Seven new ergonomic handpieces complement Connection Validation (CV) soldering system.

This automated coating inspection line combines Select Coat SL-940 conformal coating system with FX-940UV series ACI/AOI automated conformal coat inspection system.

Type AuR gold ribbon bonding wire is fabricated to 4N specifications with 99.99% purity using a dry process.

PF606-PW215 water-soluble solder paste provides high-speed printability that reportedly produces great solder paste print quality, as well as a wide reflow process window for excellent solderability.

Sarcon 15GTR is a thin thermal interface composite film made from heat-conducting silicone and a 0.05mm fiberglass reinforcement layer.

Pen-Vac Kit is self-contained with eight probes plus cups and vacuum pen holder.

Scanflex II Cube JTAG/boundary scan controller has an optional Wireless LAN interface.

Master Bond EP21ND-LP two-part epoxy is for structural bonding applications involving large surface areas.

SpiCAT simulation software includes SpiMLCC and SpiTAN portals that provide electrical and performance characteristics by frequency and temperature for a range of multilayer ceramic or tantalum, polymer, and niobium oxide surface-mount capacitors.

PowerSpector BTL AOI offers synchronized inspection of top and bottom sides of PCBs after placement of SMT and through-hole components and after reflow, wave or selective soldering.

FH62 compact flexible printed circuit (FPC) connector has a single-action lock designed for automatic assembly.

System Cascon software v.4.6.8 enables embedded JTAG solutions.