News
FRAMINGHAM, MA -- Fourth quarter PC sales rose 8.7% year-over-year, with Hewlett-Packard retaining its top spot, according to preliminary market share data from IDC.
For the quarter, HP had a share of 18.1%, well ahead of second-place Dell's 14.7%.
Lenovo (7.3%) was third, followed by Acer (7.1%) and Toshiba (3.7%).
HP's unit sales rose 24% year-over-year, its fastest pace since 2000 and three times the market rate. Dell's shipments fell 9%. Apple's unit growth was 28% -- despite a 10% increase in average selling prices -- giving the company a 2.4% worldwide share.
According to Deutsche Bank analyst Chris Whitmore, "We believe Dell's unit weakness is the result of efforts to improve mix/margins by exiting the low-end market, particularly $300 consumer. We expect this strategy to pressure revenues in the near term but support Dell's profitability over the next few quarters."
In the U.S., Apple's shipments rose 32% and now accounts for 4.7% of the market, up from 4.1% a year ago.
For the quarter, HP had a share of 18.1%, well ahead of second-place Dell's 14.7%.
Lenovo (7.3%) was third, followed by Acer (7.1%) and Toshiba (3.7%).
HP's unit sales rose 24% year-over-year, its fastest pace since 2000 and three times the market rate. Dell's shipments fell 9%. Apple's unit growth was 28% -- despite a 10% increase in average selling prices -- giving the company a 2.4% worldwide share.
According to Deutsche Bank analyst Chris Whitmore, "We believe Dell's unit weakness is the result of efforts to improve mix/margins by exiting the low-end market, particularly $300 consumer. We expect this strategy to pressure revenues in the near term but support Dell's profitability over the next few quarters."
In the U.S., Apple's shipments rose 32% and now accounts for 4.7% of the market, up from 4.1% a year ago.
TOKYO -- The Tokyo Big Sight exhibition center last week was crammed with attendees wanting to see the latest in electronics components, equipment and materials. Really a co-location of six different shows, Nepcon World is geared toward the EMS and OEM customer, and offers myriad suppliers in one place.
Aisles were packed and business was brisk. Unlike some shows, booths tend to be smaller and the focus closer to the customer’s immediate needs. While many manufacturers do roll out their latest technology, others reserve their big splash for the more extravagant exhibitions. The show has grown by almost 20% in exhibit space, with over 1,000 companies participating, but the estimates for attendance of 50,000 may well have been significantly exceeded as evidenced by the difficulty in navigating the aisles.
Aisles were packed and business was brisk. Unlike some shows, booths tend to be smaller and the focus closer to the customer’s immediate needs. While many manufacturers do roll out their latest technology, others reserve their big splash for the more extravagant exhibitions. The show has grown by almost 20% in exhibit space, with over 1,000 companies participating, but the estimates for attendance of 50,000 may well have been significantly exceeded as evidenced by the difficulty in navigating the aisles.
MUNICH - EPCOS offers an online service to help comply with the requirements of the Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP), or China RoHS. The company offers a downloadable Excel table, which indicates which of the six substances are contained in products.
EPCOS’ Website features background information on labeling requirements and a summary of the ACPEIP, as well as links to the Ministry of Information Industry of the People’s Republic of China (in Chinese), the German Electronic Manufacturers Association (ZVEI) and the American Electronics Association (AEA).
The China RoHS rules go into effect March 1. Manufacturers must clearly label electronics products if they contain listed substances.
Further information can be found at http://www.epcos.com/china_rohs.
EPCOS’ Website features background information on labeling requirements and a summary of the ACPEIP, as well as links to the Ministry of Information Industry of the People’s Republic of China (in Chinese), the German Electronic Manufacturers Association (ZVEI) and the American Electronics Association (AEA).
The China RoHS rules go into effect March 1. Manufacturers must clearly label electronics products if they contain listed substances.
Further information can be found at http://www.epcos.com/china_rohs.
HERNDON, VA – iNEMI will preview highlights of its 2007 Roadmap at the Apex trade show in Los Angeles next month.
iNEMI CEO Jim McElroy will discuss the roadmap in the Feb. 22 conference keynote, including a look a new chapter on Organic and Printed Electronics Technology.
Also at the show, the Optimizing Lead-Free Processes forum will review some of iNEMI’s Pb-free projects. iNEMI is also cosponsor of the Reliability Summit: Keeping Industry Reliability Test Protocols Current with Rapidly Changing Markets. This free one-day session will discuss current industry initiatives to standardize reliability testing, the challenges of keeping pace with new technologies and markets, and plans for a path forward.
Other iNEMI meetings at the conference include Heat Transfer; Optoelectronics; Environmentally Conscious Electronics TIG, and Board Assembly and Substrates TIGs.
For information, visit http://www.inemi.org/cms/calendar/APEX07.html.
iNEMI CEO Jim McElroy will discuss the roadmap in the Feb. 22 conference keynote, including a look a new chapter on Organic and Printed Electronics Technology.
Also at the show, the Optimizing Lead-Free Processes forum will review some of iNEMI’s Pb-free projects. iNEMI is also cosponsor of the Reliability Summit: Keeping Industry Reliability Test Protocols Current with Rapidly Changing Markets. This free one-day session will discuss current industry initiatives to standardize reliability testing, the challenges of keeping pace with new technologies and markets, and plans for a path forward.
Other iNEMI meetings at the conference include Heat Transfer; Optoelectronics; Environmentally Conscious Electronics TIG, and Board Assembly and Substrates TIGs.
The roadmap will be released after March 5.
For information, visit http://www.inemi.org/cms/calendar/APEX07.html.
SCHAUMBURG, IL -- Motorola will cut 3,500 jobs -- 5% of its workforce -- over the next two quarters amid a nearly 50% drop in quarterly profits.
The cuts will save the company about $400 million over two years, Motorola CEO Ed Zander said.
The cuts will save the company about $400 million over two years, Motorola CEO Ed Zander said.
TAIPEI -- Wistron's annual shipment of LCD
TVs is will reach 1.2 million units this year on new orders from Sony and continued OEM demand from HP and
Westinghouse.
The compamy's revenue reached NT$218.4 billion in 2006. About 75% came from sales of notebook PCs. The compamy estimates shipments will rise to 11 million from 10 million this year.
Wistron also shipped 600,000 handheld units in 2006, and expects to more than double that to 1.3 million units in 2007.
ATLANTA – PCB Design Conference West returns to the Santa Clara (CA) Convention Center this March. The annual PCB West conference and exhibition is geared toward PCB engineering, design and manufacture professionals. Highlights of the March 25-30 conference include a two-day exhibition; 14 free technical sessions; free exhibitor presentations; a professional development certificate program of eight full-day tutorials and two design excellence curriculum two-day courses; a three-day technical conference of 26 short courses; and several free networking events. Mentor Graphics vice president and general manager Henry Potts will keynote the conference, talking on the intersection of PCB design, ICs and hardware.
The conference brochure is available for download at www.pcbwest.com. Registration is currently open.
The conference brochure is available for download at www.pcbwest.com. Registration is currently open.
PALO ALTO -- Hewlett-Packard scientists this month disclosed a new way to make nanoscale computer chips that reportedly increases by eightfold the number of transistors on a chip, without making the transistors smaller.
The HP team's concept involves layering a structure called a nanowire on top of a conventional silicon chip, to increase the number of interconnects. Also, most of the wiring from the silicon is removed, allowing the more transistors to be crammed on the chip.TAIPEI -- Is ODM Asustek Computer going to follow the path blazed by Acer, BenQ Mobile and others and go head-to-head with its customers?
That's the talk -- and it's coming from the company itself.
Company spokesman Jonathan Tsang told DigiTimes the company plans to split its ODM and OEM production within three years.
Asustek builds and markets motherboards, notebook PCs, servers, handsets and LCD TVs under the Asus brand. Sales from Asus notebooks are nearing those of contract revenues, Tsang said.
No decision has been made but the company plans to make a separation in three years, DigiTimes reported Tsang as saying.
SAN CLEMENTE, CA – Inspection equipment OEM YESTech has sold its 500th AOI system, the company announced today. Panasonic purchased the system for its Reynosa, Mexico, plant. Panasonic first purchased YESTech’s AOI in 2005.
SAN JOSE – The SMTA announced plans for the 4th Annual International Wafer-Level Packaging Conference and Exhibition.
This event will be held Sept. 18-19 in San Jose, and will focus on leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging.
The event includes one day of workshops, a two-day technical program and two days of exhibits.
Submit 200-word abstracts to Melissa Serres at melissa@smta.org by March 23.
This event will be held Sept. 18-19 in San Jose, and will focus on leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging.
The event includes one day of workshops, a two-day technical program and two days of exhibits.
Submit 200-word abstracts to Melissa Serres at melissa@smta.org by March 23.
SONORA, MEXICO – Indium announced signed an agreement with Multi Dicona to distribute soldering materials in Sonora, Mexico.
Multi Dicona has more than 13 years’ experience in the printed circuit board industry and is working toward ISO 9000 certification.
The deal covers Indium’s solder paste, rework flux, wave solder fluxes, liquid fluxes, solder bar, solid and flux cored wire, and tape and reel preforms.
Multi Dicona has more than 13 years’ experience in the printed circuit board industry and is working toward ISO 9000 certification.
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- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri