Gen7 acoustic micro-imaging tool provides greater versatility in transducer movement, faster scanning of samples, and faster processing of data.

eC-reflow-mate v. 4 reflow oven gives an even temperature across the PCB under user control throughout soldering process.

Saki Self-Programming software is for solder paste inspection and automated optical inspection equipment.

H-series replacement induction heating tips are for Hakko FX-100 series.

Power Plus Tips are for applications demanding high thermal load.

HSI1x instrument for Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8 Gbps data rate.

Loctite Ablestik ABP 8068T die attach materials facilitate package-level sintering and address regulatory challenges of high-lead solders, thermal conductivity drawbacks of conventional die attach pastes, and processability shortcomings of traditional sintering products.

SP1220 screen printer is designed to accommodate mid-sized long boards up to 48" in length.

6892 series connectors feature 0.5mm-pitch flexible printed circuit (FPC) and flat flexible cable (FFC) with improved quality assurance checks.

High-frequency SMA end launch plug offers VSWR performance up to 26.5GHz.

Yxlon compact computer tomography system is now equipped with CTScan 3 line detector.

ER8 Series miniature board-to-board connector combines rugged design with high-speed transmission speeds of more than 10Gpbs to support industrial applications.