News
“We are proud of the decade-long recognition we’ve received from Circuits Assembly magazine and its Service Excellence Awards program,” said Karen Vincent, Director of Sales & Program Management, at previous winner MassTech EMS. “The awards both validate and raise awareness of our commitment to delivering outstanding services in engineering and creative supply chain solutions that help customers reach their larger business goals. What means most to us is that the awards reflect our clients’ perspective on our services. We look forward to participating in this program year after year.”
Customers are surveyed to determine a participating company's level of customer satisfaction in various categories, including: dependability/timely delivery; ease of use; manufacturing quality; responsiveness to requests and changes; technology; and value for the price. All customer responses and ratings are tabulated by a third party and provided in a confidential report to the participating company.
This year, Circuits Assembly will recognize three categories of EMS providers based on revenues (under $100 million; $100 million to $500 million; $500 million and over) and the following categories of suppliers: dispensing; pick-and-place; repair and rework; screen printing; test and inspection; materials (solder paste); and manufacturing or supply chain management software.
Circuits Assembly will honor winners during Apex 2006 in Anaheim, CA. Proceeds from the program help fund the SMTA's Charles Hutchins Educational Grant.
For more information, contact Circuits Assembly associate editor Robin Norvell at rnorvell@upmediagroup.com or visit circuitsassembly.com/cms/sea.
The new facility was created to enhance Kester’s ability to deliver globally. Its global distribution and manufacturing operations now allow customers to receive Kester’s full line of soldering and solder-related products 24/7 throughout the world.
Harper released a statement saying, "I have greatly enjoyed my experience with Suntron and I am proud of our accomplishments over the past several years. My departure should not be viewed as a negative reflection on the company."
Vice president, controller and chief accounting officer James A. Doran has been named interim CFO.
The layoffs could begin in January, a company official stated. The Winnipeg, Manitoba-based company said most of its manufacturing at the Valley City plant will be consolidated at other sites.
The plant was opened in 2001. In 2003, the company was given about $635,000 in city and state grants to keep it from leaving town, according to reports.
The new facility will employ about 700 people in its first year of operation and will have 1,500 employees within five years, Dell said in a statement today.
For the quarter ended June 30, the company reported net sales of $59.1 million, up from $57.1 million. The net loss was $1.98 million, including a one-time, non-cash, pretax writedown of $2.2 million. Last year, the company reported income of $177,000.
For the year, net sales were $231.8 million, down from $249.1 million. The net loss increased to $4.9 million, from $556,000. Fiscal fourth quarter SG&A expenses declined 14% vs. a year ago. For the year, SG&A fell 8%.
In a statement, Jaco chairman and chief executive Joel Girsky said, “I believe we have made progress in extending our U.S. market presence with a focused marketing model emphasizing Jaco's core strengths in providing value-added products and services for our customers, especially in the flat panel display and Far Eastern logistics business segments.”
Jaco supports large contract manufacturers in Asia with logistics programs such as automated inventory management.
AUSTIN – Use of system in package is expected to grow 20% compounded annually through 2009, driven by wireless products, especially cellphones.
In a new report, System-in-Package: The New Wave in 3D Packaging, TechSearch International explores the technology advances and market drivers that have produced a renaissance in multichip packaging solutions.
How are SiPs different from multichip packages of the past? According to TechSearch one application – wireless products – stands out as a high-volume driver that did not exist a dozen years ago, when many multichip packages were first introduced.
According to TechSearch, SiP is a functional system or subsystem assembled into a single package containing two or more dissimilar die, typically combined with other components such as passives, filters, antennas, and/or mechanical parts. The components are mounted together on a substrate to create a custom, integrated product.
A variety of SiPs are found in the RF, digital baseband, and transceiver sections of mobile phones. The reason: SiPs deliver increased functionality and performance in small form factor for mobile communication, resulting in significantly greater adoption rates than any previous MCM. Emerging applications for mobile phones include mini hard disks and camera modules. Planar and stacked configurations are in use and several companies, including Philips, STMicroelectronics and SyChip, have introduced integrated passive substrate solutions.
SiP solutions are increasingly found in a broad range of additional market segments, including consumer electronics such as digital cameras and camcorders, automotive, military/aerospace, medical, computer, and telecom. SiP is forecast to hit a unit growth rate of almost 20% CAGR between 2004 and 2009, TechSearch says.
According to local press reports, Abit will use the proceeds to retire debt.
Press Releases
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- Cofactr Democratizes their Complete Procure-to-Ship Automation Service at a Pivotal Moment for US, Unlocking Support for Agile Hardware Manufacturers in America—with No Upfront Costs
- Semi-Kinetics Adds 2nd Pemtron X-Ray Inspection and Component Counting Capabilities as Part of California Expansion
- The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver