News
Washington, DC – Plans are underway for the IMAPS International Conference and Exhibition on Device Packaging, March 20 – 23, 2006, in Scottsdale, AZ.
The conference is dedicated to the challenges and technologies for packaging and devices of all types. Dr. Andrew Strandjord, IMAPS VP of technology and Device Packaging ’06 general chair, said in a statement, “This Conference will feature a new format – six workshops concentrating on 3-D Packaging; Copper/Low-K; Flip-Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics.”
It will also feature an exhibition and technology showcase.
For more info., visit imaps.org/devicepackaging.
The conference is dedicated to the challenges and technologies for packaging and devices of all types. Dr. Andrew Strandjord, IMAPS VP of technology and Device Packaging ’06 general chair, said in a statement, “This Conference will feature a new format – six workshops concentrating on 3-D Packaging; Copper/Low-K; Flip-Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics.”
It will also feature an exhibition and technology showcase.
For more info., visit imaps.org/devicepackaging.
MINNEAPOLIS -- The annual Pan Pacific Microelectronics Symposium
& Exhibit will focus on lead-free PWB finishes, 3-D integration,
lead-free package finishes and advanced flip chips.
The dual keynotes are, Prospects and Challenges of Nano-Packaging for Electronic and Bioelectronic Systems, will be given by Rao Tummala, Ph.D., of the Georgia Institute of Technology, and Summary of New England Lead-free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards, by Sammy Shina, Ph.D., of the University of Massachusetts Lowell.
The event takes place Jan. 17-19, in Hawaii and is sponsored by the SMTA.
Other sessions will cover thermo-mechanical reliability, materials deposition, MEMS and sensor networks, and embedded and SiP packaging, materials and process management and reliability testing and failure analysis.
Sponsors include 3M Co., Asymtek, Dow Corning, Indium, Libra Industries and Sonoscan.
For details visit smta.org/pan_pac.
The dual keynotes are, Prospects and Challenges of Nano-Packaging for Electronic and Bioelectronic Systems, will be given by Rao Tummala, Ph.D., of the Georgia Institute of Technology, and Summary of New England Lead-free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards, by Sammy Shina, Ph.D., of the University of Massachusetts Lowell.
The event takes place Jan. 17-19, in Hawaii and is sponsored by the SMTA.
Other sessions will cover thermo-mechanical reliability, materials deposition, MEMS and sensor networks, and embedded and SiP packaging, materials and process management and reliability testing and failure analysis.
Sponsors include 3M Co., Asymtek, Dow Corning, Indium, Libra Industries and Sonoscan.
For details visit smta.org/pan_pac.
SAN JOSE -- Tessera
Technologies, a fabless chip packaging company, has entered into a definitive agreement to purchase
certain assets of Shellcase Ltd., for
$33 million in cash. The deal is pending standard closing conditions
and regulatory approvals and is expected to close in the December
quarter.
Shellcase is a provider of commercial wafer-level image sensor packaging. Its technology portfolio includes wafer-level packaging for image sensors and other devices used in cellphones that integrate digital cameras.
"Tessera is one of the world's leading technology development and licensing companies. This, in combination with the Shellcase technology and team, will enable us to grow the new business substantially," said Bruce McWilliams, Tessera's chairman and chief executive officer. "Furthermore, it solidifies our position in the wafer-level packaging market for image sensors and MEMS devices, which we believe to be among the semiconductor industry's fastest growing market segments."
According to Prismark Partners, a research firm, the image sensor market is expected to grow from approximately 520 million units in 2004 to approximately 1.3 billion units by 2009. And In-Stat forecasts the MEMS market to grow from 2.4 billion units in 2004 to nearly 6 billion units by 2009.
Shellcase is a provider of commercial wafer-level image sensor packaging. Its technology portfolio includes wafer-level packaging for image sensors and other devices used in cellphones that integrate digital cameras.
"Tessera is one of the world's leading technology development and licensing companies. This, in combination with the Shellcase technology and team, will enable us to grow the new business substantially," said Bruce McWilliams, Tessera's chairman and chief executive officer. "Furthermore, it solidifies our position in the wafer-level packaging market for image sensors and MEMS devices, which we believe to be among the semiconductor industry's fastest growing market segments."
According to Prismark Partners, a research firm, the image sensor market is expected to grow from approximately 520 million units in 2004 to approximately 1.3 billion units by 2009. And In-Stat forecasts the MEMS market to grow from 2.4 billion units in 2004 to nearly 6 billion units by 2009.
HERNDON, VA -- A pair of trade groups will discuss implementation and adoption of material composition data exchange
standards at Productronica this month.
IPC and iNEMI will sponsor the meeting, scheduled for Nov. 16 from 9 to noon.
SALT LAKE CITY -- CirTran Corp., a contract electronics
manufacturer, said today that it has obtained marketing and
distribution rights to The Perfect Grill, an electric indoor grill sold
through infomercials in
the U.S., Canada, Japan and South America. The company also obtainted
worldwide manufacturing rights.
CirTran said the agreement, signed last week with Euro-G.E.M GmbH of Aschheim, Germany, is effective immediately.
CirTran-Asia, a subsidiary, already builds the device in China.
CirTran said the agreement, signed last week with Euro-G.E.M GmbH of Aschheim, Germany, is effective immediately.
CirTran-Asia, a subsidiary, already builds the device in China.
ANAHEIM, CA -- Bruce McMaster, president and chief executive of
quickturn PCB maker DDi Corp., resigned today, effective immediately.
The company named senior vice president and CFO Mikel Williams to
replace him. A new CFO will be sought. DDi is the 8th largest
U.S.-based PCB company, with sales of about $195 million last year, although in terms of revenues from U.S.
operations it ranks fourth.
ENDICOTT, NY -- Endicott Interconnect Technologies, a supplier of electronic interconnect solutions and
turnkey manufacturing services, announced a contract to supply several major components in support of the E-2D
Advanced Hawkeye Program for Raytheon-Network Centric Systems.
Endicott Interconnect will be responsible for PWB design, fabrication and circuit card assembly production of multiple components in support of this program.
The E-2D Hawkeye aircraft is used by the U.S. Navy primarily as an all-weather, airborne battle management and command and control center. It has been in active service with the U.S. Navy since 1973. The major components of the Advanced Hawkeye are among the latest in a continual series of modifications and upgrades to enhance the aircraft's capabilities.
"With Endicott Interconnects new win with Raytheon, we further enhance the company's position as the 'Supplier of the Future' to Raytheon," said Jay McNamara, chief executive. "From our initial engagements through today, we've made the commitment to deliver unparalleled customer service, technical support, improved quality and manufacturability in the products we build for Raytheon. Our staff of experienced professionals will continue to support the Raytheon team with development efforts on the Advanced Hawkeye, as well as other programs," he said.
Endicott Interconnect will be responsible for PWB design, fabrication and circuit card assembly production of multiple components in support of this program.
The E-2D Hawkeye aircraft is used by the U.S. Navy primarily as an all-weather, airborne battle management and command and control center. It has been in active service with the U.S. Navy since 1973. The major components of the Advanced Hawkeye are among the latest in a continual series of modifications and upgrades to enhance the aircraft's capabilities.
"With Endicott Interconnects new win with Raytheon, we further enhance the company's position as the 'Supplier of the Future' to Raytheon," said Jay McNamara, chief executive. "From our initial engagements through today, we've made the commitment to deliver unparalleled customer service, technical support, improved quality and manufacturability in the products we build for Raytheon. Our staff of experienced professionals will continue to support the Raytheon team with development efforts on the Advanced Hawkeye, as well as other programs," he said.
SAN JOSE – Worldwide sales of semiconductors
rose 5.2% sequentially to $19.6 billion in September, the SIA reported today. Global chip sales increased 5.6%
over September 2004.
Third-quarter sales were up 8.9% sequentially.
Third-quarter sales were up 8.9% sequentially.
GRAZ, AUSTRIA -- The global semiconductor market is expected to grow 6.6% on an annualized basis to $227 billion in 2005, according to fall forecast of the World Semiconductor Trade Statistics. Worldwide growth will accelerate to 8% in 2006 and 10.6% in 2007, with Asia-Pacific being the largest and fastest growing regional market, the trade group said.
SAN JOSE -- Michael Moritz and Patrick Foley resigned
from the board of Flextronics International Ltd., effective Oct. 18, the company said.
The company named Lip-Bu Tan to its audit committee, in compliance with Nasdaq requirements.
The company named Lip-Bu Tan to its audit committee, in compliance with Nasdaq requirements.
VANCOUVER -- Nam Tai
Electronics on Monday reported
third-quarter flat net income of $18.8 million on sales of $207
million, up 50.6% year-over-year. The EMS company's sales are up 44.3%
year-to-date, although net income has dropped 65% to $38.6 million.
REDMOND, WA -- Data I/O Corp., a maker of manual and automated
device
programming systems, today announced third-quarter
net income of $127,000 on revenues of $6.6 million. For the quarter
ended Sept. 30, revenues were flat sequentially and incomes was up
140%.
Fourth quarter revenues are expected to increase significantly, the firm said.
Fourth quarter revenues are expected to increase significantly, the firm said.
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