News
Marlborough, MA -- Software simulation company Flomerics has released a survey highlighting the conflict that often occurs between meeting thermal, electromagnetic compatibility (EMC) and signal integrity (SI) design requirements in new PCB designs. 59% of respondents agreed that thermal and EMC requirements are usually in conflict in PCB design (23% disagreed). 60% agreed that thermal and SI requirements are usually in conflict in PCB design (23% disagreed).
However, the survey reveals positive communication and collaboration between electronic and mechanical design engineers at most companies. 64% of respondents described communication as “good” or “very good”, 31% as “needs to improve” and just 4% as “very poor”. 56% of respondents stated that “better software interfaces between electronic and mechanical software would greatly improve collaboration between electronic design engineers and mechanical design engineers”, while 28% said “software is not the issue - good management, human interaction, etc. are more important”.
Respondents were also asked to identify the percentage of new designs that overran time and cost budgets, and the most common causes of such overruns. Most respondents (50%) said that 10 to 30% of new PCB designs overran time and cost budgets, while 4% said projects went over time/budget more than half the time. The most common causes of time and budget overruns were: design requirement changes (59%); circuit design (39%); thermal problems (34%); EMC problems (32%); SI problems (30%); physical layout problems (22%); and routing problems (19%). Respondents were allowed to specify more than one cause.
The survey also provides insights into typical PCB design flows and processes. The average design cycle time for a new PCB design from concept to final testing and manufacturing signoff was specified at 6 to12 weeks by 50% of respondents, more than 12 weeks by 29% and less than 6 weeks by 21%. When asked what generates the greatest pressure on the PCB design function, 54% said “functionality and performance”, 30% said “time to market” and 14% said “cost”.
For a copy of the survey, visit www.flomerics.com/contact.
However, the survey reveals positive communication and collaboration between electronic and mechanical design engineers at most companies. 64% of respondents described communication as “good” or “very good”, 31% as “needs to improve” and just 4% as “very poor”. 56% of respondents stated that “better software interfaces between electronic and mechanical software would greatly improve collaboration between electronic design engineers and mechanical design engineers”, while 28% said “software is not the issue - good management, human interaction, etc. are more important”.
Respondents were also asked to identify the percentage of new designs that overran time and cost budgets, and the most common causes of such overruns. Most respondents (50%) said that 10 to 30% of new PCB designs overran time and cost budgets, while 4% said projects went over time/budget more than half the time. The most common causes of time and budget overruns were: design requirement changes (59%); circuit design (39%); thermal problems (34%); EMC problems (32%); SI problems (30%); physical layout problems (22%); and routing problems (19%). Respondents were allowed to specify more than one cause.
The survey also provides insights into typical PCB design flows and processes. The average design cycle time for a new PCB design from concept to final testing and manufacturing signoff was specified at 6 to12 weeks by 50% of respondents, more than 12 weeks by 29% and less than 6 weeks by 21%. When asked what generates the greatest pressure on the PCB design function, 54% said “functionality and performance”, 30% said “time to market” and 14% said “cost”.
For a copy of the survey, visit www.flomerics.com/contact.
Framingham, MA – In a recent report from Manufacturing Insights, supply chain research director Bob Ferrari identifies intellectual property protection and supplier strategies as the top two risk areas facing manufacturing and retail executives with operations in China. Other risk areas include logistics and transportation, infrastructure, and national as well as local political events.
Ferrari authored the report, which is based on the results from MI’s annual Low Cost Manufacturing in China survey.
Ferrari authored the report, which is based on the results from MI’s annual Low Cost Manufacturing in China survey.
Kunshan, China -- Nanya PCB will invest around $613 million to expand PCB materials production capacity of its plant in Kunshan, Jiangsu Province, China, DigiTimes reported.
The company will expand capacity for producing glass yarn and glass fabric by 40,000 tons and 9 million sq. m., respectively, the paper said. Nanya is also expected to soon finish the second-stage capacity expansion at the plant, with the CCL (copper-clad laminate) capacity to exceed that of the company's Taiwan operations by the first half of 2007.
The company will expand capacity for producing glass yarn and glass fabric by 40,000 tons and 9 million sq. m., respectively, the paper said. Nanya is also expected to soon finish the second-stage capacity expansion at the plant, with the CCL (copper-clad laminate) capacity to exceed that of the company's Taiwan operations by the first half of 2007.
