News
REDMOND, WA –Data I/O, provider of manual and automated programming systems, has named the second member of its Preferred Partnership Program. The company is also in talking about the program with several other memory and microcontroller companies.
Program benefits and collaboration areas include:
Focused attention on increasing quality of service and reducing time-to-market;
Offering a full solution to end customers rather than selling only a device;
Providing global support to partners and mutual customers;
Helping multi-national OEM customers to link their design and manufacturing in wireless, automotive, consumer electronics, white goods and process control markets;
Protecting IP with “Connected Strategy”;
Helping partners and mutual customers improve profitability and achieve Lean manufacturing by reducing RMAs and introducing higher quality standards;
Educating mutual customers and arranging joint seminars globally;
Providing “Priority Device Support” for partners and their customers;
Collaborating to develop and/or license technology from each other;
Collaborating between partners’ sales/FAE forces early enough to address manufacturing related issues during design phase.
Data I/O and its partners will coordinate efforts to dedicate direct, focused resources for closer customer support at the device level as well as local sales, marketing and technical levels.
Program benefits and collaboration areas include:
Focused attention on increasing quality of service and reducing time-to-market;
Offering a full solution to end customers rather than selling only a device;
Providing global support to partners and mutual customers;
Helping multi-national OEM customers to link their design and manufacturing in wireless, automotive, consumer electronics, white goods and process control markets;
Protecting IP with “Connected Strategy”;
Helping partners and mutual customers improve profitability and achieve Lean manufacturing by reducing RMAs and introducing higher quality standards;
Educating mutual customers and arranging joint seminars globally;
Providing “Priority Device Support” for partners and their customers;
Collaborating to develop and/or license technology from each other;
Collaborating between partners’ sales/FAE forces early enough to address manufacturing related issues during design phase.
The Preferred Partnership Program was introduced in October 2005 to address the growing time-to-market issue both for semiconductor companies and their customers.
HELSINKI, FINLAND -- Nokia Corp. had filed suit in Chinese court, accusing two Chinese companies of copying its cellphone designs.
In Beijing court Nokia asked for damages and a cease-and-desist order.
In Beijing court Nokia asked for damages and a cease-and-desist order.
ROUND ROCK, TX – Michael Dell, the founder of Dell Computer,
today said the computer and consumer electronics maker would offer free
recycling of Dell-branded products worldwide.
"We have a responsibility to our customers to recycle the products we make and sell," said Dell, who is chairman of the company. "Our direct relationships with consumers allow us to offer this easy and free service and we encourage others in our industry to do so as well."
"We don’t believe consumers should have to pay for responsible retirement of products,” Dell said.
"We have a responsibility to our customers to recycle the products we make and sell," said Dell, who is chairman of the company. "Our direct relationships with consumers allow us to offer this easy and free service and we encourage others in our industry to do so as well."
"We don’t believe consumers should have to pay for responsible retirement of products,” Dell said.
ELKHART, IN -- Electronics manufacturer CTS Corp. said today it entered into an bank agreement providing it with a $100 million unsecured revolving credit facility through June 2011.
The company, which makes parts for medical and automotive customers and performs some contract electronics assembly, said it will also have access to an additional $50 million.
CTS said it plans to use the loan for general corporate purposes, including strategic acquisitions.
CTS customers include Hewlett-Packard and Motorola.
The company, which makes parts for medical and automotive customers and performs some contract electronics assembly, said it will also have access to an additional $50 million.
CTS said it plans to use the loan for general corporate purposes, including strategic acquisitions.
CTS customers include Hewlett-Packard and Motorola.
BANNOCKBURN, IL -- May sales of rigid printed circuit boards by North American fabricators were up 20.2% and bookings climbed 7.1% year-over-year, the IPC trade group reported Wednesday. Sequentially, shipments rose 8.5% and bookings were up 2.9%.
Flexible circuit shipments fell 4.2% and bookings were off 20% compared to May 2005. Shipments rose 19.5% and flex bookings increased 19.2% over April's numbers.
The May book-to-bill ratio for rigid boards fell to 1.02. The flexible circuit book-to-bill ratio was 0.91, its third straight month below the benchmark 1.0 level.
The ratios are based on monthly data collected from PCB producers that participate in IPC’s monthly PCB Statistical Program. The combined (rigid and flex) industry book-to-bill ratio in May was 1.01.
Ratios are calculated by dividing the value of orders over the past three months by the value of sales. A ratio of more than 1.0 suggests expansion.
It is difficult to derive the value of the IPC data, critics contend, because of the limited number and size of companies that participate in the survey.
Year to date, rigid PCB shipments are up 11.1% and bookings are up 12.8%. Flexible shipments are up 0.8 % and bookings are down 14.5%. Combined industry shipments are up 10.3% and bookings are up 10.8%.
More than 75% of the PCB market in North America is for rigid boards.
At least 13% of the boards sold in May by those surveyed were built offshore.
