News
Elcoteq Network Corp. (Espoo, Finland), an electronics manufacturing services (EMS) provider for the communications technology industry, has added three surface-mount manufacturing production lines at Elcoteq America's facility in Monterrey, Mexico. The addition is a result of increased orders to manufacture mobile phones and similar wireless communications products. The addition brings the number of lines to 10 and increases capacity by 43%. Elcoteq will be expanding its work force by 200 employees.
The majority of the new equipment will be purchased from Siemens and Panasonic in keeping with Elcoteq's strategy to equip all its manufacturing plants with similar equipment so process transfer and supply chain management are facilitated and optimized. Plants are located in Europe, Asia, Mexico and the U.S.
The Monterrey plant was established in 1999 and has a production area of 18,300 m² and approximately 1,200 employees who manufacture electronic and electro-mechanical assemblies. The facility has ISO 9002, ISO 14001, QS 9000, ISO/TS 16949 and BS7799 (Information Security Management system) certificates. They practice six sigma methodology and have eleven black belts. The facility has achieved World-Class Quality Level status based on GE Quality Assessment guidelines and was awarded the 2003 Quality Award by the government of the state of Nuevo Leon, Mexico.
Joe Foster, director of operations, Elcoteq Americas, said, "This increased capacity is consistent with our long range plans of growing Elcoteq's presence in the Americas."
Copyright 2004, UP Media Group. All rights reserved.
Sanmina-SCI Corp. (San Jose, CA), an electronics contract manufacturer, announced that seven of its medical device manufacturing facilities have been certified for ISO 13485 or 13488 as well as for Canadian Medical Devices Conformity Assessment System (CMDCAS) by TUV Rheinland of North America Inc. (Newtown, CT), a compliance engineering and independent testing services provider. The TUV quality sanctions augment earlier facility registrations for all seven facilities by the United States Food and Drug Administration (USFDA).
According to John Hendrick, executive vice president of Sanmina-SCI's Medical Systems Division, ISO 13488 certifications have been granted to facilities located in Alabama, China, Ireland, Singapore and Sweden while ISO 13485 certifications have been granted to facilities in California and Israel. The Israel facility was granted ISO 13485 certification by the Standards Institute of Israel, which plans to transition its certification to TUV Rheinland later this year.
Hendrick said, "By the end of the third quarter 2004, we expect to earn two more TUV certifications—one for an additional facility in Alabama and another for a facility in Mexico—which will expand TUV quality certifications to nine Sanmina-SCI medical facilities worldwide."
According to TUV Rheinland, the ISO 13485/13488 quality standards are specific to medical device quality systems and supplement the more generic ISO 9001 and 9002 standards that apply to many industries. The company also notes that the European Union (EU) has issued a number of directives that set forth compliance criteria for medical devices destined for the European market. These directives apply to a number of medical products, including active implantable medical and in vitro diagnostics devices. With its recent certifications, Sanmina-SCI is positioned to comply with EU directives, since a significant portion of demonstrating EU compliance depends on the prior establishment and independent assessment of quality systems.
Copyright 2004, UP Media Group. All rights reserved.
The book-to-bill ratio for April 2004 remained positive at 1.11, just slightly down from 1.12 in March, according to IPC (Northbrook, IL). The ratio is calculated by averaging the index numbers for orders booked over the past three months and dividing by the average index numbers for sales billed during the same period. A ratio greater than 1.00 suggests that current demand is ahead of supply, indicating probable near-term growth.
Shipments in April increased 41.3% from April 2003, and orders booked increased 63.6%. PCB shipments are up 34.7% year-to-date, while bookings are up 47.1%.
The April shipment index was 131.4, down 13.3% sequentially, and the booking index was also down, decreasing 15.2% to 136.3.
The index shows how current shipments and bookings relate to an index point. In this case, 1992 was chosen as a stable growth year for U.S. PCB manufacturers. A shipment index number of 117.0, for example, indicates that shipments are 17% higher than average shipments for the same time period in 1992.
According to data reported by current participants in the monthly survey, their shipments increased 30.9% in April 2004 year-on-year and their orders booked increased 49.8%, with year-to-date shipments and bookings rising 30.4% and 43%, respectively.
The information is based on data provided by PCB manufacturers that participate in IPC's monthly statistical program. These companies reportedly represent approximately 60% of the U.S. IMS industry.
Copyright 2004, UP Media Group. All rights reserved.
Sponsored by the ESD Association (Rome, NY), the 2004 EOS/ESD Symposium will package research, technology and education into one international electrostatic discharge (ESD) event Sept.19-23 at the Gaylord Texan Resort and Conference Center in Grapevine, TX.
