LED405Med one-component, LED-curing adhesive meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly.

Sherlock Automated Design Analysis software v. 6.1 has locked IP models and thermal mechanical BGA life predictions.

Master Bond Supreme 11HT-3A two-part, room-temperature curing epoxy is said to have reliable thermal cycling abilities and high-temperature resistance.

MK7 SMT reflow oven incorporates lower delta T, reduced nitrogen consumption and extended PM.

TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".

Smart Reflow Analyzer (SRA) is an integrated fixture and profiler designed to collect reflow oven-related data to analyze and track machine stability from run to run over time.

Flexline software is for accurate slide line/assembly documentation.

Heatwave software is a pictorial representation of an assembly that is updated in real-time as failures are reported to the manufacturing execution system.

G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.

Smart reflow process inspection (RPI) data analytics have been integrated into iTAC.MES.Suite.

Zestron Eye Mobile monitors concentration of multiple cleaning processes.

YSP10 solder paste printer has an automatic changeover system.