PHILADELPHIA ― ACI Technologies, a manufacturing and research corporation dedicated to the advancement of electronics processes and materials, is making available a free e-booklet titled “Failure Analysis Techniques for Electronics.”

The photo-rich booklet provides a quick reference to the most common electronics failures and the equipment and procedures used to identify these issues. It covers and explains defects such as head-on-pillow, solder paste voiding and measurement, pad cratering, and gold embrittlement.

The guide is said to assist in matching analysis tools to a particular job, offering help in determining when to use x-ray, optical inspection, scanning electron microscopy (SEM), bulk ionics and ion chromatography or surface insulation resistance (SIR). Techniques for solderability evaluation, spectroscopic analysis and thermal analysis are also presented, along with environmental stress testing such as temperature cycling, thermal shock, vibration and mechanical testing.

The booklet is available from ACI’s website. 

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