The program is organized in three special interest tracks: ESD Test, Failure Analysis and Systems; Factory, Materials and ESD Control; and Device, Design and Technology. Attendees will be able to customize their experience along their specific areas of interest.
This year's symposium features 51 papers to be presented in 10 parallel technical sessions: MR Heads - Processing; RFIC and Novel Protection Devices; System Level and Other ESD Issues; On-Chip Protection Strategies, Physics and Modeling; Tester - Device Effects; Analysis and Modeling of ESD Design Failures; Factory and Materials; Characterization of On-Chip Protection; Novel TLP Testers; and Magnetic Recording Heads.
The technical sessions also feature the award winning paper from the 2003 RCJ EOS/ESD Symposium-Japan: ESD Protection Design Using a Mixed-Mode Simulation for Advanced Devices by H. Hayashi, S. Kuroda, K. Kato, K. Fukuda, S. Baba and Y. Fukuda of Oki Electric Industry Co., Ltd.
The week's events open with three full-day ESD tutorials. An additional 17 tutorials will be offered throughout the week, covering topics such as Air Ionization: Issues and Answers; Packaging Principles for the Program Manager; Device Technology and FA Overview; Electrostatic Calculations for the ESD Engineer; and Cleanroom Considerations for the Program Manager.
A two-day seminar, ESD Program Development and Assessment (ANSI/ESD S20.20), will take place on September 19-20.
Eight interactive workshops will cover Silicon Technology Scaling and ESD Reliability - Roadmap and Reality; Common Auditing Issues; ESD in Cleanrooms; Can TLP Go Beyond HBM and CDM?; Ionization Issues; Automated Equipment, ESD and Grounding Issues; ESD in Magnetic Recording, and HBM-TLP Testing Miscorrelation: Experiences, Explanations and Solutions.
Attendees also will have the opportunity to visit exhibit booths displaying ESD control products and services. The exhibits are open to anyone interested in EOS and ESD; symposium registration is not required to attend the exhibits.
Other events include a Welcome Reception, an Awards Breakfast, a Professional and Technical Women's Reception, the ESD Association Annual Meeting and Luncheon, Authors' Corners to discuss the technical papers with the authors and ESD training presentations.
The detailed program is available at: www.esda.org/symposia.html.
Copyright 2004, UP Media Group. All rights reserved.
Hover-Davis, Inc. (Rochester, NY) has hired Darrell R. Tullar as Marketing Manager. In this new role, Tullar will lead global technical and promotional marketing activities and strategies. His focus will be on market growth and increasing sales.
Tullar comes to the company with over 24 years of experience in the electronics industry. He has held positions in customer service, product management, marketing and sales, while at Motorola, Universal Instruments & PMJ Automec.
Copyright 2004, UP Media Group. All rights reserved.
The Surface Mount Technology Association (SMTA, Minneapolis, MN) is co-locating its annual conference, SMTA International, with the Assembly Tech Expo on September 26-30, in Rosemont, IL.
Many events are planned for industry professionals who have an interest specifically in lead-free soldering technology. To help industry professionals prepare for the 2006 deadline, this year's event will feature eight short courses, close to 40 technical papers and a Lead-Free Soldering Symposium.
The short courses will cover: Lead-Free Solder Joint Reliability; Lead-Free Conversion Project; Real Time Process Control, Including Lead-Free; Lead-Free Rework; Lead-Free Surface Finishes; Implementing Lead-Free at Your Facility; The Real Cost of Lead-Free; and Ten Steps to an Effective RoHs Compliance Process.
The technical papers will cover printing, selective soldering, moisture-sensitive devices (MSD), rework, ball grid array (BGA), flip chip, harsh environments, surface finishes, automated optical inspection (AOI), x-ray, tin whiskers, lead-free materials, processes and reliability.
Organized by Dr. Paul T. Vianco of Sandia National Labs, the symposium will provide technical information on alternative materials systems, tin whiskers, lead-free processing techniques and the growing knowledge base of lead-free solder joint reliability, as they related to lead-free technology.
Additionally, a free session entitled "Lead-Free: Where Are We Right Now?" will explore the transition from standard leaded solders in a volume-manufacturing environment with papers from Agilent, Flextronics and Indium Corp. of America. The SMTAI Opening Ceremony will focus on RoHS Compliance.
Copyright 2004, UP Media Group. All rights reserved.
The National Electronics Manufacturing Initiative's (NEMI, Herndon, VA) Tin Whisker User Group has released a draft proposal of tin whisker acceptance test requirements. As part of its efforts to help suppliers and users minimize the exposure to problems associated with tin whiskers, the group has developed the document to provide testing requirements and acceptance criteria for evaluating devices with tin finishes in high-reliability applications.
As the electronics industry moves toward lead-free assemblies, a simple manufacturing solution is to use pure tin, or alloys with high tin content, as coatings on lead-frames. However, tin is known to be susceptible to the formation of needle-like protrusions, or whiskers, and tin whiskers are a reliability concern. They can cause electrical shorts, disruption of moving parts or degraded RF/high-speed performance. Tin whiskers may grow between adjacent conductors of different potentials and cause either a transient short circuit if the whisker is burned open, or a permanent short if the whisker remains intact. At shorter lengths, whiskers may create a stub-type effect that degrades performance of high-speed/high-frequency circuits. Additionally, whiskers can potentially break loose and, as debris, cause mechanical or other electrical problems.
"System developers face two key problems," said Joe Smetana, principle engineer, advanced technology for Alcatel and chair of the NEMI Tin Whisker User Group. "First, there is no scientific consensus on whisker formation and growth fundamentals, despite five decades of research. Second, there is no standard set of tests that can accelerate whisker formation and growth and relate these tests to field conditions with any reasonable degree of certainty. These issues make it difficult for developers to safely specify tin-based lead-free finishes for components used in their products, particularly those concerned with high-reliability or design life of more than five years."
NEMI has previously published recommendations for test conditions for evaluating tin whisker growth and for mitigation practices to help prevent whisker formation. The latest publication combines practices established by the previous documents and adds information such as test lengths, failure criteria, number of parts and additional bias voltage testing. It provides guidelines for post finishing inspection and preconditioning; outlines a flowchart for acceptance requirements; provides a framework for a qualification test report; and defines requirements for process controls and periodic testing.
The Tin Whisker User Group has scheduled a meeting on June 2, in conjunction with the IEEE Electronic Components and Technology Conference (ECTC), in Las Vegas, NV. The group will review the proposed test requirements with suppliers and solicit feedback on the practicality of implementing the various recommended mitigation and testing approaches. Supplier inputs during the meeting will be considered by the User Group for possible modifications to the test requirements.
The draft of the NEMI acceptance test requirements document is available at http://www.nemi.org/projects/ese/tin_whisker_activities.html.
Copyright 2004, UP Media Group. All rights reserved.
Assembly Technology Expo will take place Sept. 28-30 in Rosemont, IL, and will feature a keynote address by actor John Ratzenberger, producer and host of the Travel Channel's John Ratzenberger's Made in America series that honors the creative and entrepreneurial spirit of American manufacturing. Ratzenberger will share insights that he has gained visiting American factories and working alongside the men and women who produce many of America's best-loved products, including Harley Davidson motorcycles, Chevy Corvettes, John Deere tractors, Craftsmen tools, Zippo lighters and Slinky toys.
"We can't imagine a more fitting way to mark ATExpo's 25th year than a tribute to the greatness and inventive spirit of American manufacturers," said Kelvin Marsden-Kish, vice president of the assembly family of events, produced by Reed Exhibitions. "Mr. Ratzenberger is clearly passionate about great American products and respects the skill and dedication of the men and women who create them. He has become a highly effective advocate of American ingenuity at work and of manufacturers who invest in the effort to maintain a competitive edge here in the U.S."
For Ratzenberger, manufacturing is much more than an abstract concept. It's a way of life and a source of pride that ties communities and generations together. The son of blue collar working parents in one of the northeast's leading industrial cities, Ratzenberger grew up with the idea that Americans were hardworking inventors and problem solvers. Before turning to an acting career, he worked as a carpenter and takes pride in pointing out the houses that he helped build to his children. Despite his celebrity status, Ratzenberger still regards himself as a garage tinkerer. He holds five patents for a packaging process that he invented.
"I've always had a high regard for people who put their hands to something useful," Ratzenberger said. "A tool and die maker is an artist on par with those who display their works in expensive art galleries. A painter can always paint over a mistake. But when you work with tolerances of 1/1000th of an inch on a spinning lathe, you can't afford to be careless."
Ratzenberger is perhaps best known for his portrayal of the know-it-all, nebbishy mailman Clifford C. 'Cliff' Clavin, Jr. in the sitcom Cheers. His movie acting credits include roles in Superman and Superman II; Star Wars V-The Empire Strikes Back; Ghandi; and all five of Pixar's animated feature films, providing the voices for Hamm in Toy Story and Toy Story 2, PT Flea in A Bug's Life, the Abominable Snowman in Monsters, Inc. and a school of moonfish in Finding Nemo.
Copyright 2004, UP Media Group. All rights reserved.
Led by its members, IPC (Northbrook, IL) pushed for a fair, open and rules-based international trading system at its recent Capitol Hill Day, an industry lobbying event.
