Diamondx VI1x, with power and automotive instrumentation featuring SmartMux, offers measurement quality and parallel test efficiency.

SMP bullet adapters are designed for blind mate applications with a variety of board spacing and package size requirements.

TurboBoost for eMMC 5.0 and 5.1 devices on the LumenX programming enables improvement of programming performance.

Berquist Gap Pad TGP 6000ULM and 7000ULM thermal interface materials have been formulated with resin platform to deliver ultra-low modulus capabilities and thermal conductivity of 6.0W/m-K and 7.0W/m-K, respectively.

ProtectoXP lacquering offers optional 2K encapsulation.

Camstar Electronics Suite manufacturing execution system (MES) enables printed circuit board (PCB) and box assemblers to meet traceability requirements, improve efficiency levels and control manufacturing operations through direct Internet of Things (IoT) connectivity with machines and production lines.

Aquanox A4727 is has a stable pH and predictable compatibility throughout its long bath life.

LED405Med one-component, LED-curing adhesive meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly.

Sherlock Automated Design Analysis software v. 6.1 has locked IP models and thermal mechanical BGA life predictions.

Master Bond Supreme 11HT-3A two-part, room-temperature curing epoxy is said to have reliable thermal cycling abilities and high-temperature resistance.

MK7 SMT reflow oven incorporates lower delta T, reduced nitrogen consumption and extended PM.

TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".