News
Indium Corp. (Utica, NY) has announced the release of a new Product Data Sheet entitled: Eutectic Gold/Tin Solder. It is available immediately as document number 97800.
Eutectic AuSn solder alloy finds use in critical applications such as high-reliability medical, aerospace and military applications; die-attach and lid sealing; or as a braze alternative. The solder's relatively high melting point and joint strength make the alloy useful for certain applications.
The document provides detailed physical properties of eutectic AuSn solder alloys and discusses applications and characteristics of the material. Performance of the solder, and the resultant solder joint, are also covered.
Indium is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
Contact Indium Corp. to obtain a copy of the product data sheet and to discuss your application.
Copyright 2004, UP Media Group. All rights reserved.
Kester (Des Plaines, IL), a supplier of interconnecting materials and related services for the electronic assembly and component assembly markets, announced that it is working with FEINFOCUS (Garbsen, Germany), a provider of high resolution X-ray microscopy and fully automated systems, to co-host two non-commercial seminars focusing on lead-free technology.
Designed to assist electronics assembly manufacturers with the reliable and cost effective implementation lead-free assembly operations, the seminar covers the main issues with lead-free soldering in surface-mount technology, wave soldering and rework operations. The seminar offers technical and practical information on how to prevent process issues usually associated with lead-free soldering. Successful case studies are also discussed showing solutions to issues normally encountered with lead-free assembly.
The seminar will provide every attendee with a Lead-Free Assembly Technical Manual containing detailed technical presentations, white papers and a subscription to the Lead-Free Connections Newsletter, mailed quarterly. The newsletter will offer process information and tech-tips to achieve solid lead-free processes. They can be used to compliment a company's training needs or knowledge base.
The first seminar is scheduled for Wednesday, Feb. 4, in Dallas, TX. The second seminar is Thursday, Feb. 5, in Austin, TX.
This series of seminars is part of the Kester University, which offers solder technology training programs coupled with consulting services to assist the electronics industry with training and process issues. For information, contact: kesteruniversity@kester.com or call Shirley Wood: (847) 699-5589.
Copyright 2004, UP Media Group. All rights reserved.
Beginning March 1, 2004, Wolf Electronix (Orem, UT), an electronics contract manufacturer (CM), will begin assembly of surface-mount and through-hole components with complete box-build capabilities—including cable harnessing and testing—in Mexicali, Mexico. The 30,000 sq. ft. facility will house the surface-mount and through-hole equipment, along with automated optical inspection (AOI) machinery.
The expansion allows Wolf to reduce labor costs up to 50% on low-mix high-run projects; thus proving an alternative for U.S. companies desiring to keep work in North America while remaining competitive. For the complete box-build, an estimated savings of up to 20% could apply.
Wolf was the first CM in the state of Utah to be awarded an ISO 9002 registration for their quality management system and currently have 9001:2000 registrations at the Utah and Colorado facilities. Wolf now is the first CM headquartered in the state of Utah to expand into Mexico.
"We desire all companies in the U.S. working with a CM to have the overseas labor rates while enjoying closer proximity and ease of communication," said Jim Trent Jr., president of Wolf. " I encourage every company to have the project quoted and compare."
Channels are already in place to facilitate the flow of product from the Mexico facility.
Copyright 2004, UP Media Group. All rights reserved.
The electronics interconnection group at National Physical Laboratory (NPL, Teddington, UK) is making progress in its current research projects.
The use of AC signals instead of DC in surface monitoring of process residues, such as flux, is yielding startling results. The new methods, dubbed surface insulation impedance (SII), show that some fluxes appear to provide variations in loss of signal in an AC environment orders of magnitude higher than predicted by traditional DC surface insulation resistance (SIR) techniques. Ongoing work continues to validate the findings, which could have important implications for AC circuit reliability. For more information, contact: alan.brewin@npl.co.uk.
Over 170,000 electronic component joints have been built with two isotropic conductive adhesive materials at NPL. These samples are now in seven different accelerated environments comprising damp heat, dry heat and thermal cycling. The next steps will involve analysis of joint conductivity, shear and drop test data to compare the reliability performance of the adhesive joints to that achievable with solder. Contact martin.wickham@ntlworld.com for further information.
Work to improve solderability wetting balance tests by including a pre-heating process for the component is showing significant rewards. The use of pre-heat with focused IR energy allows for a lower solder globule or bath temperature and better representation in the test to the reality of wave of reflow soldering conditions. The improved method is likely to reward users with a better prediction of defect rates if parts are used in production. For more information, contact: alan.brewin@npl.co.uk.
Copyright 2004, UP Media Group. All rights reserved.
UP Media Group Inc. (UPMG, Atlanta, GA) has announced the final schedule of events for the thirteenth annual PCB Design Conference West (PCB West). The West Coast conference and exhibition for PCB engineering, design and manufacture professionals will be held March 16-18 in San Jose, CA.
"This year, we've kicked things up a few notches," said UPMG president Pete Waddell. "The complete Professional Development and Technical Conference program boasts a terrific selection of more than 35 courses--over half of which are new to PCB West. Plus, attendees of the full-day tutorials and two-day Design Excellence Curriculum (DEC) courses that make up our new Professional Development Certificate Program will each receive certificates of completion following the show. I'm also pleased to announce that we've added a new low-cost conference package, the Lecture and Workshop Package, which is one of the best bargains we've ever offered at a PCB Design Conference."
The PCB West three-day Technical Conference takes place March 16-17 and includes 27 short courses. The Technical Conference is bracketed by 10 Professional Development Certificate courses: six full-day tutorials and four two-day DEC courses.
Dr. Walden C. Rhines, CEO of Mentor Graphics Corp., will give his keynote address, "Breaking the PCB Design Process," to kick-off the conference on March 16. The exhibition will begin immediately following the keynote. Three special events will also take place back-to-back on March 16: the Opening Night Reception, book signings and the Pot O'Gold Party and Giveaway at the headquarters hotel, the Fairmont San Jose.
Registration for the two-day exhibition and most special events is free.
UPMG publishes Printed Circuit Design & Manufacture and Circuits Assembly, and produces PCB Design Conference West and PCB Design Conference East in the Boston, MA, area. UPMG also hosts the PCB Design Conference Road Series of courses in cities throughout the U.S.
Copyright 2004, UP Media Group. All rights reserved.
Celestica Inc. (Toronto, Ontario, Canada), an electronics manufacturing services (EMS) provider, has announced that Eugene V. Polistuk, chairman and chief executive officer, has decided to retire, effective immediately.
Polistuk has led the company since its establishment in 1994, when Celestica was established as a standalone subsidiary of IBM. Onex Corp. acquired Celestica in 1996 and the company subsequently went public in 1998.
The Board of Directors understands and accepts Polistuk's decision to retire and appreciates the contribution he has made to Celestica's success.
"I believe the 'tech storm' is over and Celestica is very well positioned to share in the outsourcing trend that is gaining considerable momentum as end markets show positive signs of recovery," said Eugene Polistuk. "At this juncture, I feel it is time for me to pass the leadership of Celestica on to new and very capable hands so that I may re-focus my priorities on family and personal interests."
Robert L. Crandall, who has been a director of the company since 1998, has been appointed to the position of chairman of the board. The board has established a search committee to select a replacement for Polistuk. Candidates from both within and outside the company will be considered.
In the interim, Stephen W. Delaney has been appointed chief executive officer. Delaney has been with Celestica since 2001, most recently as president of Americas operations. Prior to joining Celestica, Delaney held executive and senior management roles in operations at Visteon Automotive Systems, AlliedSignal's electronic systems business, Ford's electronics division and IBM's telecommunications division.
J. Marvin MaGee will remain in his current position as president and chief operating officer, Anthony P. Puppi will continue as executive vice president and chief financial officer and R. Thomas Tropea will remain vice chair, worldwide marketing and business development.
The company also announced financial results for the fourth quarter and fiscal year ended Dec. 31, 2003. For the fourth quarter, revenue was $1,915 million, up 17% sequentially from the third quarter of this year. Net loss for the quarter was $165 million or ($0.80) per share, which includes a $106 million charge associated with the company's non-cash impairment of long-lived assets and previously announced restructuring activities. This compares to a net loss of $435 million or ($1.90) per share for the same period last year.
Adjusted net earnings was a loss of $4 million or ($0.04) per share, compared to earnings of $39 million or $0.15 per share for the same period last year. The results compare with the company's guidance for the fourth quarter, which was announced on Oct. 23, 2003, for revenue of $1.70 - $1.85 billion and adjusted net loss per share of ($0.01) to ($0.09).
For the fiscal year, revenue was $6,735 million compared to $8,272 million last year. Net loss was $266 million or ($1.22) per share up from a net loss of $445 million or ($1.98) per share in 2002. Adjusted net loss for 2003 was $7 million or ($0.11) per share compared to adjusted net earnings of $222 million or $0.87 per share last year.
Copyright 2004, UP Media Group. All rights reserved.
Karl Pfluke has been promoted to the position of market development specialist at the Indium Corp. of America (Utica, NY).
Pfluke, a degreed Manufacturing Engineering Technologist, is certified as both a Powder Metallurgy Technologist with MPIF and a Process Engineer with the Surface Mount Technology Association (SMTA, Minneapolis, MN). He is an active member of the IPC Solder Alloy Standards Development Group and has presented numerous technical papers.
Pfluke has worked at Indium for three years as a technical support engineer and has experience with the full range of interconnect materials and processes. He will remain based at the company¹s corporate headquarters in New York.
Indium Corp. is supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials. Factories are located in North America, Europe and Asia.
Copyright 2004, UP Media Group. All rights reserved.
AVX Corp. (Myrtle Beach, SC), a manufacturer of electronic passive components, has landed on Mars. The company announced their contribution to the Mars exploration rover, Spirit, and its twin rover, Opportunity, that successfully drove onto Martian soil last weekend. AVX supplied their CYR20 glass-dielectric capacitors in the mission critical rover lift actuator (RLA) and lander petal actuator (LPA) circuits. AVX has a long-standing relationship with NASA's space programs and has supplied passive components for many missions over the past 20 years.
The fused monolithic construction of the capacitors provide selectrical performance, environmental immunity, stability and retraceability, making them ideal for mission critical applications. The devices are designed to withstand extremely high and low temperatures and exposure to radiation.
The capacitors used in the rover played a vital role in the RLA and LPA electronics. The circuits enable the lander to open and adjust its petals and enable the lift mechanism to raise the rover so its wheels can be deployed to drive onto Martian terrain.
Photo courtesy of NASA/JPL-CALTECH.
Copyright 2004, UP Media Group. All rights reserved.
DEK (Flemington, NJ), a high accuracy mass imaging solutions provider, has announced representative changes in the Pacific Northwest and Southern California regions. DEK's offerings have expanded over the last two years and this growth has resulted in the need for a change in representation in a few select regions.
In the Pacific Northwest, DEK will now be represented by Systems Specialists Inc., an industry leader and representative for many major brands. The 27-year old organization prides itself on superior customer service and technical support and, in their new relationship, will represent DEK in Washington, Oregon and Idaho.
DEK has also announced a representative change in Southern California. Competitive Edge Manufacturing Equipment (CEME) will now represent DEK's complete product line in this territory. CEME will represent DEK in the Southern California counties of San Louis Obispo, Kern, San Bernadino, Santa Barbara, Ventura, Los Angeles, Orange, Riverside, San Diego, Imperial and in Baja, Mexico.
