WP616 zero-halogen, Pb-free, water-soluble solder paste is for nitrogen and air reflow applications.

ChipVORX and VarioTAP embedded board test technologies now support Intel Arria 10 SoC (system-on-chip).

Master Bond EP110F8-3 is a two-part epoxy for sealing, encapsulating, potting, and casting applications.

CA-188-1 low-temperature cure electrically conductive adhesive is for die attach and general circuit assembly applications.

S3088 SPI for solder paste inspection and S3088 ultra and S3088 ultra gold AOI now come in extended versions for long printed circuit boards, including LED boards, with lengths up to 2000mm.

MT2168 XT pick-and-place handler has two new optional features that target optimization of test floor processes: double device detection (DDD) increases binning integrity; automatic temperature calibration helps calibrate as scheduled without manual processes.

KY8030-3 3-D SPI now comes with precision integrated solder paste dispenser.

C3i entry-level focused IR rework system with software control is reportedly ideal for rework in R&D or small labs.

The max. operating temperature for TWD High-Temp Max-Cap (HTMC) series axial leaded, hermetically sealed wet tantalum capacitors is from 125°C to 175°C.

Permalex blades for Yamaha SMT printers feature two-part assembly that enables users to purchase blade element or blade and holder separately.

ACD 200.1 extraction system removes gases, vapors and odors.

Stealth-Vac Elite kit operates on 30 to 50psi filtered compressed air or nitrogen.