News
The first annual International Wafer-Level Packaging Congress (IWLPC), co-sponsored by the Surface Mount Technology Association (SMTA, Minneapolis, MN), will be presented at the San Jose Doubletree Inn, San Jose, CA, on Oct. 10-12. The congress includes three days of technical programming and two full days of exhibits presented by suppliers to the semiconductor packaging and testing industry.
Dr. W.R. "Bill" Bottoms, chairman of Third Millennium Test Solutions, will present the dinner keynote speech on October 11. The title of his address is "Wafer-Level Packaging: Why and Why Not?" With a Ph.D. from Tulane University, Dr. Bottoms has an extensive background in academia, venture funding and in the commercial semiconductor equipment sector.
After receiving his doctorate in physics, Dr. Bottoms joined the electrical engineering faculty of Princeton University, where he remained until 1976. He then joined Varian Associates in Palo Alto, CA, as manager of research and development, and he was later named president of Varian's newly formed semiconductor equipment group. After leaving Varian, he was senior vice president and general partner at Patricof & Co.
Ventures Inc., an international venture capital firm. He founded Third Millennium Test Solutions in March 1999.
Dr. Bottoms has also served on a number of government and industry committees and advisory positions, including chairmanship of the subcommittee of the Technical Advisory Committee of the U.S. Commerce Department's Export Control Commission for Semiconductor Equipment and Materials.
Joseph Fjelstad, co-founder of SiliconPipe Inc., and Dr. Ken Gilleo of ET-Trends LLC will co-chair the technical program. Both are widely known speakers on semiconductor packaging and interconnection topics. In addition to its focus on wafer-level packaging, the congress will explore many topics in chip-scale packaging and other advanced packaging processes.
Copyright 2004, UP Media Group. All rights reserved.
Dow Corning Corp. (Midland, MI), a provider of silicon-based technology, has launched a partnering approach specifically designed to help electronics industry customers solve business problems and seize emerging opportunities. The Electronic Solutions initiative expands the company's value proposition beyond materials and signals a significant shift in the company's business strategy.
Drawing on its 60 years as a materials manufacturer and the capabilities of its partners throughout the electronics industry, Dow Corning can now help customers meet many business challenges, including product and application development; materials, process and equipment integration; facilities design and engineering; and supply chain management (including environmental, health and safety capabilities).
The company has also tapped Arthur Hanlon to lead the solutions strategy. In this role, Hanlon oversees the development of customer-centered solutions across Dow Corning's semiconductor, packaging, systems assembly and subsystems assembly market segments, including emerging business programs.
To date, Dow Corning has helped many companies throughout the electronics industry overcome specific business challenges, including factory and geographic expansions, supply chain optimization, equipment procurement and product research and development.
"Where we once had limited points of contact with customers, typically between our sales person and the company's procurement department, we now interface with companies on multiple levels," said Tom Cook, executive director. "Our engineers work with customers' engineers to troubleshoot process problems on their manufacturing lines, our scientists support customers' scientists in creating new formulations, R&D teams help customers' brand managers create new markets and our business development leaders work with our customer's business owners to outline and develop proposals to meet their significant business challenges."
www.dowcorning.com/electronics
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Printing printed circuit boards (PCBs) in highly flexible production environment demands new solutions for efficient use of a screen/stencil printer. Standard inline printers are not ideally suited since various production lines or production cells would need a machine for each section.
The SP500 batch printer from ESSEMTEC (Glassboro, NJ) can be used for printing several lines or cells, as it provides a fully automatic process.
All printing parameters are stored in an internal database and users can also store information such as set up info and solder paste and stencil specifications. The operator can easily select the product and gets all necessary information for setting the new batch.
The printer automatically aligns the PCBs to the stencils with an integrated vision system. The printer can be operated in a manual loading or fully automatic batch-loading mode. The related PCB loading/unloading system automatically feeds PCBs from a rack, prints them and stores them on the same rack. The integrated underside stencil cleaning system makes sure that the batch is properly printed, avoiding blocked stencil apertures. Different cycles can be programmed and three different cleaning modes—dry, wet or vacuum—can be selected and combined.
The complete printing cycle is fully automatic; a full rack of PCBs can be printed and then inserted to a surface-mount device assembly line or cell. Problems with paste drying on the stencil are avoided.
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EMC has introduced the Cyberclean Series 6000, Model 7883CD batch washer. The stainless steel cleaner washes and dries in one chamber. Features include wash and dry temperatures to 93ºC; a built-in adjustable water softener, detergent and neutralizer dispensing system; and a HEPA filtration system with adjustable drying.
Other important features include a 106-gallon per minute circulation pump, thermally protected for overheating, and eight standard wash recipe times with holding times and temperatures that are fully adjustable. The washer also includes an RS-232 printer port for monitoring and validation.
The dual rotary spray arms are located at the top and bottom of the cleaning chamber for efficient cleaning within the chamber. The unit can be configured in 208/220V three phase, 20 Amps or 208/220V single phase 30 Amps. Running sound decibels are rated at 54.0 dB @ 1 meter.
The batch cleaner has a footprint of 33.5 x 35.5 x 27.5 in. Interior wash chamber is 18.5 x 20.5 x 20.5 in.
Copyright 2004, UP Media Group. All rights reserved.
EAZIX Inc., the design service and original design manufacturing (ODM) arm of electronics manufacturing services (EMS) provider Integrated Microelectronics Inc. (IMI, Laguna, Philippines), announced its partner distribution program with MEV Elektronik Service Gmbh (Hilter, Germany), a distributor and stocking representative for electronic niche components.
MEV offers procurement of electronic components and logistics services to original equipment manufacturers (OEMs) and EMS companies in Central and Eastern Europe. With the value added reseller partnership with EAZIX, MEV will also be an authorized distributor of EAZIX's line of wireless connectivity ODM products, including wireless local area network 802.11b and 802.11g embedded modules and adapters supporting USB 2.0, PCMCIA, mini PCI, and Compact Flash standard interface. EAZIX upcoming solutions available in Europe also include wireless multi media adaptors, remote automation and control solutions and ZigBee/IEEE 802.15.4 and Bluetooth modules and adapters.
The distribution partnership capitalizes on EAZIX' strength in firmware and hardware design for wireless ODM solutions and design services, and MEV's experience in distribution to established OEMs.
MEV president Dieter Tappmeyer said, "We foresee high demand coming from European wireless OEMs for wireless ODM platforms that will require more complex level of customization, such as the solutions developed by EAZIX."
Research group iSuppli predicts that the number of embedded devices supporting WiFi technology will increase to 167.8 million units in 2008, up from $436 million in 2003.
www.imiphil.com
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Due to ever-changing customer needs and recognizing its growing international stencil business, DEK (San Jose, CA), a high accuracy mass imaging solutions provider, has announced the installation of next-generation laser cutting equipment in its Guadalajara, Mexico, stencil manufacturing facility.
"The addition of this equipment is in direct response to current and anticipated customer requirements," said Neil MacRaild, North American general manager for DEK Process Support Products. "Our worldwide stencil business continues to grow and we are seeing significant business development in Mexico."
The laser equipment, which is a proprietary DEK system, provides production speed while delivering precision and control. With a guaranteed aperture dimension tolerance of ±5 µm over the entire printable area, the laser equipment enables the manufacture of stencils for precise surface-mount technology and semiconductor packaging applications.
Jose Perez, DEK Mexico general manager, said, "This enhancement to our manufacturing capability in Mexico is very exciting because it speaks to the volume our business is enjoying and to the dedication DEK has to providing necessary resources for growth. Our customers' manufacturing volumes require this increase in capacity and we have delivered."
DEK's international stencil operating procedures enable customers to transfer data, processes and products to any of DEK's worldwide locations. The company has seven stencil manufacturing sites in North America and eight facilities in Europe and Asia.
Copyright 2004, UP Media Group. All rights reserved.
The National Electronics Manufacturing Initiative (NEMI, Herndon, VA) is hosting an open workshop to review year-to-date progress on the 2004 NEMI Roadmap. The meeting is scheduled for June 23 at NEMI headquarters.
