R12-SP2 v. 13 multi-CAD interoperability software enables open standards for CAD/CAM/CAE software applications.

DOWSIL EC-6601 electrically conductive adhesive is engineered for electromagnetic compatibility in electronics applications.

XRHCount is for automatic text recognition for databases and test counting of parts.

Condura has new features for direct copper bonding (DCB) substrates to extend the lifetime of power electronics modules.

Inspectis 4K digital microscopes come with come HD-125 and HD-126 single- and double-LED matrix head lighting units.

DRV Z1 (Deep Reality Viewer) digital 3-D stereoscopic display technology creates stereo high-definition 3-D images without a monitor.

Sliver card edge connectors are now SFF-TA-1002 compliant.

Microbond SMT650 solder paste offers high surface resistance.

TJC series thermal jumper chips enable designers to manage temperature rise in compact power electronic assemblies.

EO-B-013 no-clean, alcohol-based fluxing agent has been developed for power electronics.

HD-171 4-direction tilt unit makes side-viewing possible in any direction and is designed to achieve easy and repeatable 30° angling of a camera in four directions.

00-6791 series RF wire-to-board coaxial IDC connectors are for industrial and automotive applications.