News
BANNOCKBURN, IL, Dec. 1, 2004- The North American book-to-bill ratio for rigid and flexible boards dipped slightly to 1.05 in October, according to IPC. It had been 1.08 in September. Shipments and bookings both dropped notably from the previous month.
The ratio is based on data collected from rigid PCB and flexible circuit producers that participate in IPC's statistical program. The ratio is calculated by dividing the value of orders booked over the past three months by the value of sales billed. A ratio over 1.0 is considered an indicator of rising demand.
Separately, the ratios were 0.94 for rigid PCBs and 1.48 for flexible circuits.
In October, combined shipments increased 15.3% year-on-year, with bookings up 2.7%.
PCB shipments are up 31.5% year-to-date, and bookings are up 31.4%.
However, shipments and bookings are both down from September, falling 15.5% and 16.8%, respectively.
Year-on-year, rigid PCB shipments are up 3.3% and bookings are down 20.0%. Shipments and bookings are both up year-to-date, increasing by 21.2% and 12.6%, but are both down sequentially, decreasing 18.7% and 16.7%, respectively.
Flexible circuit shipments are up 48.6% and bookings are up 81.5% year-on-year. Year-to-date, flexible shipments and bookings have grown 74.4% and 103.1%. Sequentially, flex shipments decreased 1.9% and bookings are down 17.2%.
Flexible circuit sales, which include some value-added services in addition to the bare flex circuits, represent about 17% of total PCB sales in IPC's survey sample.
In a press release, IPC cautioned that month-to-month comparisons should be made with caution as they may reflect cyclical effects.
Carlsbad, CA — Asymtek is holding a conformal coating and dispensing workshop on Wednesday, Dec. 8, at the Center for Board Assembly Research, Manufacturing Research Center (MARC) of the Georgia Institute of Technology in Atlanta. The hands-on workshop will feature demonstrations from Asymtek and presentations from Dow Corning, Georgia Tech, Emerson and Cuming, Henkel Technologies, Humiseal, Heraeus and Nordson.
Speakers will review the best practices for coating, jetting and other electronics assembly dispensing from both material and equipment perspectives.
For more information on the free event, visit: www.asymtek.com/news/seminars/southeast_2004 or call 1-800-ASYMTEK, ext. 8496.
Jersey City, NJ, Nov. 29, 2004 - Cookson Electronics Assembly Materials and Automated Learning Corp. (ALC) have launched a series of lead-free assembly training courses.
The courses are part of ALC's Learntech series, a modular interactive multimedia learning approach designed for process engineers, managers and senior operators involved in the implementation and management of lead-free electronic assembly processes.
Business Electronic Soldering Technologies (BEST) is a key contributor in the first product in the suite -- Lead-Free Soldering: Orientation. Click here for more information.
Future lead-free training courses will cover rework, wave soldering and SMT. Translated versions will be offered in German and Chinese.
Munich, Nov. 30 - The electronica trade show in Munich earlier this month attracted more than 3,000 exhibitors and 75,000 attendees, according to event organizer Munich Trade Fairs International. These numbers are almost equal to those released regarding the last show in 2002.
Overall feedback was positive; 85% of exhibitors and attendees surveyed assessed the market's future as "excellent to good."
Non-German attendance rose 10% from the previous show, making up 42% of total visitors. According to the organizer, 86% of attendees were identified as decision-makers for their companies.
"We spent quality time with customers in a relaxed atmosphere here at our booth," said Alden Chauvin, VP of worldwide sales for Intersil, a manufacturer of high performance analog solutions. "We've had meeting after meeting and business has been great, which is no surprise at electronica."
The next electronica will take place Nov. 14-17, 2006, at the New Munich Trade Fair Centre.
Minneapolis, MN -- The SMTA has issued a call for papers for the next SMTA International event, to be held in conjunction with AT Expo on Sept. 25-29, 2005, at the Donald Stephens Convention Center in Chicago. A 300-word abstract should be submitted online by Feb. 7.
Papers are sought in the following technology tracks: assembly; business; components; emerging technologies; PCB technology; and process control
New topics for 2005 include New Materials & Processes, Battery Interaction, Lead-free Case Studies, Doing Business in Asia and RoHS Compliance. A full list of topics can be found on the SMTA Web site.
IC Insights, a research firm, today forecast the 2004 ranking of the top 10 semiconductor suppliers, with Intel leading the way, surpassing $30 billion in semiconductor sales. However, the company is expected to register only 11% growth this year, and a 3.4% CAGR over the 1999-2004 timeframe, compared to an industry-wide 6.9% average.
Number two is Samsung, followed by Texas Instruments, Renesas and Infineon.
Driven by surging DRAM and flash memory sales, Samsung's semiconductor revenue (85% of which is memory) is forecast to grow 53% in 2004. Infineon is forecast to jump from seventh in 2003 to fifth in 2004, aided by the strength of the euro. In euros, Infineon is expected to register a 24% growth rate (35% when its sales are converted into U.S. dollars).