"This workshop serves as an important reality check for the teams writing the various roadmap chapters and helps us enhance the quality of the final product," said Jim Arnold, director of roadmapping for NEMI and a fellow of the Motorola technical staff. "It also gives the industry a sneak peak at what will be featured in the final roadmap. This year, we are actively soliciting global participation in this review as we begin the first steps toward internationalizing the NEMI roadmap. For example, we have already secured commitments from the Components, Packaging and Manufacturing Technology Society (CPMT) of the Institute of Electrical and Electronics Engineers (IEEE/CPMT) and IMAPS Europe to participate. In addition, we have had positive interactions with Japan Electronics and Information Technology Industries Association (JEITA), and representatives from Japan will be involved in the 2004 roadmap."
Every two years, NEMI maps the future manufacturing needs of the global electronics industry to identify the key technology and infrastructure developments required to assure leadership of the supply chain over the next decade. It helps companies anticipate shifts in product requirements and provides an early warning of changes in technology or infrastructure. It also serves as the foundation of all of the consortium's activities.
The 2004 roadmap marks the tenth anniversary of this initiative. The first roadmap was created in 1994 by the National Electronics Manufacturing Framework Committee, a group of 200 individuals from industry, government and academia who came together to study the challenges facing the nation in electronics manufacturing and to develop technology roadmaps and policy options with which to address these challenges. To celebrate this milestone, NEMI is planning a banquet on the evening of June 22 at the consortium's headquarters. The event will feature speakers from industry and government and provide an opportunity for the group to meet informally prior to the workshop sessions the next day.
The workshop registration fee is $200 for non-members and $100 for members, and includes attendance at the banquet, participation in the workshop (including lunch and breaks), a CD of workshop presentations and the 2004 NEMI Roadmap CD when published.
For more information, visit: www.nemi.org/roadmapping/june_TWG.html.
Copyright 2004, UP Media Group. All rights reserved.
Cookson Group plc
(London, UK) announced that Stephen Howard intends to relinquish his
role as group chief executive after the identification and appointment
of a successor. The process of identifying a successor has commenced
and the Board hopes that an appointment will be made during 2004.
Accordingly, it is expected that Howard will leave the company on or
before Dec. 31, 2004.
Howard has been a
director of Cookson since 1992 and in his current position since 1997.
During the seven years of his tenure as group chief executive, Cookson
has been fundamentally reshaped into a highly focused group, centered
around electronics and ceramics, with the precious metals division the
subject of an ongoing strategic review, as announced on March 15, 2004.
Stephen
Howard said, "My eighteen years at Cookson have been enormously
fulfilling, but the time has simply come to do something else. The
company is now in excellent competitive shape and the long-awaited
recovery is clearly underway, making this year the appropriate time to
pass the baton on."
Bob Beeston, chairman of Cookson, said, "The
Board is very grateful for Stephen Howard's contribution to, and
leadership of, the company over many years. After three years of very
difficult trading conditions, Cookson is now firmly on the recovery
path, is in a sound financial position and is therefore very well
positioned to prosper under his successor."
An announcement concerning a successor will be made at the appropriate time.
At Nepcon Shanghai 2004, Cor Scholten, Assembléon's (Eindhoven, The
Netherlands) chief executive officer, confirmed that Asia, and in particular, China, is a key element of the company's long-term global business strategy.
In 2003, sales in Asia grew to 40% of the company's total sales, up from just over 30% in 2002, with China representing 30% of this growth. As a direct result of the company's aggressive drive to increase market share in this market, Assembléon expects China to represent 70% of total Asia sales in 2004.
"We recognized China as a growing force in the global market several years ago and moved quickly to position ourselves to serve not only the large multinational original design manufacturers (ODMs) and electronics manufacturing service (EMS) companies that were moving their operations into China, but also the large number of local Chinese enterprises that were becoming increasingly sophisticated and challenging the foreign-owned multinationals," said Scholten.
