News
IRVINE, CA, Dec. 3, 2004 --A Santa Ana Federal Court jury unanimously awarded $3 million to Systems Division Inc., in its patent infringement lawsuit against Teknek Electronics Ltd. and Teknek LLC. The plaintiff company said the seven-member jury found that the defendants had willfully infringed Systems Division's U.S. patents '073, '358, and '393 for computer circuit-board cleaning.
A press release issue by SDI states that the final Court order decreed that Systems Division is awarded $771,555.25 in prejudgement interest against Teknek, in addition to $3,000,000 previously awarded to the plaintiff. In previous orders, the court ordered that the defendants and their agents are enjoined from importing, exporting, advertising, marketing and selling in the U.S. "any CM6, CM5 mk2, or any machine substantially identical to a CM6 or CM5 mk2 machine."
Teknek Electronics Ltd. is a limited liability partnership based in Scotland, Teknek LLC is a limited liability corporation based in Illinois. In May of 1999, according to SDI, it noted that Teknek was infringing on its patents and requested that Teknek immediately cease and desist selling those of its products that infringed SDI's patents. According to SDI, Teknek continued to manufacture and sell knock-offs of the plaintiff's patented sheet cleaning machines and paper rollers around the world.
Austin, TX, Dec. 3 -- A new study by TechSearch International projects a compound growth rate of over 28% in the flip chip and wafer level packaging market between 2004 and 2009. With a forecasted demand of 22 million 8-in. equivalent wafers (FC and WLP) in 2007, TechSearch projects a need for capacity expansion to meet the requirements.
According to the study, the drivers for flip chip continue to be performance, on-chip power distribution, pad limited designs and form factor requirements. High-performance logic suppliers such as ASIC, FPGA, DSPs, chipset, graphics and microprocessor makers are expanding their use of flip chip in package (FCIP). Applications such as watch modules and automotive electronics are included as flip chip on board (FCOB) packaging solutions. An increasing number of devices, from diodes to DRAMs, are packaged at the wafer level.
WLPs are also growing in volume for a variety of low lead count (¾100 I/O) applications-including analog devices such as power amplifiers, battery management devices, controllers, memory and integrated passives. Most of these devices are relatively small in size, and thousands can be fabricated on a single wafer. While the shift to flip chip and WLP did not materalize in high volume for DDR2 DRAM, performance requirements will necessitate a shift in interconnect methods from wire bond to bumps (flip chip or wafer-level package) for DDR3. Gold bump demand continues to be dominated by LCD driver ICs, but an increasing number of gold stud bumped devices are also shipping.
The expansion of flip chip technology continues to spark innovation and new developments. New bumping technologies continue to be introduced for the flip chip market. The assembly of bumped silicon fabricated with low-k dielectric materials resulted in a host of issues requiring changes to the materials and the assembly process.
Legislation in Europe banning lead and other materials deemed harmful to the environment by 2006 currently provides an exemption for high-lead flip chip bumps, however a number of companies are moving to adopt lead-free bump compositions. Demand for 300 mm bumping is expected to expand with increased production of devices on 300 mm wafers. Solder bumping prices continue to decline and are no longer a factor in the adoption of flip chip. However, high substrate prices continue to be a barrier to widespread migration from wirebond to flip chip attachment.
CHANDLER, AZ, Dec. 2, 2004 - Isola Group has completed a major portion of its European restructuring plan, including the relocation of full-scale production from the UK to its German and Italian operations. The Cumbernauld, UK, operation will maintain partial production capabilities to support quick turns and special products.
The company also relocated a sizeable portion of the basic research and development center to Chandler, AZ, and built a new customer service facility in Duren.
President and CEO Raymond Sharpe said Europe's operating performance continues to strengthen as a result of commitments to Lean and Six Sigma manufacturing techniques. "We have appointed both regional and individual site leaders to drive the program. During December, these European leaders will join a global Isola operations team in Japan for an intensive nine-day boot camp focused on achieving world class performance."
