Smart Reflow Analyzer (SRA) is an integrated fixture and profiler designed to collect reflow oven-related data to analyze and track machine stability from run to run over time.

Flexline software is for accurate slide line/assembly documentation.

Heatwave software is a pictorial representation of an assembly that is updated in real-time as failures are reported to the manufacturing execution system.

G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.

Smart reflow process inspection (RPI) data analytics have been integrated into iTAC.MES.Suite.

Zestron Eye Mobile monitors concentration of multiple cleaning processes.

YSP10 solder paste printer has an automatic changeover system.

No. 934 is an 850°F cabinet oven used for heat treating.

TM-6520 low-temperature cure adhesive is designed for die attach and general PCB assembly applications. Is electrically insulating.

CL125 clear UV-activated ink enhances security of internal track and trace processes.

Integra 508.3 multistation selective soldering system is for high-volume applications.

S300 multiple blade depaneling saw is for singulating assembled PCBs.