"Unlike many other vendors, Assembléon does not view China simply as a location for low-cost manufacturing," Scholten continued. "Instead, we firmly believe that China is one of the key market and technology drivers in the world. No longer is China just looking at its export markets, but domestic sales are booming and helping to drive new technology around the world. Also, many of the domestic brands, such as Bird, Eastcom, and TCL, are outselling multinational brands by swiftly incorporating new functionality as soon as it becomes available."
In addition to its distribution policy, Assembléon has continued its own direct commitment to China, and expects to more than quadruple its staff headcount by the end of 2004. The additional staff will be deployed in the new locations around the country and in a new training and demonstration center expected to open in Shanghai before the end of the year.
Assembléon's drive to increase market share and sales in 2004 is focused upon a number of industry segments: consumer electronics—including PC motherboards, mobile phones, LCD monitors and DVD/EVD players; telecommunications equipment, including PBXs and trunking systems; and the automotive electronics and GPS segments.
Copyright 2004, UP Media Group. All rights reserved.
Valor Computerized Systems (Yavne, Israel), a software solutions provider to the electronics industry, has reported an improvement in its revenue for the first quarter of 2004.
Business in the global electronics industry is picking up, which is positively impacting the company's overall business. Revenues in the first quarter increased by 16.4% to $7.15 million, up from $6.14 million in Q1 2003.
During the quarter, Valor experienced a steep increase in research and development investments, due to the purchase of 50% of Danish company TraceXpert and the development of new products. R&D expenses rose 60% from the same quarter last year to $2.66 million. The company's headcount increased to 199, a raise of 16% mainly attributed to the increase in the R&D force.
Selling and marketing expenses were the same as the previous quarter at $3.34 million, up 9.6% from the previous year. +Product sales generated $4.6 million, up 20% year-on-year.
Due to the investments in new products, the net profit for Q1 was $295,000, down from $623,000 in Q1 2003. However, positive cash flow from operating activities reached $1.25 million.
Copyright 2004, UP Media Group. All rights reserved.
March Plasma Systems (Concord, CA) recently established direct operations in Japan. The new March offices are located in the Nordson facility in Tokyo, Japan.
"With a growing customer base in Japan, our new offices in Tokyo allow us to provide our customers with local sales and service support," said Peter Bierhuis, president.
The Japan facilities will be equipped with March plasma treatment systems for customer training, demonstration and applications support. To manage Japanese operations, March appointed Terumitsu Tsuji as business manager, Japan and named Yuji Takai regional sales manager.
Other recent activities include the appointment of new distributors for the semiconductor and printed circuit board (PCB) market segments, and the formation of strategic alliances with key allied equipment partners in the Japanese market.
March Plasma Systems is a provider of gas plasma technology for semiconductor, PCB and webbed material industries.
Copyright 2004, UP Media Group. All rights reserved.
Electronics manufacturing services (EMS) provider EPIC Technologies (Rochester Hills, MI) has recently added two new surface-mount technology lines to its facility in Juarez, Mexico. The new Siemens lines bring EPIC's Mexico capacity to a total of seven lines. Steve Fraser, general manager of EPIC's Norwalk, OH, facility, said the company specifically uses Siemens machinery because of its quick changeover capability that allows for flexibility and accuracy.
Fraser said, "In addition to the new Siemens lines, we have added another EPM wave solder machine, EPM vapor phase rework station for fine pitch, flip chip and ball grid array (BGA devices) and two vapor phase inline reflow ovens in our Juarez location."
The vapor phase reflow ovens use an inert Teflon solution, which will not leave a residue on the printed circuit boards that go through it. One of the advantages of vapor phase reflow ovens is the lower operating temperatures (lead solder 200oC and lead free 230 oC). The company will now be poised to handle most lead-free alloys.
EPIC's 70,000 sq. ft. operation in Juarez opened in July 2002 with just over 100 employees. The staff grew to 260 workers last summer, with current employment in Mexico at over 600 people. In addition, the operation has implemented a 24/7 schedule since January to provide additional capacity and flexibility. The success in Juarez has led EPIC's management to conduct a preliminary analysis to expand their Mexican operations, possibly with an additional site in late 2004.
Copyright 2004, UP Media Group. All rights reserved.
