LAS VEGAS – CIRCUITS ASSEMBLY announced the winners of the 2016 New Product Introduction Awards for electronics assembly equipment, materials, and software.

The 9th annual NPI Awards recognizes leading new products during the past 12 months. An independent panel of practicing industry engineers selected the recipients.

The winners are:

Automation Tools: ASM Assembly Systems (Siplace Bulkfeeder X)
Bonders: Palomar Technologies (3880 Die Bonder)
Coatings/Encapsulants: Aculon (NanoProof PCB Repellency)
Cleaning Equipment: Seika Machinery (Unitech UC-250M-CV PCB Board Cleaner)
Cleaning Materials: Kyzen (Aquanox A8820)
Component Placement – High Speed: Fuji America (LCR Unit)
Component Placement – Multifunction: Kurtz Ersa (Ersa Roboplace)
Component Storage: Inovaxe (InoAuto Smart Cart)
Device Programming: Data I/O (LumenX)
Dispensing Equipment: Techcon Systems (TS5624 Disposable Diaphragm Valve)
Process Control Tools: Seika Machinery (RCX Series Modular Reflow Oven Profiling System)
Rework & Repair Tools: BEST Inc. (HeatShieldGel)
Screen/Stencil Printing Equipment: Speedline Technologies (MPM Edison)
Screen/Stencil Printing Peripherals/Consumables: Datum Alloys (Datum Tension Stainless Steel Foil)
Software – Management: Europlacer Americas (CircuitCAM Express Offline Programming Software)
Software – Process Control: Kurtz Ersa (Imagesoft)
Software – Production: Cogiscan (Factory Intelligence)
Soldering Materials: Henkel Electronic Materials (Loctite GC 3W)
Soldering – Reflow: Kurtz Ersa (Hotflow 3/20 Voidless)
Soldering – Other: ACE Production Technologies (LTS300-JEDEC Molten Solder Lead Tinning System)
Soldering – Selective: Kurtz Ersa (Versaflow 455)
Test & Inspection – AOI: MIRTEC (MV-6 Omni 3D In-Line AOI)    
Test & Inspection – AXI: Scienscope International (AXI5100c)
Training Materials: STI Electronics (IPC-A-600 PCB Process Sequence Kit)
Underfill/Thermal Interface Materials: Henkel Electronic Materials (Gap Pad EMI 1.0)

The awards were presented during a ceremony at IPC Apex Expo in Las Vegas.

“As usual, the judges found some of the categories very difficult to decide,” said Mike Buetow, editor-in-chief of CIRCUITS ASSEMBLY. “The competition was tremendous, especially in AOI, rework and repair tools, and soldering materials.”

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