News
YANTAI, CHINA -- Nintendo today issued a statement reiterating its commitment to international standards for employment at its subcontractors but did not indicate any specific failures by Foxconn.
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ST. PETERSBURG, FL -- The changing of the guard is beginning at Jabil Circuit, which today named Mark Mondello chief executive officer, effective March 1, 2013.
TAIPEI – Hon Hai reported non-consolidated revenues in September of $8.02 billion, up 8.2% sequentially, slightly less than expected.
SANTA CLARA, CA – Smart TVs are moving from a novelty to mainstream, with shipments expected to grow 15% worldwide in 2012, says NPD DisplaySearch. With the shift, regional preferences and TV consumption habits are changing.
TABY, SWEDEN - Micronic Mydata today announced president and chief executive Peter Uddfors will leave the company once a replacement can be found.
ORLANDO -- Vern Solberg last night received SMTA's Founder's Award, the highest individual honor the trade group presents.
BANNOCKBURN, IL – Following economic setbacks in 2009, the world market for electronics manufacturing services continued to recover in 2011 and 2012, and is projected to grow this year 9.4% globally and 8.9% in North America, says IPC.
CRANSTON, RI – AIM announces its partnership with the Conflict-Free Tin Initiative, whose goal is to create regulated tin supply chains from the South-Kivu region of the Democratic Republic of Congo.
ATLANTA -- PRINTED CIRCUIT DESIGN & FAB is undertaking a survey of how printed circuit board designers, design engineers and other layout specialists use and think about various CAD tools.
WASHINGTON, DC -- US companies doing business in China are both more profitable than ever and more pessimistic than ever about their prospects in the world's most populous nation.
Press Releases
- MKS Instruments Releases 2024 Environmental, Social, Governance Report
- Promex Industries and QP Technologies Implement Sales/Marketing Reorganization
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI