News
Hardmeier Electronics, a major contract manufacturer in Switzerland, has replaced its complete surface-mount assembly line with the new Ultraflex line from ESSEMTEC. The line is capable of running larger batches in inline mode, but runs different boards simultaneously.
Hardmeier specializes in the assembly of small- to mid-size batches, so the new machines provide them with the possibility to run large series with high speed on some days, while on other days several small batches can be produced simultaneously.
The feeder concept with bar code scanning ensures placement quality and enables product changeovers while the machine is placing boards. The FLX1020-V holds up to 200 feeders and minimizes the need for feeder changes. Laser and vision centering gives customers the possibility to place nearly all available components from 0201s up to quad flat packs (QFPs), ball grid arrays (BGAs), microBGAs and connectors. The integrated software optimizes the feeder set up to eliminate unnecessary changeovers in production. The integrated dispensing system dispenses directly on the same line adhesives or solder paste for prototypes or smaller batches.
In combination with specialized loader/unloader systems, a FIFO Buffer, inspection conveyor and full convection oven for lead-free production, the installation is a fully automatic solution for low-to mid-size volumes.
Copyright 2004, UP Media Group. All rights reserved.
IPC (Northbrook, IL) has selected Speedline's (Franklin, MA) patent-pending MPM Gel-Flex conformal board support system for this year's Innovative Technology Showcase (ITS). The 2004 ITS highlighted new and emerging technologies from all segments of the electronics interconnection supply chain, including assembly, printed circuit board fabrication and design. After a rigorous evaluation, the ITS Review Board selected Speedline's board support system as one of the industry's cutting-edge technologies. The showcase was held on Feb.24-26, during APEX, in Anaheim, CA.
The board support system is a cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of electrostatic discharge (ESD)-safe polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, Gel-Flex tooling is a true conformal board-support system. The compressible gel material provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface.
Since product setup takes literally seconds to complete, and product changeovers are as simple as relocating the support bars, downtime associated with board support changes is dramatically reduced with the system. Compared to other more expensive options, such as dedicated workholder and fixed-grid pin support tooling, the system is considerably less expensive to purchase and operate.
Speedline Technologies provides single-source process knowledge, solutions and service to the PCB assembly and semiconductor packaging industries. The company sells five brands - ACCEL microelectronics cleaning, CAMALOT dispensing systems, ELECTROVERT wave soldering, reflow soldering and cleaning equipment, MPM stencil and screen printing systems, and PROTECT global services, support and training solutions.
Copyright 2004, UP Media Group. All rights reserved.
Aqueous Technologies Corp. (Rancho Cucamonga, CA) has announced the introduction of a series of evaporators: Model AQ-7, Model AQ-12 and Model AQ-12G.
The evaporators are available in either a natural gas or propane-heated configuration, or as an electric model. Typical applications include minimizing wastewater from machining operations, parts washing equipment, compressor condensate, mop water, die cast solutions and many other water-based wastestreams.
Installation of the series is simple. Model AQ-7 requires an electrical service and a 6 in. vent stack. Model AQ-12 requires an electrical connection and a 10 in. diameter vent stack. Model AQ-12G requires a 110 VAC electrical connection, a ¾ in. standard pressure gas line and a 10 in. exhaust stack. The units can be filled using three different methods: plumbing the feed source into the supplied coupling on top of the unit; removing the lid and manually fill the unit; or using the optional 70 GPM self-priming fill pump.
After an initial heat up time of approximately one hour, the units will evaporate at rates between 5-7 GPH or 12-17 GPH, depending on the model.
The evaporators will shut down automatically via a low-level control. A secondary high-temperature shutoff is also provided. When a cycle is completed, the waste material can be drained via a 2 in. drain opening, vacuumed out of the unit via the removable lid with a wet/dry vacuum or pump, or, for solid materials, scooped out. To facilitate cleanout, the interior tank of the AQ-12G is sloped toward a 2 in. outlet. Additionally, its u-shaped burner tube is located around the perimeter of the process tank, allowing access between the tubes.
Each evaporator in the series features a heavy-duty 12-gauge tank, covers and stack. Additionally, the series offers adjustable burners (NG or Propane) with electronic ignition, flame rectification system and, on the AQ-12G only, an air-pressure sensor. Automatic shutoffs, two-switch on/off operation, removable lid for fast and easy cleanout, fully insulated tanks, power exhaust for outdoor venting and polyurethane finish also come standard.
Copyright 2004, UP Media Group. All rights reserved.
National Physical Laboratory has completed a three-year project investigating the impact of thermal cycling regimes on the shear strength of lead-free solder joints.
The project undertook a comparison of accelerated test regimes for accessing the reliability of solder joints, in particular those made using lead-free solders. Samples were subjected to six different cycling regimes to investigate the effect of thermal excursions, ramp rates and temperature dwells. The most damage to joints per cycle was found to be caused by thermal cycling between 55-125°C, with a 10°C/min ramp rate and 5 minute dwells.
Similar degrees of damage in the lead-free solder joints were experienced from thermal shock regimes with ramp rates in excess of 50°C/min. However, these regimes, although faster to undertake, appeared to cause different crack propagation paths than observed with the thermal cycling regimes, although importantly still remaining within the solder.
Since this is a small difference, thermal shock testing may still be used to differentiate between, or enable ranking of, the effects of changes to materials or processes on the reliability of the solder joints. Hence, if a wide range of conditions are to be tested, a first sift can be completed using thermal shock, with the final work using more typical thermal cycling conditions. The difference between the SAC (95.5Sn3.8Ag0.7Cu) and SnAg (96.5Sn3.5Ag) solder alloy results across all types of cycles showed very little difference in rates of joint degradation.
Dr. Chris Hunt, one of the investigators, said, "One of the major findings to come out of this work is that the thermal shock cycles do produce a failure that is different to ordinary thermal cycles, but the failure is still in the solder, hence it gives us enough confidence to use it as a process to sort out reliability on a range of assemblies. It requires us to use the more usual thermal cycles which are slower ramp and dwell for final qualification, but the thermal shock is definitely a useful tool in getting through lots of different assemblies and evaluating & ranking reliability. The thermal shock cycle will typically be at least a third of the time, so you will get there more than three times quicker. So, if you are cycling, typically up to 2000 cycles, significant time can be saved—down from two months to two weeks."
For more information contact Dr. Chris Hunt: chris.hunt@npl.co.uk.
Copyright 2004, UP Media Group. All rights reserved.
Aegis Industrial Software Corp. (Horsham, PA), a provider of manufacturing productivity software, has announced that the Key Electronics (New Albany, IN) has purchased the entire scope of Aegis software to support all factory information management from new product introduction (NPI) through manufacturing execution, quality, traceability and line monitoring. The electronic manufacturing services (EMS) provider has selected Aegis software to deliver efficient management of data from the factory office to the factory floor and from end-to-end of the product lifecycle.
Tom Hardy, Key Electronics president, said, "Our decision to partner with Aegis is the result of a deliberate effort to increase efficiencies and productivity for our customers as we grow as well as maintain aggressive quality levels....and demonstrates our commitment to leading edge technology, improved processes and total commitment to be the choice for original equipment manufacturers (OEMs) in the high mix/low volume marketplace."
Jason Spera, chief executive officer of Aegis, said, "Key Electronics and Aegis are both recipients of our industry's Service Excellence Awards, sponsored by Circuits Assembly. By standardizing factory-wide on the entire Aegis system, Key Electronics has invested to even further enhance their quality and the service they provide their customers. Both companies share a common vision; a single software platform spanning NPI to MES to the real-time machine data, and out to management and customer portals delivers real business advantage."
The deployment of Aegis software at Key Electronics provides a single source for all NPI engineering operations, including bill of materials (BOM) validation and program generation cross-line, and a single-database solution for MES and factory execution analysis. Quality data collection, automated repair and product tracking is automated through interactive and visual Web interfaces throughout the factory floor. The system joins this information to real-time data streaming from machines across the entire line—not just surface-mount placement—for real process visibility and traceability.
Copyright 2004, UP Media Group. All rights reserved.
Preco Electronics (Morton, IL), a provider of electronic manufacturing services, received ITM Process Certification for Class 2, Electronics Assembly.
ITM Consulting's (Durham, NH) principal consultants, Jim Hall and Phil Zarrow, conducted a series of operations and process audits and certified that the materials, equipment, processes and personnel comprising the Preco Electronics facility have met the standards set forth by ITM and represent best practices for the assembly of Class 2 electronic products. ITM determined that the printed circuit board (PCB) assembly operation within the Preco's Morton facility is capable of producing high-quality printed circuit assemblies in accordance with IPC-A-610, Class 2, Acceptability of Printed Circuit Boards.
Jim Lanigan, director of operations and engineering at Preco, said, "The significance of attaining ITM Certification is that it allows our customers to benefit from our sophisticated degree of technology for EMS products coupled with a high commitment to quality, all while enjoying the service level a world-class Tier 3 EMS provider can offer. The team at ITM conducted the audit and noted areas requiring enhancement or improvement. Our engineering, quality and production staff made the modifications and we attained certification."
ITM president, Phil Zarrow, said, "Preco's certification should help dispel the myth that only a Tier 1 EMS provider can have a world-class facility. Preco is the first North American EMS provider to receive ITM Assembly Process Certification."
PCB Assembly and PCB Fabrication Process Certifications are patent pending services provided exclusively through ITM Consulting.
Copyright 2004, UP Media Group. All rights reserved.
Transition Automation Inc. (Billerica, MA) released a new Permalex squeegee holder and blade assembly for EKRA printers.
The new design is specially created for E1, E4, E5 and X5 models of EKRA printers. The holders are adjustable and feature Transition Automation's unique sliding paste retainers. These retainers allow one holder to accommodate many different blade lengths. The new holder design accepts Permalex bare-blade replacement stock, eliminating the need for additional holders.
Transition Automation is an international manufacturer for the electronics assembly industry, supplying two distinct product lines: tooling services and squeegee technology.
Copyright 2004, UP Media Group. All rights reserved.
Cookson Electronics (Londonderry, NH) recently celebrated the expansion of its Polyclad Laminates electronics material manufacturing facility in Elk Grove, CA. More than 75 guests, including customers, state and local officials, media and company employees attended the event. A ribbon-cutting ceremony was followed by tours of the new manufacturing area and a buffet luncheon.
The expansion of Polyclad's Elk Grove laminate and prepreg manufacturing area represents an over $20,000,000 investment initiative by Cookson Electronics in the state of California. The operation will be a major resource to the Americas and Pacific Rim-based printed wiring board fabrication industry, providing material supply, service and support. Products manufactured at the site will include Polyclad low and high Tg FR-4 products, including the recently introduced FR-370HR lead-free assembly-compatible CAF resistant materials.
The plant's design includes vacuum presses, automatic build-up lines and automatic fabrication equipment. Additionally, new lean manufacturing and advanced scheduling practices will accelerate product delivery speeds and reduce excess inventory problems for customers. The new plant is 43,200 sq. ft. and situated on 8.3 acres. The real estate enables Cookson Electronics the opportunity to expand both manufacturing capacity and personnel to meet future customer demands.
Copyright 2004, UP Media Group. All rights reserved.
Siemens Dematic Electronic Assembly Systems Inc. (EAS, Norcross, GA) sponsored the Atlanta International School's (AIS's) International House of Technology (IHOT) in the For Inspiration and Recognition of Science and Technology (FIRST) Robotics Regional Championship competition held March 19-20 at the Gwinnett Civic and Cultural Center in Duluth, GA.
FIRST is an international program designed to inspire interest in the sciences and challenge middle school and high school students to use their creativity, knowledge and leadership skills to build robots to compete with other robots. Siemens Dematic supported the team by providing a facility, tooling and funds necessary to complete their project. The competition is designed to foster students' interest in science and technology and to help them apply classroom lessons to real-world situations. The partnerships developed between schools, businesses and universities promote an exchange of resources and talent and expose students to new career choices.