The rest of the top 10 include Toshiba, STM, TSMC, NEC and Freescale. Excluding TSMC, which is a pure-play foundry, Philips would come in at no. 10.
The top 10 semiconductor companies revenues are forecast to grow 24% over 2003. In contrast, the worldwide market is forecast to grow 28%. Of the top 10, including TSMC, only four are forecast to grow faster than the total market in 2004. Excluding TSMC, only three top 10 companies are expected to increase their 2004 sales faster than the overall market growth rate.
Weymouth --On Nov. 25, DEK held a Stencils Technology Day at its Weymouth, UK, office to share the findings from its recent lead-free print trials, and to provide hands-on experience with stencil technologies.
Clive Ashmore, global applied process manager, presented the lead-free trial results. The company found that having a stencil that is well designed and specified for its application has the greatest impact on process performance, whether the application is lead-free or leaded. A second important consideration is materials composition. Electroformed nickel was the top performing stencil material in tests, closely followed by laser-cut nickel.
Richard Boyle of Henkel Multicore then gave a presentation on lead-free pastes that focused on areas where the differences between leaded and unleaded may impact the industry most.
The afternoon was dedicated to workshops and discussions on the theme "Print failures: cause and effect."
Dek reported positive feedback from the 32 customers in attendance.
SAN JOSE, Nov. 22 -- The 90-day moving average for orders of semiconductor equipment from North American manufacturers rose 3% over revised September levels and 60% year-on-year, the industry trade group SEMI said today.
Respondents to SEMI's monthly poll posted $1.39 billion in orders in October. The book-to-bill ratio was 0.96, meaning that $96 worth of orders were received for every $100 of product billed for the month.
The three-month average of worldwide billings was $1.44 billion in October, flat with revised September levels and up 67% versus a year ago.
The industry is flux, SEMI said in a statement. "The overall semiconductor equipment sector will post the second greatest gain on record in 2004. It is also several months into a period of order softening," said Stanley T. Myers, president and CEO.
"Total equipment bookings for North American producers have declined 13% from the cyclic peak observed in June. Given recent announcements from several equipment companies, continued moderation in orders is expected until end market visibility strengthens for the semiconductor manufacturers."
SAN JOSE, Nov. 26 -- Worldwide semiconductor sales grew 1.5% to $18.8 billion in October, said the SIA today. The October 90-day average for sales was up 22% over a year ago.
The rise reflected "ongoing inventory corrections in certain market segments," said SIA president George Scalise in a press statement.
SIA guided for fourth-quarter sales to be flat sequentially. The trade group projects year-on-year growth of at least 28%.
October sales of DSPs rose 8.5% sequentially, a sign that the inventory correction that began in the wireless handset market in July has run its course, said Scalise.
PC sales, which historically peak in the fourth quarter, have been further buoyed by corporate demand, SIA said. Microprocessors were up 6.4% sequentially and DRAMs were up 2.8%, signs that the supply chain has shed its excess inventories for those chips, SIA said.
"Sales of consumer electronics are especially strong in the fourth quarter as the holiday build continues," said Scalise.
Capacity utilization declined two points in the third quarter, to 93%. Sales in all geographic regions except Japan were up sequentially in October.
The agreement was announced by the companies today. Other details were not disclosed.
Boucher will also lead the EMS company's Lean Manufacturing initiatives.
Boucher was head of manufacturing for Celestica in North and South America.
Prior to joining Celestica in March, Boucher was corporate vice president of global supply chain management for MSL, which Celestica acquired. He also worked for Circuit Test Inc. and Digital Equipment Corp.
Revenue from so-called volume high-end servers grew 18.2% and continues to drive the server market. Midrange enterprise server sales declined 10.2%, the third straight quarterly decline. High-end enterprise servers grew 1.9%, the forth consecutive quarter of growth.
"IT spending remained strong overall in the third quarter as customers continued to refresh and expand their IT infrastructures," said Matt Eastwood, program director of global enterprise server solutions at IDC. "Although customers continue to target data center simplification initiatives, investment in strategic IT initiatives - including new workloads - are also growing significantly once again."
IBM retained the top spot worldwide with 31.7% market share, up 6.3%. HP, the shipments leader, was second in revenues (26.8% share), up 2.9%. Sun and Dell were third at 10.2% and 10.1%, respectively. Dell grew 14.1% year-over-year while Sun was flat at 0.1%.
Top 5 OEMs, Worldwide Server Systems Factory Revenue (millions)
- IBM $3,659 31.7%
- Hewlett-Packard $3,094 26.8%
- Sun $1,176 10.2%
- Dell $1,170 10.1%
- Fujitsu/Fujitsu Siemens $714 6.2%
- Others $1,733 15%
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association