TAIPEI – Foxconn International Holdings, the cellphone manufacturing arm of the world’s largest electronics ODM, said it would sell assets to the parent company after reporting a steep drop in annual profits.

EL SEGUNDO, CA -- Japan's earthquake and resultant impact the global electronics supply chain will be the focus of an IHS iSuppli webinar this morning.

EL SEGUNDO, CA -- Semiconductor sales fell sequentially in the fourth quarter, the first sequential drop in 18 months.

SAN JOSE -- The heads of the Institute of Electrical and Electronics Engineers and the Semiconductor Industry Association sent a detailed letter to Congress yesterday advocating for immigration reform.

MILWAUKEE – Plexus Corp. was named a 2010 Wisconsin Manufacturer of the Year.

The EMS firm was awarded the Customer Commitment Special Award.

Seven Wisconsin firms won awards, competing against 53 total nominees. Awards were selected by an independent panel of judges.

TAIPEI, TAIWAN – Foxconn International, Hon Hai’s cellphone manufacturing subsidiary, posted a full-year 2010 net loss of $218.3 million, compared with net income of $38.6 million in 2009.

Sales dropped 8% year-over-year to $6.63 billion.

The firm is selling its Taiyuan, China, unit to its parent to reduce costs.

BANNOCKBURN, IL – IPC has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

The standard provides three standardized test methodologies that enable product developers to determine the best material for their application.

IPC-9708 provides test methods to evaluate the susceptibility of printed board assembly materials and designs to cohesive dielectric failure underneath surface mount technology attach pads. The test methods, including cold ball pull, ball shear and hard pin pull, can be used to rank order and compare different printed board materials and design parameters.

The standard can be used in the process of building test coupons and running tests on these coupons.

IPC says companies using IPC-9708 will see substantial cost reductions by reducing the burden of verification and qualification.

For more information, visit www.ipc.org/9708.

SCHAUMBURG, IL – Harry Moser, founder of the national Reshoring Initiative, will deliver a seminar at the Greater Chicago Design-2-Part Show on May 4.

His free presentation, Returning Manufacturing to America, will discuss the “true” costs of offshoring manufacturing, including why it may not always be the most cost-effective solution.

The Illinois Reshoring Initiative helps level the playing field for American Manufacturers competing against offshore suppliers, and intends to bring orders and jobs back to Illinois manufacturing companies.

Admission to the Illinois Reshoring Initiative session and the Greater Chicago Design-2-Part Show is free to qualified industry professionals.

For more information, visit www.reshoringd2p.com or http://news.d2p.com.

OXFORDSHIRE, ENGLAND – Smart Group has issued a call for papers for its Area Array Assembly & Reliability Conference – Table Top Exhibition. The event takes place here Oct. 5 and 6.

The event will focus on area array design, assembly, reliability, cleaning and conformal coating.

Suggested topics include industry trends on area array packaging; design and reliability of BGA and uBGA devices; advanced printed board design and fabrication techniques; component developments and future packaging; soldering and joint reliability of Pb-free and mixed alloys; overcoming pad cratering on laminates; coating and its impact of joint reliability, and tin whiskers and benefits from coating assemblies.

Email papers to technical@smartgroup.org. Include a title, abstract, speaker’s name and company.

The deadline for submitting abstracts is May.

For more information, email info@smartgroup.org.

GARBSEN, GERMANY – LPKF today reported net profits rose 149% year-over-year to record levels.

BANNOCKBURN, IL – North American printed circuit fabricators reported February shipments were up 11.1% year-over-year, as orders decreased 4.1%.

The book-to-bill ratio in February slipped to 0.95, says IPC. A ratio of more than 1.0 suggests current demand is ahead of supply, which is a positive indicator for sales growth over the next two to three months.

February rigid printed circuit board shipments were up 11.4%, and orders fell 7.3% year-over-year. Flex circuit shipments were up 8.3%, and orders grew 36.3% compared to February 2010.

Through February, PCB shipments were up 7.8%, and orders were down 5.3%. Sequentially, circuit shipments increased 12.9%, and orders rose 7%.

Rigid shipments were up 7.7 %, and orders declined 7.5%. Sequentially, rigid shipments increased 13.2%, and orders were up 6.4%. Flex shipments increased 9.4%, and orders were up 19.7%. Sequentially, flex shipments increased 9.3%, and orders rose 12.6%. The rigid book-to-bill dipped to 0.94, while flex book-to-bill jumped to 1.10.

Rigid PCB sales have been growing faster than orders for the past six months, while the opposite is happening in the flexible circuit segment, IPC said.

Rigid circuits represent an estimated 89% of the current industry in North America. In February, 24% of the sales were to the military market. Rigid board producers reported military sales accounted for 23% of sales for the month, and flex circuit producers reported 38% military sales.

In February, 77% of total PWB shipments reported were domestically produced. Domestic production accounted for 76% of rigid and 88% of flex shipments. 

TATABANYA, HUNGARY – Electronics manufacturing services firm Sanmina-SCI’s local subsidiary is hiring 150 staff to meet rising demand, according to local reports.

The site currently employs some 1,000 employees, and is back to pre-2008 levels after halving the headcount during the recession.

Revenues will return to pre-crisis levels by the end of 2011, the firm says.