The group also reported that sales increased by 19% over last year for the three-month period ending Sept. 30.
Sales of high performance products grew significantly from the prior year and are expected to grow 50% annually over the next two years.
Sharpe commented, "Our cash flow from operations has improved substantially since the company was acquired by TPG and Redfern Partners in June. This has enabled us to improve our balance sheet and fund restructuring operations and strategic investments we believe will return value to our shareholders and customers."
Isola has plans to continue expanding in the rapidly growing Asia market and in high performance niche markets.
SINGAPORE, Dec. 2, 2004 - Speedline Technologies Inc. has launched a Chinese language version of their website (speedlinetech.com) as part of their expanding service to distributors, customers and manufacturers throughout Asia.
The new website provides information regarding products, services and software, along with technical processes and applications information and news. It also provides opportunities for partners and customers to conduct business online. Asia-specific customer support and contact information are highlighted.
To view the Chinese language version, visit the site and click on the Chinese flag.
Norcross, GA, Dec. 1, 2004 ¾ The Electronics Assembly Systems division of Siemens Logistics and Assembly Systems Inc. is providing a Lean Manufacturing course for the Americas. The first two-day course is scheduled for Jan. 26-27, 2005, in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at the Rochester Institute of Technology (RIT).
The course will take place at RIT's Rochester, NY, CEMA facility. The following Lean tools will be discussed: Value Stream Mapping (VSM); 5-S; Visual Controls; Standard Work; Takt; Kanban, Pull Systems and Supermarkets; Line and Cell Design; Setup Reduction, Total Productive Maintenance (TPM); Kaizen Event Training; Impact and Culture Change; and Assessment Tools.
The course is being offered as a result of the Siemens EA Consortium for the Advancement of Electronics Manufacturing Education (CAEME).
BANNOCKBURN, IL, Dec. 1, 2004- The North American book-to-bill ratio for rigid and flexible boards dipped slightly to 1.05 in October, according to IPC. It had been 1.08 in September. Shipments and bookings both dropped notably from the previous month.
The ratio is based on data collected from rigid PCB and flexible circuit producers that participate in IPC's statistical program. The ratio is calculated by dividing the value of orders booked over the past three months by the value of sales billed. A ratio over 1.0 is considered an indicator of rising demand.
Separately, the ratios were 0.94 for rigid PCBs and 1.48 for flexible circuits.
In October, combined shipments increased 15.3% year-on-year, with bookings up 2.7%.
PCB shipments are up 31.5% year-to-date, and bookings are up 31.4%.
However, shipments and bookings are both down from September, falling 15.5% and 16.8%, respectively.
Year-on-year, rigid PCB shipments are up 3.3% and bookings are down 20.0%. Shipments and bookings are both up year-to-date, increasing by 21.2% and 12.6%, but are both down sequentially, decreasing 18.7% and 16.7%, respectively.
Flexible circuit shipments are up 48.6% and bookings are up 81.5% year-on-year. Year-to-date, flexible shipments and bookings have grown 74.4% and 103.1%. Sequentially, flex shipments decreased 1.9% and bookings are down 17.2%.
Flexible circuit sales, which include some value-added services in addition to the bare flex circuits, represent about 17% of total PCB sales in IPC's survey sample.
In a press release, IPC cautioned that month-to-month comparisons should be made with caution as they may reflect cyclical effects.
Carlsbad, CA — Asymtek is holding a conformal coating and dispensing workshop on Wednesday, Dec. 8, at the Center for Board Assembly Research, Manufacturing Research Center (MARC) of the Georgia Institute of Technology in Atlanta. The hands-on workshop will feature demonstrations from Asymtek and presentations from Dow Corning, Georgia Tech, Emerson and Cuming, Henkel Technologies, Humiseal, Heraeus and Nordson.
Speakers will review the best practices for coating, jetting and other electronics assembly dispensing from both material and equipment perspectives.
For more information on the free event, visit: www.asymtek.com/news/seminars/southeast_2004 or call 1-800-ASYMTEK, ext. 8496.