Flexible circuit shipments fell 4.2% and bookings were off 20% compared to May 2005. Shipments rose 19.5% and flex bookings increased 19.2% over April's numbers.
The May book-to-bill ratio for rigid boards fell to 1.02. The flexible circuit book-to-bill ratio was 0.91, its third straight month below the benchmark 1.0 level.
The ratios are based on monthly data collected from PCB producers that participate in IPC’s monthly PCB Statistical Program. The combined (rigid and flex) industry book-to-bill ratio in May was 1.01.
Ratios are calculated by dividing the value of orders over the past three months by the value of sales. A ratio of more than 1.0 suggests expansion.
It is difficult to derive the value of the IPC data, critics contend, because of the limited number and size of companies that participate in the survey.
Year to date, rigid PCB shipments are up 11.1% and bookings are up 12.8%. Flexible shipments are up 0.8 % and bookings are down 14.5%. Combined industry shipments are up 10.3% and bookings are up 10.8%.
More than 75% of the PCB market in North America is for rigid boards.
At least 13% of the boards sold in May by those surveyed were built offshore.
Elk Grove Village, IL-- Sonoscan Inc., a developer and manufacturer of acoustic microscope systems, has been issued a patent (U.S. #6,890,302) that gives engineers a new tool for diagnosing packaging defects. It is one of several patents issued to the company in the past year.
Acoustic microscope echoes are typically time-gated on a depth of interest, and echoes from other depths are ignored. This method, known as time domain imaging, has been the standard for many years. If a 230 MHz transducer is being used, the frequency content of the return echoes at an x-y coordinate will range from about 170 to about 260 MHz or more, and the frequency content characteristic typically varies from one pixel to the next.
A new technique, Frequency Domain Imaging (FDI), separates the various return echoes at each x-y coordinate into their individual frequencies. The result is not a single acoustic image, but typically 20 to 40 different acoustic images, each image made from echoes of a single frequency, and each image having its own contrast and resolution.
Engineers often solve problems involving internal interfaces by comparing the various FDI images. The results for any particular sample depend on the sample and on the materials involved, but typically some FDI images have high resolution, and are useful for performing diagnoses of critical interfaces, such as those in flip chips. In some cases, FDI images display features that are not visible in the time-domain images.
Acoustic microscope echoes are typically time-gated on a depth of interest, and echoes from other depths are ignored. This method, known as time domain imaging, has been the standard for many years. If a 230 MHz transducer is being used, the frequency content of the return echoes at an x-y coordinate will range from about 170 to about 260 MHz or more, and the frequency content characteristic typically varies from one pixel to the next.
A new technique, Frequency Domain Imaging (FDI), separates the various return echoes at each x-y coordinate into their individual frequencies. The result is not a single acoustic image, but typically 20 to 40 different acoustic images, each image made from echoes of a single frequency, and each image having its own contrast and resolution.
Engineers often solve problems involving internal interfaces by comparing the various FDI images. The results for any particular sample depend on the sample and on the materials involved, but typically some FDI images have high resolution, and are useful for performing diagnoses of critical interfaces, such as those in flip chips. In some cases, FDI images display features that are not visible in the time-domain images.
Shenzhen – Exhibitors are lining up to showcase electronics goods at Nepcon/EMT South China 2006, which will be held at the Shenzhen Convention and Exhibition Centre from Aug. 29 to Sept. 1. The four-day expo is expected to bring 18,000 domestic and international visitors, making it the largest in South China.
Nepcon South China allows professional visitors to troubleshoot with esteemed technicians and work out complete SMT solutions. Two highlights of the show are the SMT Zone and the Soldering Zone. EMT South China will feature Test & Measurement, Component Manufacturing and Electronics Manufacturing Services.
Exhibiting companies include Assembleon, Cookson Electronics, Dage, Hitachi, HIWIN, Omron, Panasonic, Samsung, Speedline, Suneast, 3M, Universal, WKK and Yamazen. The show will open up an arena for local industry players to glean knowledge about the industry from international heavyweights and hear about the latest electronics manufacturing products.
Booming market conditions in South China have set the stage for a large turnout at the show. Economic forecasters predict the annual revenue of China’s electronics market to hit $60 billion in 2006, growing 15 to 20% annually. Guangdong’s year on year growth has outstripped all regions throughout China at 12.5%, and it already accounts for 37% of China’s electronics production. In coming years, the province will allocate 53 billion yuan to develop 25 key electronics, bio-medicine, software and IC projects.
Plant managers, proprietors, technical engineers, test and inspection officers and quality control officials are just some of the industry professionals that visit the show to catch up on industry trends and gain crucial market information.
Nepcon South China allows professional visitors to troubleshoot with esteemed technicians and work out complete SMT solutions. Two highlights of the show are the SMT Zone and the Soldering Zone. EMT South China will feature Test & Measurement, Component Manufacturing and Electronics Manufacturing Services.
