Solderless vertical launch connectors are reportedly ideal for high-speed networking, high-speed computing and telecommunications applications.

Component identification poster is a 24" x 30" teaching tool for soldering instructors.

U30 series digital microscopes offer x168 with +10 macro lens with 8mp. Feature fast auto focus.

Alpha PowerBond solder preforms are for high-temperature, high-reliability, lead-free interconnects for automotive and power semiconductor applications.

F13 solder wire for automatic soldering machines conforms to J-ST-004 (ROL0).

iJet table dispenser models 250 and 350 are for SMT and PCB packaging, underfill, semiconductor packaging, LED packaging, electromechanical assembly, and flat panel assembly.

TVM field of view (FOV) video measurement systems include TVM20 and TVM35, with FOV sizes of 20mm and 35mm, respectively.

This image comparison app enables comparison of PCB reference images to live or captured sample images of PCBs.

Gen7 acoustic micro-imaging tool provides greater versatility in transducer movement, faster scanning of samples, and faster processing of data.

eC-reflow-mate v. 4 reflow oven gives an even temperature across the PCB under user control throughout soldering process.

Saki Self-Programming software is for solder paste inspection and automated optical inspection equipment.

H-series replacement induction heating tips are for Hakko FX-100 series.