News
EL SEGUNDO, CA – In light of strong growth in the third quarter, China’s semiconductor market appears to be closing in on previous growth forecasts of 15% in 2007, research firm iSuppli Corp. says.
MILWAUKEE, WI – EMS provider MEC named Hani Malek general manager and national sales and marketing manager.
Malek will have operational responsibility for MEC’s (The Milwaukee Electronics Company) Milwaukee-based EMS facility, and sales and marketing responsibility for its EMS facilities in Wisconsin, Oregon and Mexico.
“His EMS-related Lean manufacturing and Six Sigma expertise is an asset in our focus on operational efficiency, and his management style is very aligned with our internal culture of enthusiastic teamwork and respect for all employees,” said P. Michael Stoehr, president and CEO, in a press release.
Malek has 12 years’ experience in EMS operations management and 20 years’ experience in electronics manufacturing-related industries.
Previously, he was vice president and general manager of Preco Electronics in Peoria, IL.
Malek will have operational responsibility for MEC’s (The Milwaukee Electronics Company) Milwaukee-based EMS facility, and sales and marketing responsibility for its EMS facilities in Wisconsin, Oregon and Mexico.
“His EMS-related Lean manufacturing and Six Sigma expertise is an asset in our focus on operational efficiency, and his management style is very aligned with our internal culture of enthusiastic teamwork and respect for all employees,” said P. Michael Stoehr, president and CEO, in a press release.
Malek has 12 years’ experience in EMS operations management and 20 years’ experience in electronics manufacturing-related industries.
Previously, he was vice president and general manager of Preco Electronics in Peoria, IL.
MEC designs and manufactures custom circuit board assemblies for the medical, transportation, military, HVAC and other industries.
SURREY, UK - The weakening dollar has had a significant impact on TT Electronics’ profitability, the company says.
The EMS firm said its U.S. electronics component operations have suffered from reduced domestic demand because of overall market softness, while its EMS business has had a stronger second half and the outlook is good for next year.
TT Electronics says its sensor and systems business is seeing consistent demand from German automotive customers, although pricing pressure is impacting revenue. The manufacturer also expects revenue from climate control systems to decline substantially in 2008 as certain programs come to end-of-life.
The company expects similar results in 2008 as in 2007.
The EMS firm said its U.S. electronics component operations have suffered from reduced domestic demand because of overall market softness, while its EMS business has had a stronger second half and the outlook is good for next year.
TT Electronics says its sensor and systems business is seeing consistent demand from German automotive customers, although pricing pressure is impacting revenue. The manufacturer also expects revenue from climate control systems to decline substantially in 2008 as certain programs come to end-of-life.
The company expects similar results in 2008 as in 2007.
ELK GROVE VILLAGE, IL – EMS provider SigmaTron International reported revenues decreased to $42.8 million for the second quarter 2008, down 4.7% year-over-year. Net income decreased to $693,274, down 2% year-over-year.
For the first half of the year, revenues increased 1% to $82.7 million compared to the same period last year.
Net income was $1.52 million, up 36.4% year-over-year.
For the first half of the year, revenues increased 1% to $82.7 million compared to the same period last year.
Net income was $1.52 million, up 36.4% year-over-year.
“Our results were negatively impacted by a delay in launching several new programs with various customers that will be additive to our existing business with them, as well as slowing sales to some of our customers. At this point we believe several of the new programs will start during the third quarter, with continuing production dependent on our customers sell-through of the new product,” president and CEO Gary R. Fairhead said.
FRANKFURT – Germany's electronics industry is expected to post a 3% rise in sales to 184 billion euros ($270 billion) this year, boosted by strong exports and robust domestic investment, industry association ZVEI says.
However, restructuring in communications technology would mean sales would fall short of the 190 billion euros previously forecast.
However, restructuring in communications technology would mean sales would fall short of the 190 billion euros previously forecast.
Sales are expected to rise by more than 4% in 2008, the association said.
WESTCHESTER, IL – Shareholders of Andrew Corp. have approved the company’s merger agreement with CommScope Inc.
PHOENIX – Suntron Corp. announced its 90% stockholder, SUNN Acquisition Corp., has nearly completed all necessary measures to take the EMS provider private.
Suntron intends to delist its common stock from the Nasdaq SmallCap Market. Suntron has not arranged for listing its common stock on another national securities exchange or for quotation of its common stock in a quotation medium. The announcement was first made Oct. 3.
As previously disclosed, Suntron decided to go private through the short-form merger of SUNN with and into Suntron, pursuant to Section 253 of the Delaware General Corp. Law.
Suntron intends to delist its common stock from the Nasdaq SmallCap Market. Suntron has not arranged for listing its common stock on another national securities exchange or for quotation of its common stock in a quotation medium. The announcement was first made Oct. 3.
As previously disclosed, Suntron decided to go private through the short-form merger of SUNN with and into Suntron, pursuant to Section 253 of the Delaware General Corp. Law.
CARLSBAD, CA – A subsidiary of microelectronics bonding OEM Palomar Technologies will partner with electronics manufacturer Vision Manufacturing to offer bare board and EMS services.
POINTE CLAIRE, QUEBEC -- EMS provider Triton Electronik will acquire Positron Technologies for an undisclosed sum, according to the Canadian Press. The combined company will have sales of more than C$140 million, the report stated.
