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News

NEW YORK -- Semiconductor customers will continue to increase consumption of multichip devices and PLDs over the next 12 months, suggests a recent survey of purchasing managers.

Investment bank SG Cowen said today that its poll of 250 procurement specialists provides "multi-year empirical data ... and serves as an important, independent validation."

The firm said 65% of participants expect year-over-year gains in purchases of chipset solutions and reference designs in the next 12 months. This is an increase from each of SG Cowen's three prior surveys, conducted in last February, October 2004 and July 2003.

Thirty-two percent of participants expect to increase purchases of PLDs within the next 12 months. This is unchanged from February but up 10 points from the July 2003 survey.

BERG, SWITZERLAND -- Alphasem Co. Ltd. has relocated its die-attach operations in China from Shenzhen to a larger premises in Suzhou.

The company, also makes die sort systems for semiconductor production, generates about 75% of its sales in Asia. The company founded the subsidiary three years ago, in Shenzhen.

The Suzhou plant will employ 30 workers, a number which the company said will increase significantly in the future.

STRATHAM, NH – Vitronics Soltec has named Erik Tobiason president, replacing Jeroen Schmits, who was named head of Universal Instruments last month.

Vitronics and Universal are subsidiaries of Dover Technologies. Tobiason was president of Graphics Microsystems Inc., also a Dover Corp. subsidiary.

NEW YORK -- Banc of America Securities says EMS demand should pick up in the second half as customers exhaust their budgets ahead of the next fiscal year.

"We still expect a second-half seasonal pick-up in demand due to corporate 'budget flush' and consumer holiday spending," said Banc of America. "On a year-over-year basis, we see mid-to-high single-digit growth in IT spending."

The analyst rated Flextronics and Benchmark as its best buys, while noting problems at Solectron and Sanmina-SCI.

HONG KONG -- Foxconn International reported first-half net earnings of $146.9 million, up 66% from $88.3 million last year. For the six months ended June 30, the ODM posted revenue of $2.35 billion, up from $1.29 billion a year ago.

Torrance, CA – Excellon Automation has opened its new corporate offices and North American production facility in Rancho Dominguez, CA. The relocation efforts will be completed by mid-October.

“Our current facility is outdated and no longer supports our North American production needs or provides the necessary capabilities for our world headquarters operations, “ said David Balsbough, president. “With our increased emphasis on customer support and technology leadership we need a facility that supports these objectives while providing efficient and flexible operating capabilities.”

TOKYO -- Sony's new CEO didn't wait long to shake up the company, as the consumer electronics giant announced plans to close 11 factories and cut 10,000 jobs from its electronics business.

Howard Stringer, the media executive whom Sony hired to revitalize its listing electronics business, said the cuts will save $1.8 billion in costs by the end of fiscal 2007. The company revised downward its forecast for the fiscal year ending in March to a net loss of $89.8 million.

AUSTIN -- Smart Modular Technologies has inked a deal to license module and package stacking technologies from Staktek Holdings.

Smart makes memory products; Staktek is a provider of intellectual property and services for chip-stacking and module technologies.

Under terms of the agreement, Smart can use Staktek's ArctiCore technology for module products, and will be licensed to offer stacking technology for leaded and BGA packages. Financial terms were not disclosed.

San Diego — KIC, Henkel Technologies, DEK, Engent, Vitronics Soltec and OK International will co-sponsor a lead-free workshop this Thursday and Friday at DEK’s facility in Schaumburg, IL.

This hands-on training program is designed for engineers and engineering management, and will provide a broader knowledge of lead-free materials interactions, and a greater understanding of the process including advantages and limitations. A sample lead-free board will be produced and taken away by each attendee. Engineering and technical representatives will be available for one-on-one discussion.

The workshop will feature hands-on production floor training in the following areas:
· Screen printing surface-mount adhesives and solder paste, and placement
· Reflow profiling
· Inspection/analytical
· Rework
· Wave.

For agenda and additional information: kicthermal.com/index.html.
Reservations must be made in advance.

WORCESTER, MA -- Although some designs are pushing 10 Gb/s, a handful of connector and backplane manufacturers agreed that most designs continue to fall in the 3.125 to 6 Gb/s range.

Exhibiting at DesignCon East this week, Tyco and FCI, among others, claimed most interest remains centered in the mid-range, despite talk of high er speed applications.

Buffalo Grove, IL - Panasonic Factory Solutions Co. of America has moved from Elgin, IL, to a dedicated location in Buffalo Grove. The new facility will house three industrial market units: Welding and Robotics, Electronics Assembly (EAG) and Microelectronics (MEG).

"We're continually growing as an independent industrial division of the Panasonic family," said Tom Gebhardt, president. "This move is most advantageous: the location's proximity to O'Hare and other industrial corporations is far more convenient for customers visiting/training with us. We have expanded our MEG clean room by 60%, and added lab space specifically for metrology and solutions."

The company develops and supports innovative manufacturing processes around the core of welding, robotic, software and circuit manufacturing technologies.

ENDICOTT, NY -- Endicott Interconnect Technologies has achieved "Approved Vendor Status" for PWB design, fabrication and circuit card assembly by Raytheon Computer Products, a business unit of Raytheon's Network Centric Systems Division.

Endicott Interconnect supplies PCBs, organic chip carriers and first- and second-level assemblies to the defense and aerospace markets. It also suppliers chip packaging, PCBs, electronic assemblies, electro-mechanical equipment and services to the computer, telecommunications and communications markets.