ARLINGTON, VA – Electronic component orders were flat in July, marking the second consecutive month that the 12-month average showed little or no gain (compared to 2005). The four-to-five-week index, which shows order fluctuations over a 10-year period, was down according to the monthly report compiled by the Electronic Components, Assemblies & Materials Association (ECA).
“We’re pretty much in a holding pattern,” said Bob Willis, ECA president. “The fact that the four-to-five-week index is down is more indicative of a strong month last July compared to 2004 than any significant development last month. The flat 12-month moving average probably reflects a wait-and-see attitude among manufacturers based on uncertainty over the current economic and political climate.”
“We’re pretty much in a holding pattern,” said Bob Willis, ECA president. “The fact that the four-to-five-week index is down is more indicative of a strong month last July compared to 2004 than any significant development last month. The flat 12-month moving average probably reflects a wait-and-see attitude among manufacturers based on uncertainty over the current economic and political climate.”
NEW YORK -- EMS sales from the North American automotive industry are likely
to grow from $1.1 billion in 2005 to $3.1 billion by 2012, according to Frost & Sullivan.
The uptick is due to greater outsourcing of certain key operations and a higher amount of electronic content
to grow from $1.1 billion in 2005 to $3.1 billion by 2012, according to Frost & Sullivan.
The uptick is due to greater outsourcing of certain key operations and a higher amount of electronic content
EDINA, MN -- The SMTA will be hosting a job center during SMTAI, held in conjunction
with Assembly Technology Expo on Sept. 26-28 in suburban Chicago. The job center is soliciting local and national companies for job openings in the
electronics manufacturing and supply industry.
The SMTA is providing booth space and a listing of jobs available. Potential employees will be matched to the jobs available and will be given copies of job descriptions and company contact information.
The job center will provide your company the opportunity to reach a region rich in high technology and electronics industry professionals. Examples of SMTAI and ATExpo attendee primary job functions are:
The SMTA is providing booth space and a listing of jobs available. Potential employees will be matched to the jobs available and will be given copies of job descriptions and company contact information.
The job center will provide your company the opportunity to reach a region rich in high technology and electronics industry professionals. Examples of SMTAI and ATExpo attendee primary job functions are:
- Administration
- Circuit/Systems Packaging Design, Circuit Design
- Engineering Management
- Engineering Support (Field Engineering, Technicians)
- Production, Manufacturing, Process Engineering
- Quality Control/Quality Assurance, Production Testing
- Research & Development
- Sales and Marketing.
- Company Name
- Job Title and Short Job Description
- Job Function (see list above)
- Number of Openings
- Company Contact Information (name, phone, email address)
- Preferred Method of Contact (mail, email, phone call).
FRANKLIN, MA – Speedline Technologies reported sales rose 10% sequentially during its fiscal second quarter ended June 30. Sales were up 33% over the second quarter of 2005.
In a press statement, president and chief executive Pierre de Villemejane said, “On the whole, we see positive signs
YAVNE, Israel – Valor Computerized Systems posted second quarter net profit of $1 million – a growth of nearly 150% year-on-year. Net profit for the first six months of 2006 was $1.75 million, up 68% from $1 million in the comparable period last year.
Cash flow from operating activities in Q2 was $1.7 million, up from $241,000 YOY.
Revenues in the second quarter increased 10% sequentially to $9.2 Million, from $8.4 million; the number is a 2% increase over Q2 2005.
“I’m very pleased with the results,” said Ofer Shofman, president and CEO. “The successful implementation of a restructuring process enabled us to show an increase in revenues in Q2 as well as significant increase in net profits. We have been able to penetrate several of the world’s largest electronics companies with our TraceXpert solution this quarter. We expect these deals to deliver significant business in the upcoming years and to open the doors for us into new markets.”
“By the end of the year we are planning to launch a number of new products,” Shofman revealed. “The first one, to be launched within a few months, will provide a Web-based collaboration platform between our customers and their clients.”
The company expects to see continued growth in the next quarter and has revised it annual net profit forecast from $3 million to $3.75 million.
Cash flow from operating activities in Q2 was $1.7 million, up from $241,000 YOY.
Revenues in the second quarter increased 10% sequentially to $9.2 Million, from $8.4 million; the number is a 2% increase over Q2 2005.
“I’m very pleased with the results,” said Ofer Shofman, president and CEO. “The successful implementation of a restructuring process enabled us to show an increase in revenues in Q2 as well as significant increase in net profits. We have been able to penetrate several of the world’s largest electronics companies with our TraceXpert solution this quarter. We expect these deals to deliver significant business in the upcoming years and to open the doors for us into new markets.”
“By the end of the year we are planning to launch a number of new products,” Shofman revealed. “The first one, to be launched within a few months, will provide a Web-based collaboration platform between our customers and their clients.”
The company expects to see continued growth in the next quarter and has revised it annual net profit forecast from $3 million to $3.75 million.
Jersey City, NJ – Cookson Electronics Assembly Materials has established a Global Applications Technology and Engineering group, which will join its global R&D group. The new group’s mission is to help customers solve assembly technology, yield and reliability challenges by understanding process dynamics, and incorporating internal testing and validation capabilities.
"The formation of the Global Applications Technology and Engineering group gives Cookson Electronics the ability to increase its development and output of process engineering expertise into the world of electronics manufacturing,” said Steve Brown, director of global applications technology. “This new group has been formed at a time when assemblers are continually finding new practical challenges in assembly processes, as Pb-free production becomes a daily reality. At the disposal of the group is our a global team of field applications engineers along with two fully automated SMT and wave soldering lines, with automatic solder paste inspection. This enables us to re-create and solve process problems from within Cookson Electronics labs, by using either Cookson test vehicles or customer specific PWBs."
"The formation of the Global Applications Technology and Engineering group gives Cookson Electronics the ability to increase its development and output of process engineering expertise into the world of electronics manufacturing,” said Steve Brown, director of global applications technology. “This new group has been formed at a time when assemblers are continually finding new practical challenges in assembly processes, as Pb-free production becomes a daily reality. At the disposal of the group is our a global team of field applications engineers along with two fully automated SMT and wave soldering lines, with automatic solder paste inspection. This enables us to re-create and solve process problems from within Cookson Electronics labs, by using either Cookson test vehicles or customer specific PWBs."
HERNDON, VA — The International Electronics Manufacturing Initiative (iNEMI) is launching a new project to develop testing and use condition guidelines for electronic components used in medical applications. The Medical Components Reliability Specifications Project is the first organized under the consortium’s new Medical TIG (Technology Integration Group).
The project will develop test and extrapolation methodologies to predict reliability of components in actual use. The project team plans to create a minimum set of requirements for electronic components used in implanted or life-critical devices. The project will also suggest when testing should be done, what kind of testing is required and how to apply test results.
ST. LOUIS -- LaBarge has been named sole supplier for PCBs by ZTEC Instruments, and received initial orders valued at approximately $1.6 million.
LaBarge is producing PCBs for the oscilloscopes, waveform generators and digitizers that constitute ZTEC's modular instrument platform. The platform is used to monitor systems in the telecommunications, military, medical and industrial markets. It integrates several automated test and measurement instruments into a single box.
LaBarge is producing PCBs for the oscilloscopes, waveform generators and digitizers that constitute ZTEC's modular instrument platform. The platform is used to monitor systems in the telecommunications, military, medical and industrial markets. It integrates several automated test and measurement instruments into a single box.
LaBarge is manufacturing the PCBs at its Pittsburgh facility. Production on the initial orders is expected to continue through December 2006, with additional orders anticipated.
ANAHEIM, CA – Along with its second quarter financial results, DDi Corp. announced that it has acquired PCB manufacturer Soverign Circuits and sold its assembly business to Veritek Manufacturing.
On August 8,, DDi sold its assembly business to Veritek Manufacturing Services LLC, for approx. $12 million in cash. The assembly business had unaudited net sales of $15.6 million for the six months ended June 30, 2006 and $31.1 million for 2005, with gross margins of 13% and 10%, respectively.
On August 8,, DDi sold its assembly business to Veritek Manufacturing Services LLC, for approx. $12 million in cash. The assembly business had unaudited net sales of $15.6 million for the six months ended June 30, 2006 and $31.1 million for 2005, with gross margins of 13% and 10%, respectively.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri