 performance series, including IPC-6013C for flexible printed boards (published in December 2013) and IPC-6018B (published in November 2011) for high-frequency (microwave) printed boards, with updated acceptance criteria for HDI/microvia structures. The release of IPC-6012D marks the final stage of this effort. Moving forward, IPC will retire the outdated IPC-6016 specification for HDI/microvia structures that was published in 1999.

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