HSI1x instrument for Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8 Gbps data rate.
Loctite Ablestik ABP 8068T die attach materials facilitate package-level sintering and address regulatory challenges of high-lead solders, thermal conductivity drawbacks of conventional die attach pastes, and processability shortcomings of traditional sintering products.
SP1220 screen printer is designed to accommodate mid-sized long boards up to 48" in length.
6892 series connectors feature 0.5mm-pitch flexible printed circuit (FPC) and flat flexible cable (FFC) with improved quality assurance checks.
ER8 Series miniature board-to-board connector combines rugged design with high-speed transmission speeds of more than 10Gpbs to support industrial applications.
Select-10 is now available as a flux-pen. Is a zero-halogen no-clean liquid flux designed specifically for selective soldering process.
These 0.8mm free height board-to-board connectors achieve speeds of 32Gbps and higher.
Aqube MV8 sTwin stencil cleaning system features dual-process chambers with independent operating control.