HERNDON, VA -- iNEMI announced four new projects ranging from PCB materials for automotive applications to reuse and recycling are open for registration.

Each project sign-up will be preceded by an informational webinar.

PCB/PCBA Material Characterization for Automotive Harsh Environments

Webinar: April 26, 2016 (two sessions)

Project sign-up deadline: May 18

There is currently no coherent view of specifications for automotive electronics for harsh environments. Tier 1 suppliers typically must meet a wide range of OEM-specific standards. As a result, multiple validation cycles are required, which is a challenge for both the material suppliers and users. This project plans to define a suite of test procedures for Tier 1 and material manufacturers that will give a high degree of confidence in meeting OEM requirements. Two webinars are scheduled for April 26 based on location.

Reuse and Recycling Metrics, Phase 2

Webinar: April 28, 11:00am - 12:00pm EDT

Project sign-up deadline: May 19

This project plans to identify design measures to improve material choice on the front end, and material and component liberation at end of life. Efforts will include development of a weighting factor that quantifies the quality of reused and recycled materials, along with a product end-of-life value score that provides a three-tiered scope of material choice, product design and regional recovery factors.

Final Assembly Automation and Optimization

Webinar: May 3, 12:00-1:00pm EDT

Project sign-up deadline: May 24

Automation or semi-automation of final assembly has, to date, carried concerns about cost, lead time and quality. There is a need to develop and understand best practices for automating the final assembly process. This new project plans to investigate the flexibility needed to minimize cost, develop design guidelines for parts and their packaging, and identify best practices for several types of design.

High-Temperature, Pb-free Die-Attach Material

Webinar: Completed

Project sign-up deadline: May 15

There is no single Pb-free drop-in solution for high-temperature die-attach. This is particularly a concern with higher junction temperatures for applications that require high-reliability alloys. This project is being organized to assess the processability and reliability of different Pb-free materials available for power semiconductor die-attach application on leadframe or ceramic substrates. Access webinar resources and sign up for the project.

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