Jersey City, NJ, Nov. 29, 2004 - Cookson Electronics Assembly Materials and Automated Learning Corp. (ALC) have launched a series of lead-free assembly training courses.
The courses are part of ALC's Learntech series, a modular interactive multimedia learning approach designed for process engineers, managers and senior operators involved in the implementation and management of lead-free electronic assembly processes.
Business Electronic Soldering Technologies (BEST) is a key contributor in the first product in the suite -- Lead-Free Soldering: Orientation. Click here for more information.
Future lead-free training courses will cover rework, wave soldering and SMT. Translated versions will be offered in German and Chinese.
Munich, Nov. 30 - The electronica trade show in Munich earlier this month attracted more than 3,000 exhibitors and 75,000 attendees, according to event organizer Munich Trade Fairs International. These numbers are almost equal to those released regarding the last show in 2002.
Overall feedback was positive; 85% of exhibitors and attendees surveyed assessed the market's future as "excellent to good."
Non-German attendance rose 10% from the previous show, making up 42% of total visitors. According to the organizer, 86% of attendees were identified as decision-makers for their companies.
"We spent quality time with customers in a relaxed atmosphere here at our booth," said Alden Chauvin, VP of worldwide sales for Intersil, a manufacturer of high performance analog solutions. "We've had meeting after meeting and business has been great, which is no surprise at electronica."
The next electronica will take place Nov. 14-17, 2006, at the New Munich Trade Fair Centre.
Minneapolis, MN -- The SMTA has issued a call for papers for the next SMTA International event, to be held in conjunction with AT Expo on Sept. 25-29, 2005, at the Donald Stephens Convention Center in Chicago. A 300-word abstract should be submitted online by Feb. 7.
Papers are sought in the following technology tracks: assembly; business; components; emerging technologies; PCB technology; and process control
New topics for 2005 include New Materials & Processes, Battery Interaction, Lead-free Case Studies, Doing Business in Asia and RoHS Compliance. A full list of topics can be found on the SMTA Web site.
IC Insights, a research firm, today forecast the 2004 ranking of the top 10 semiconductor suppliers, with Intel leading the way, surpassing $30 billion in semiconductor sales. However, the company is expected to register only 11% growth this year, and a 3.4% CAGR over the 1999-2004 timeframe, compared to an industry-wide 6.9% average.
Number two is Samsung, followed by Texas Instruments, Renesas and Infineon.
Driven by surging DRAM and flash memory sales, Samsung's semiconductor revenue (85% of which is memory) is forecast to grow 53% in 2004. Infineon is forecast to jump from seventh in 2003 to fifth in 2004, aided by the strength of the euro. In euros, Infineon is expected to register a 24% growth rate (35% when its sales are converted into U.S. dollars).
The rest of the top 10 include Toshiba, STM, TSMC, NEC and Freescale. Excluding TSMC, which is a pure-play foundry, Philips would come in at no. 10.
The top 10 semiconductor companies revenues are forecast to grow 24% over 2003. In contrast, the worldwide market is forecast to grow 28%. Of the top 10, including TSMC, only four are forecast to grow faster than the total market in 2004. Excluding TSMC, only three top 10 companies are expected to increase their 2004 sales faster than the overall market growth rate.
Weymouth --On Nov. 25, DEK held a Stencils Technology Day at its Weymouth, UK, office to share the findings from its recent lead-free print trials, and to provide hands-on experience with stencil technologies.
Clive Ashmore, global applied process manager, presented the lead-free trial results. The company found that having a stencil that is well designed and specified for its application has the greatest impact on process performance, whether the application is lead-free or leaded. A second important consideration is materials composition. Electroformed nickel was the top performing stencil material in tests, closely followed by laser-cut nickel.
Richard Boyle of Henkel Multicore then gave a presentation on lead-free pastes that focused on areas where the differences between leaded and unleaded may impact the industry most.
The afternoon was dedicated to workshops and discussions on the theme "Print failures: cause and effect."
Dek reported positive feedback from the 32 customers in attendance.