BANGALORE – The Electronic Industries Association of India called on the government to level the playing field for domestic component makers, saying the field is falling behind thanks to imports and the high cost of local production, say published reports.
SAN JOSE – Tessera Technologies has filed a new complaint requesting the U.S. International Trade Commission investigate the unlawful importation, sale for importation and sale after importation of certain small-format BGA semiconductor packages and products including these packages.
Tessera’s complaint is directed at a variety of products, including certain DRAM memory chips, DRAM memory modules and computer systems incorporating such chips and modules.
Companies named as respondents include A-DATA Technology, Acer, Acer America, Centon Electronics, Elpida Memory, International Products Sourcing Group, Kingston Technology, Nanya Technology, Peripheral Device and Product Systems, Powerchip Semiconductor, ProMOS Technologies, Ramaxel Technology, SMART Modular Technologies, and TwinMOS Technologies.
None of these companies is a Tessera licensee.
The complaint seeks an exclusion order barring the importation, sale for importation or sale after importation of products that Tessera believes infringe its technology and are unlawfully competing with licensees.
The ITC is expected to decide whether to initiate an investigation within 30 days.
Tessera also has filed a concurrent action in the U.S. District Court for the Eastern District of Texas against these same companies.
In both complaints, Tessera seeks remedies for infringement of four U.S. patents. Licensed companies include DRAM manufacturers Samsung, Hynix, Qimonda and Micron.
Tessera’s complaint is directed at a variety of products, including certain DRAM memory chips, DRAM memory modules and computer systems incorporating such chips and modules.
Companies named as respondents include A-DATA Technology, Acer, Acer America, Centon Electronics, Elpida Memory, International Products Sourcing Group, Kingston Technology, Nanya Technology, Peripheral Device and Product Systems, Powerchip Semiconductor, ProMOS Technologies, Ramaxel Technology, SMART Modular Technologies, and TwinMOS Technologies.
None of these companies is a Tessera licensee.
The complaint seeks an exclusion order barring the importation, sale for importation or sale after importation of products that Tessera believes infringe its technology and are unlawfully competing with licensees.
The ITC is expected to decide whether to initiate an investigation within 30 days.
Tessera also has filed a concurrent action in the U.S. District Court for the Eastern District of Texas against these same companies.
In both complaints, Tessera seeks remedies for infringement of four U.S. patents. Licensed companies include DRAM manufacturers Samsung, Hynix, Qimonda and Micron.
PALO ALTO, CA – Software capability and feeder designs represent the key highlights for new surface mount placement machines. In particular, an easy configuration process for the automated assembly line emphasizes the changeover during production and zero-downtime feature. Better robotic controls, user interface, programming, RFID tags, intelligent feeder designs and other add-ons all assist with easy configuration, reports research firm Frost & Sullivan.
The company finds market and product demands have resulted in smaller, lighter PCBs capable of carrying more components. These demands have led to a higher requirement for replacement accuracy and throughput, thereby necessitating continuous improvements in the SMD assembly process, says Frost.
“Leading SMD placement equipment manufacturers are introducing new machines with faster placement rates and higher accuracies,” notes Frost technical insights research analyst Krishnakumar Srinivasan. “This is achieved by the improvement of the vision system, servo system, feeder design, fixating system, optimization software and nozzle design.”
With the introduction of 01005 packaging, manufacturers have to return to the drawing board to provide design support for these components. While placement rate and accuracy at one end continue to be performance marking factors of the process and equipment, the industry has started looking at other aspects of technology like solder material, packaging and conveyor systems as trivial entities that impact the development curve of advanced SMD placement technologies, says the firm.
“Modular designs are becoming more important in the new SMD placement systems,” says Srinivasan. “With the increasing mix of product types and packaging, new machines need to provide higher versatility and robustness in handling these challenges. This has direct impact on the head technology, line-balancing strategies, optimization issues and vision systems.”
The emergence of hybrid placement machines addresses the need to support production environments with high product mix. These machines help maximize throughput while reducing wear and tear caused by changeovers, without causing unnecessary downtime, according to the firm.
The company finds market and product demands have resulted in smaller, lighter PCBs capable of carrying more components. These demands have led to a higher requirement for replacement accuracy and throughput, thereby necessitating continuous improvements in the SMD assembly process, says Frost.
“Leading SMD placement equipment manufacturers are introducing new machines with faster placement rates and higher accuracies,” notes Frost technical insights research analyst Krishnakumar Srinivasan. “This is achieved by the improvement of the vision system, servo system, feeder design, fixating system, optimization software and nozzle design.”
With the introduction of 01005 packaging, manufacturers have to return to the drawing board to provide design support for these components. While placement rate and accuracy at one end continue to be performance marking factors of the process and equipment, the industry has started looking at other aspects of technology like solder material, packaging and conveyor systems as trivial entities that impact the development curve of advanced SMD placement technologies, says the firm.
“Modular designs are becoming more important in the new SMD placement systems,” says Srinivasan. “With the increasing mix of product types and packaging, new machines need to provide higher versatility and robustness in handling these challenges. This has direct impact on the head technology, line-balancing strategies, optimization issues and vision systems.”
The emergence of hybrid placement machines addresses the need to support production environments with high product mix. These machines help maximize throughput while reducing wear and tear caused by changeovers, without causing unnecessary downtime, according to the firm.
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