The IHOT team was successful at the tournament and won the Rookie All Star Award. With this award, the team is now eligible to advance to the National Competition to be held in the Georgia Dome on April 18.
Copyright 2004, UP Media Group. All rights reserved.
CSA International (CSA, Northbrook, IL) and Underwriters Laboratories Inc. (UL, Toronto, Ontario, Canada) have adopted an expanded Memorandum of Understanding (MoU) and completed the first phase of a mutual acceptance program for electrical components, the first milestones of an agreement the two testing organizations signed Nov. 10, 2003.
That agreement, which is designed to assist manufacturers in getting their products to Canadian and U.S. markets more quickly, without redundant testing, was the result of several months of negotiation between UL and CSA, with support from the National Electrical Manufacturers Association (NEMA), Electro-Federation Canada and major electrical manufacturers.
The expanded MoU covers 50 additional component and 11 additional end-products categories as well as all of the 13 product categories covered in the original 1996 MoU, allowing manufacturers to obtain both UL and CSA certification and listing with a single product test conducted by either company.
With the completion of the first phase of the component agreement, CSA and UL now accept several component categories for use in low voltage distribution and industrial control equipment. As many as 52 additional component categories and 11 additional end-product categories are being considered under the agreement.
A complete listing of components and end-products covered by the expanded MoU and the component acceptance agreement is available at: www.csa-international.org/components and www.ul.com/components.
CSA is a provider of product testing and certification services for electrical, mechanical, plumbing, gas and a variety of other products. UL is an independent, not-for-profit product safety certification organization that has been testing products for more than 110 years.
Copyright 2004, UP Media Group. All rights reserved.
Siemens VDO Automotive has completed the acquisition of Chrysler Group's Huntsville Electronics operations, advancing Siemens VDO Automotive to a top-three spot in the global automotive electronics supplier industry.
"Today is a great day for the future of Siemens VDO Automotive and the community of Huntsville," said Siemens VDO Automotive AG Group president and chief executive officer (CEO) Wolfgang Dehen during a company event unveiling the new monument sign. "Huntsville Electronics brings us additional capacity, capability and expertise to grow our core competencies in areas such as powertrain electronics, vehicle instrumentation and driver information."
This transition of ownership enables the manufacture of electronics to remain in the Huntsville, AL, community. The company plans to make the location one of its global electronics manufacturing and engineering centers of expertise.
As a subsidiary of Siemens VDO Automotive, the Huntsville plants will have access to a range of business opportunities within the rapidly growing global $125-billion automotive electronics market.
With the completion of the acquisition, Siemens VDO Automotive has complete access to Huntsville Electronics, including two facilities comprising 1.1 million sq. ft. of space and approximately 2,000 employees. Huntsville Electronics generated approximately $1 billion in annual sales last year.
Siemens VDO Automotive is a tier-one supplier of automotive electronic/electrical systems and components with applications covering gasoline and diesel powertrain technologies, safety and chassis systems, body electronics, plus interior products including infotainment systems.
Copyright 2004, UP Media Group. All rights reserved.
During a reception at Apex 2004, Soldertec Global awarded its Lead-Free Solder Co-operation Award to global solder materials manufacturer Indium Corp. and its customer Motorola.
The award recognizes the collaboration between the two companies. Indium's vice president of technology, Ning-Cheng Lee, and Motorola's Dr. Edwin Bradley and Dr. Vahid Goudarzi have developed a lead-free assembly process and solder paste that has been used to assemble more than 8 million cellular phones world-wide. The team shared their process details with the global electronics assembly industry.
The result of this co-operation is the Pb-Free Quickstart process, offering yields and benefits which are equal or better than similar processes using lead-bearing solders Benefits include a wide process window, component-friendly profiles and no requirement for nitrogen-reflow.
Several hundred process, quality and production engineers have been trained on the successful implementation of the process.
The Soldertec Global Lead-Free award, established in 1999, has been awarded to industrial consortiums, material suppliers and lead-free users from North America, Europe and Asia.
Copyright 2004, UP Media Group. All rights reserved.
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