Exhibiting companies include Assembleon, Cookson Electronics, Dage, Hitachi, HIWIN, Omron, Panasonic, Samsung, Speedline, Suneast, 3M, Universal, WKK and Yamazen. The show will open up an arena for local industry players to glean knowledge about the industry from international heavyweights and hear about the latest electronics manufacturing products.
Booming market conditions in South China have set the stage for a large turnout at the show. Economic forecasters predict the annual revenue of China’s electronics market to hit $60 billion in 2006, growing 15 to 20% annually. Guangdong’s year on year growth has outstripped all regions throughout China at 12.5%, and it already accounts for 37% of China’s electronics production. In coming years, the province will allocate 53 billion yuan to develop 25 key electronics, bio-medicine, software and IC projects.
Plant managers, proprietors, technical engineers, test and inspection officers and quality control officials are just some of the industry professionals that visit the show to catch up on industry trends and gain crucial market information.
Pomona, CA – Everett Charles Technologies will consolidate two of its Capital Equipment Group’s wholly owned German business units, atg Test Systems and Luther Maelzer Gmbh. The reorganization is anticipated to be complete by year-end. Till then, both existing operations will continue to service their respective customers. The units manufacture electrical test systems and related products for the bare PCB industry.
Pat Flynn, ECT president and CEO, said in a statement, “This move will leverage the considerable engineering and software talents of each company to the benefit of their respective customer bases and the market in general.”
Pat Flynn, ECT president and CEO, said in a statement, “This move will leverage the considerable engineering and software talents of each company to the benefit of their respective customer bases and the market in general.”
The consolidated unit will be headed by atg’s managing director, Uwe Rothaug. Hans Higgen, L&M’s managing director, will assume responsibility for the R&D engineering team while atg’s Viktor Romanov will manage the flying probe systems R&D effort.
SIOUX FALLS, SD -- EMS provider Electronic Systems Inc. has been certified to the ISO13485:2003 Medical Device Quality Management Systems Standard by the British Standards Institute (BSI).
"We've worked with our registrar, BSI, for nearly 10 years to assure continued compliance to the ISO 9000 standards so the addition of internal systems to comply with the ISO 13485 has been a straightforward sequence from gap analysis through final implementation," said Jim Subart, quality manager.
"As our company has grown and expanded into the medical device area we have sought to improve and add to our QMS expertise by designing and adding the necessary systems to comply with ISO 13485:2003 as well as ISO 9001:2001", said Gary Larson, president. "The medical device industry continues to be an integral part of our long term growth plan."
"We've worked with our registrar, BSI, for nearly 10 years to assure continued compliance to the ISO 9000 standards so the addition of internal systems to comply with the ISO 13485 has been a straightforward sequence from gap analysis through final implementation," said Jim Subart, quality manager.
"As our company has grown and expanded into the medical device area we have sought to improve and add to our QMS expertise by designing and adding the necessary systems to comply with ISO 13485:2003 as well as ISO 9001:2001", said Gary Larson, president. "The medical device industry continues to be an integral part of our long term growth plan."
Austin, TX -- Increased demand in 2005 resulted in longer delivery times and price increases for laminate flip chip build-up substrates, according to market research firm TechSearch International. While several companies have since added capacity, the situation is expected to remain much the same through the end of this year.
Installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks are needed to complete incoming engineering evaluation (2 weeks), engineering build (8 weeks) and actual qualification testing (15 weeks).
However, TechSearch notes that the situation should improve in 2007 and 2008 as additional capacity is installed and qualified.
For its analysis, the firm interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates.
Installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks are needed to complete incoming engineering evaluation (2 weeks), engineering build (8 weeks) and actual qualification testing (15 weeks).
However, TechSearch notes that the situation should improve in 2007 and 2008 as additional capacity is installed and qualified.
For its analysis, the firm interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates.
SAN JOSE – Worldwide revenue of EMS companies reached $190 billion in 2005, up 14% over 2004, according to a report issued today by Electronic Trend Publications.
According to ETP, the EMS industry was responsible for 23% of the total worldwide electronics assembly, valued at $810 billion. The $190 billion includes all the work done by the EMS companies for OEM customers, explained spokesman Steve Berry.
According to ETP, the EMS industry was responsible for 23% of the total worldwide electronics assembly, valued at $810 billion. The $190 billion includes all the work done by the EMS companies for OEM customers, explained spokesman Steve Berry.
SHENZHEN -- Foxconn has admitted to working employees more than twice China's legal limits.
As reported by Circuits Assembly on June 14, the contract assembler was alleged to have been directing its hourly staff to work as much as 80 extra hours each month.
China labor law permits employees to work no more than 36 hours of overtime per month.
As reported by Circuits Assembly on June 14, the contract assembler was alleged to have been directing its hourly staff to work as much as 80 extra hours each month.
China labor law permits employees to work no more than 36 hours of overtime per month.