In more than 50 appointments with lawmakers, senators and their staff, IPC's Government Relations Committee and more than 40 industry leaders lobbied Congress to enforce the U.S.' international trade agreements and more aggressively officiate U.S. trading partners' obligations under the World Trade Organization and other international trade agreements. In particular, Capitol Hill Day attendees asked Congress to keep the pressure on U.S. trading partners that manipulate their currency in order to gain a competitive and trade advantage over their U.S. counterparts.
During his keynote address, Rep. Donald Manzullo, chairman of the House Small Business Committee, emphasized that lower business costs, not protectionist trade policies, will revitalize the U.S. manufacturing sector.
Congressman Phil English (R-Pa.) concurred with Manzullo in his address, as he discussed his countervailing duty bill and other congressional efforts that help level the playing field with foreign competition.
"After a three-year absence, IPC's GR Committee decided to bring back this important program to assist our members in continuing the industry recovery," said IPC President Denny McGuirk. "IPC's lobbying efforts, though, extend beyond this one-day event and cover a vast array of policies that greatly impact today's U.S. electronics manufacturer. Presently, we are lobbying to reduce the corporate tax rate on U.S. manufacturing and production income by 3%, and, to maintain competitiveness, we are supporting the extension of the research and development tax credit and the bonus 50% depreciation. IPC staff is also working on several important environmental initiatives, including a reduction of Toxics Release Inventory (TRI) reporting burdens, a broader exclusion of all recycled materials and development of lead-free labeling and materials declaration."
After recent lobbying efforts at the state and local level, Gov. Arnold Schwarzenegger's recently signed the California's Workers' Compensation Reform Bill, which promises to save up to $7 billion a year for the state's employers. IPC also successfully opposed a bill in Maine that would have banned all brominated flame retardants, including TBBPA-the main flame retardant in printed circuit boards.
Copyright 2004, UP Media Group. All rights reserved.
Siemens Dematic Electronic Assembly Systems Inc. (Norcross, GA) has announced the appointment of Gregg Schoenrade as the new Senior Sales Engineer for the South Central U.S. He will be based out of Fort Forth, TX, and will be responsible for Texas, Arkansas and Oklahoma.
Schoenrade comes from Technical Solutions, a sales rep organization that he owned and operated for the past two years.
Jeffrey Timms, vice president of sales and marketing at Siemens Dematic, said, "We are excited to have Gregg join our team. As a seasoned sales professional, with more than 14 years experience in the surface-mount technology industry, we know customers will be pleased with his professionalism and enthusiasm."
Copyright 2004, UP Media Group. All rights reserved
Cookson Electronics Assembly Materials (Jersey City, NJ) is joining fellow Cookson Electronics companies Polyclad and Enthone in adopting the six sigma system to improve the effectiveness and efficiency of its business processes. The goal will be to enhance customer satisfaction, improve profitability and to train employees to understand and effectively employ the six sigma philosophy throughout the organization.
"Six Sigma is not another ‘TQM' program," said David Zerfoss, president of Cookson EAM. "It involves a sustainable, measurable culture shift for the companies that embrace it, and our company is doing just that. In fact, we have over 35 assembly materials employees either in or about to begin black belt training globally. Our black belt candidates have been carefully selected and, upon graduation, they will have developed the skills required to lead six sigma projects for us."
Motorola first made six sigma popular in the 1980s. Allied Signal employed it in the 1990s, and General Electric has made it arguably the most popular management philosophy in history. Polyclad and Enthone both launched their six sigma programs three years ago.
Cookson EAM develops, manufactures and sells materials used in electronic assembly processes, including: solder paste, stencils, squeegee blades, stencil and printed circuit board cleaners, bar solder, cored wire solder, wave soldering fluxes and surface-mount device adhesives.
Copyright 2004, UP Media Group. All rights reserved.
Speedline Technologies Inc. (Franklin, MA) and Aegis Industrial Software Corp. (Philadelphia, PA) announce the availability of Aegis' iMonitor remote monitoring software for use with Speedline's Camalot dispensing, MPM printing and Electrovert reflow oven equipment for the electronics manufacturing industry.
The software provides completely browser-based remote monitoring by station, machine, line, factory or the entire enterprise over a Web or network connection. The reporting and performance analysis tool offers more than 100 customizable displays reporting status, performance, quality and efficiency data for use by technicians and line operators, process development engineers and business managers.
The remote monitoring software is available for use with the Camalot XyflexPro dispensing system, MPM AP-Excel, UltraPrint 2000 and AccuFlex stencil printers and Electrovert Bravo 8 reflow soldering system. The software will be compatible with other Speedline equipment models in the near future. For data acquisition, Aegis xLink transmitters have been incorporated into the native software of the Speedline machines. This solution meets the new industry standard IPC 254x 'CAMX' XML specifications for easy data interchange with other XML-based software throughout the enterprise.
Copyright 2004, UP Media Group. All rights reserved.
Press Releases
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- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association