Copyright 2004, UP Media Group. All rights reserved.
Speedline Technologies Inc. (Franklin, MA) has manufactured and shipped its 100th CAMALOT XyflexPro dispensing system. The dispenser was purchased by Mektec Manufacturing Corp. of Thailand.
Mektec produces flexible printed circuit boards (PCBs) for computers, cameras, printers and mobile phones. The company will use the dispenser for flip chip underfill on flexible PCBs. With this purchase, Mektec operates 15 of the new dispensers, becoming the second largest XyflexPro installation in the world.
CAMALOT equipment provides new approaches to surface-mount and component protection. The benchtop, stand-alone and in-line systems dispense solder paste, conductive adhesives, encapsulants and flip chip underfill. The dispensing system has a calibration-free linear gantry drive system, small footprint and many easy-to-add options. The equipment handles surface-mount technology and semiconductor production applications.
Copyright 2004, UP Media Group. All rights reserved.
Siemens Dematic Electronics Assembly Systems (EAS, Norcross, GA) announced its intention to provide comprehensive surface-mount technology process training for the Americas in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at the Rochester Institute of Technology (RIT, Rochester, NY).
The training will take place at RIT's CEMA facility, which has a fully equipped surface- mount technology laboratory with screen printing, dispensing, pick-and-place, reflow, rework stations, optoelectronics workstations, wire bonding, test and inspection equipment.
The five-day hands-on course hopes to provide participants with a thorough understanding of surface-mount technology and advanced packaging principles needed for supporting and troubleshooting the surface-mount process. The course will offer extensive discussions on process parameters and process characteristics, as well as identifying and correcting defects.
Professor S. Manian Ramkumar, director of the CEMA at RIT said, "We are very pleased to offer these advanced technology courses in partnership with Siemens Dematic. We understand that these skills are imperative in today's manufacturing environment in order to improve the performance and quality of the manufacturing process."
To find out more about this course, visit www.siplace.com.
Copyright 2004, UP Media Group. All rights reserved.
Electronics manufacturing services (EMS) provider Flextronics (Singapore) has announced results for its third fiscal quarter ended Dec.31, 2003. Net sales reached a record of $4.15 billion, an increase of 18.5% over the previous quarter, and up 7.8% from Q3 2002.
Pro forma net income was $93.9 million, or $0.17 per diluted share, a sequential increase of 97.6% and a year-on-year increase of 41.9%. Including after-tax amortization expense of $8.6 million, previously announced restructuring costs of $49.5 million and litigation settlement costs of $14.4 million, net income in the third quarter was $21.4 million. Last year, the company recorded a third quarter net loss of $6.5 million.
The quarterly results reflect a number of financial milestones, including record inventory turns of 13 times, a cash conversion cycle of 14 days and selling, general and administrative expense of 2.9% of sales. In addition, pro forma cash flow from operations was $356 million, which excludes approximately $68 million of payments for restructuring and other charges.
"As we begin to realize the earnings leverage imbedded in our business, our financial results will continue to improve," said Michael E. Marks, chief executive officer of Flextronics. "The improved operating results are what we expected to begin to see as we emerge from the technology downturn. While we are pleased that our margins, overall profitability, return on invested tangible capital, and many other financial metrics have improved this quarter, we continue to be completely focused on driving additional improvements in our operating performance."
Marks concluded, "Last week's announcement regarding our discussions with Nortel Networks has the potential to be a major transformational event for Flextronics in many ways. As currently being discussed, it has the potential to be the largest program award in the history of the EMS industry, with revenues exceeding $2 billion per year for Flextronics."
The company has increased its expectations for the March 2004 quarter by 10% for sales and 20% for pro forma earnings per share, to a range of $3.4 to $3.6 billion and $0.09 to $0.11, respectively.
Copyright 2004, UP Media Group. All rights reserved.
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